Abstract: A semiconductor memory device includes; a first impurity region and a second impurity region spaced apart in a semiconductor substrate, a bit line electrically connected to the first impurity region, a storage node contact electrically connected to the second impurity region, an air gap between the bit line and the storage node contact, a landing pad electrically connected to the storage node contact, a buried dielectric pattern on a sidewall of the landing pad and on the air gap, and a spacer capping pattern between the buried dielectric pattern and the air gap.

Abstract: A transparent light emitting device display, comprising a transparent substrate, at least two light emitting devices provided on the transparent substrate, a first common electrode wiring portion, a second common electrode wiring portion, and a signal electrode wiring portion provided on the transparent substrate, electrode pad portions provided between each of the transparent substrates and the light emitting devices, and an electrode pad connection portion electrically connecting the first common electrode wiring portion, the second common electrode wiring portion, and the signal electrode wiring portion to the electrode pad portion.

Abstract: A metal pattern film including a substrate; a first adhesion promoting layer provided on a first surface of the substrate; a second adhesion promoting layer provided on a second surface of the substrate, which is opposite to the first surface of the substrate; a metal pattern provided on a surface of the first adhesion promoting layer opposite to a surface of the first adhesion promoting layer adjoining the substrate; a first adhesive layer provided on a surface of the metal pattern opposite to the first adhesion promoting layer so as to cover the metal pattern; and a second adhesive layer provided on a surface of the second adhesion promoting layer opposite to a surface of the second adhesion promoting layer adjoining the substrate. Each of the first adhesion promoting layer and the second adhesion promoting layer includes an inorganic oxide. A method for preparing a metal pattern film.

Abstract: A method of manufacturing a transparent electrode substrate according to an exemplary embodiment includes: a) forming a structure including a transparent base, a bonding layer on a surface of the transparent base, and a metal foil on a surface of the bonding layer opposite the transparent base; b) forming a metal foil pattern by patterning the metal foil; c) heat-treating the structure resulting from b) at a temperature of 70° C. to 100° C.; and d) completely curing the bonding layer. Also, a transparent electrode substrate is disclosed.

Abstract: The present application relates to a film mask comprising: a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate; and an embossed pattern part provided on a surface of the transparent substrate, which is provided with the darkened light-shielding pattern layer, a method for manufacturing the same, a method for forming a pattern by using the same, and a pattern formed by using the same.

Abstract: A three-dimensional semiconductor memory device is disclosed. The device may include a substrate including a cell array region and a connection region provided at an end portion of the cell array region, an electrode structure extending from the cell array region to the connection region, the electrode structure including electrodes sequentially stacked on the substrate, an upper insulating layer provided on the electrode structure, a first horizontal insulating layer provided in the upper insulating layer and extending along the electrodes, and first contact plugs provided on the connection region to penetrate the upper insulating layer and the first horizontal insulating layer. The first horizontal insulating layer may include a material having a better etch-resistive property than the upper insulating layer.

Abstract: The present specification relates to an ink composition, a cured pattern prepared using an ink composition, a heating element including a cured pattern, and a method for manufacturing a heating element.

Abstract: A user terminal device is provided. The user terminal device includes a display, a first sensor provided on a front surface of the user terminal device and configured to detect a front illumination, a second sensor provided on a rear surface of the user terminal device and configured to detect a rear illumination, and a controller configured to adjust a luminance of the display based on the front illumination detected by the first sensor and the rear illumination detected by the second sensor.

Abstract: The present application relates to a film mask comprising: a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate; and groove portions provided in a region where the darkened light-shielding pattern layer is not provided, a method for manufacturing the same, a method for forming a pattern by using the same, and a pattern manufactured by using the same.

Abstract: The present application relates to a film mask including: a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate; and a release force enhancement layer provided on the darkened light-shielding pattern layer and having surface energy of 30 dynes/cm or less, a method for manufacturing the same, and a method for forming a pattern using the film mask.

Abstract: The present disclosure relates to a method for manufacturing a heating element, which includes the steps of: preparing a first bonding film; forming a conductive heating pattern on the first bonding film; and laminating a second bonding film and a transparent substrate on the first bonding film, where the second bonding film is disposed on a surface opposite to the surface provided with the conductive heating pattern of the first bonding film, and the conductive heating pattern is formed by using an adhesive film having an adhesive strength decrement of 30% or greater by an external stimulus based on adhesive strength before the external stimulus.

Abstract: A transparent light emitting element display, comprising: a transparent substrate; at least one light emitting element which is provided on the transparent substrate; and a first common electrode wiring portion, a second common electrode wiring portion, and a signal electrode wiring portion which are provided on the transparent substrate, in which all of the first common electrode wiring portion, the second common electrode wiring portion, and the signal electrode wiring portion comprise metal mesh patterns, respectively, each of the metal mesh patterns, which constitute the first common electrode wiring portion, the second common electrode wiring portion, and the signal electrode wiring portion, has a standard deviation of a line width which is 20% or less, a standard deviation of a pitch which is 10% or less, and a standard deviation of a line height which is 10% or less, and the metal mesh patterns are provided in a region having an area of 80% or more of an overall area on the transparent substrate.

Abstract: An imprinting photomask including: a transparent substrate; a light blocking pattern provided on the transparent substrate; and a dry film resist (DFR) pattern provided on the light blocking pattern.

Abstract: An electrode substrate for a transparent light emitting device display according to an embodiment of the this application comprises: a transparent substrate; (M rows×N columns) light emitting device pad portions provided on the transparent substrate as a matrix; and a first common electrode wiring portion, a second common electrode wiring portion, and a signal electrode wiring portion which are provided on the transparent substrate and connected to the light emitting device pad portions, respectively, in which each of the first common electrode wiring portion, the second common electrode wiring portion, and the signal electrode wiring portion comprises a metal mesh pattern, and line resistance of the first common electrode wiring portion or the second common electrode wiring portion connected to the light emitting device pad portions constituting one row among the light emitting device pad portions satisfies Equation 1 above.

Abstract: A semiconductor device includes a plurality of electrode structures formed on a substrate; and an upper supporter group and a lower supporter between upper ends and lower ends of the plurality of electrode structures The upper supporter group includes a plurality of supporters, and at least some of the plurality of supporters each have an upper surface and a lower surface. One of the upper surface and the lower surface has a curved profile, and the other surface has a flat profile.

Abstract: An embedded electrode substrate for a transparent light emitting device display that includes a transparent substrate; an adhesive layer provided on the transparent substrate; and a wiring electrode portion and a light emitting device mounted portion embedded in the adhesive layer, and the wiring electrode portion comprises a first metal foil pattern, and comprises a blackening layer on both an upper surface and a side surface of the first metal foil pattern, and the light emitting device mounted portion comprises a second metal foil pattern and comprises the blackening layer only on the side surface of the second metal foil pattern.

Abstract: An apparatus for power demand distribution in a fuel cell vehicle includes: a battery management system calculating an allowable battery power that a battery can supply; a power demand distribution controller configured to derive a vehicle demand power including a drive motor demand power required by the drive motor, and determine a value corresponding to a vehicle demand power minus the allowable battery power being scaled down or the drive motor demand power, as a fuel cell demand output; and a fuel cell controller configured to drive the air compressor feeding the air to the fuel cell to enable a fuel cell to generate the fuel cell demand output calculated by the power demand distribution controller.

Abstract: A semiconductor device includes a plurality of electrode structures formed on a substrate; and an upper supporter group and a lower supporter between upper ends and lower ends of the plurality of electrode structures The upper supporter group includes a plurality of supporters, and at least some of the plurality of supporters each have an upper surface and a lower surface. One of the upper surface and the lower surface has a curved profile, and the other surface has a flat profile.

Abstract: Provided are a method of manufacturing a semiconductor device using a thermally decomposable layer, a semiconductor manufacturing apparatus, and the semiconductor device. The method includes forming an etch target layer on a substrate, forming thermally decomposable patterns spaced apart from each other on the etch target layer, forming a first mask pattern covering at least sidewalls of the thermally decomposable patterns, and removing the thermally decomposable patterns by a heating method to expose a sidewall of the first mask pattern.

Abstract: An unmanned aerial vehicle comprises a housing, a plurality of first arms, a plurality of second arms, and a landing gear. The housing includes a gimbal attachment to couple a gimbal with a camera. Each of the plurality of first arms and the plurality of second arms rotatably couple with the housing at one end and has a motor coupled with a propeller on the other end. The landing gear includes a plurality of foldable legs and releasably couples with an underside of the housing. The aerial vehicle may be programmed with aerial flight path data that corresponds with a prior traced route.