Abstract: A method and apparatus for testing a magnetic memory device is provided. The method begins when a magnetic field enhancing backing plate is installed in the test fixture. The magnetic field enhancing backing plate may be installed in the wafer chuck of a wafer testing probe station. The magnetic memory device is installed in the test fixture and a magnetic field is applied to the magnetic memory device. The magnetic field may be applied in-plane or perpendicular to the magnetic memory device. The performance of the magnetic memory device may be determined based on the magnetic field applied to the device. The apparatus includes a magnetic field enhancing backing plate adapted to fit a test fixture, possibly in the wafer chuck. The magnetic field enhancing backing plate is fabricated of high permeability magnetic materials, such as low carbon steel, with a thickness based on the magnetic field used in testing.

Abstract: An apparatus includes a perpendicular magnetic anisotropy magnetic tunnel junction (pMTJ) device. The pMTJ device includes a storage layer and a reference layer. The reference layer includes a portion configured to produce a ferrimagnetic effect. The portion includes a first layer, a second layer, and a third layer. The second layer is configured to antiferromagnetically (AF) couple the first layer and the third layer during operation of the pMTJ device.

Abstract: A method of fabrication of a device includes forming a first metallization layer that is coupled to a logic device of the device. The method further includes forming a second metallization layer that is coupled to a magnetoresistive random access memory (MRAM) module of the device. The second metallization layer is independent of the first metallization layer.

Abstract: A particular apparatus includes a magnetic tunnel junction (MTJ) device and a transistor. The MTJ device and the transistor are included in a comparator that has a hysteresis property associated with multiple transition points that correspond to magnetic switching points of the MTJ device.

Abstract: Shadow-effect compensated fabrication of magnetic tunnel junction (MTJ) semiconductor elements is disclosed. Providing shadow-effect compensated fabrication of MTJ elements can provide reduced free layer sizing for enhanced MTJ operational margin. In certain aspects, to reduce size of a free layer during fabrication of an MTJ to provide enhanced write and retention symmetry, ion beam etching (IBE) fabrication process is employed to fabricate a free layer smaller than the pinned layer. To avoid asymmetrical footing being fabricated in free layer due to shadow-effect of neighboring MTJs, an ion beam directed at the MTJ is shadow-effect compensated. The angle of incidence of the ion beam directed at the MTJ is varied as the MTJ is rotated to be less steep when another MTJ is in directional line of the ion beam and the MTJ being fabricated. Thus, the free layer is etched more uniformly in the MTJ while avoiding increased etching damage.

Abstract: An apparatus includes a polarizer, a first free layer, a second free layer, and an antiferromagnetic (AF) coupling layer. The polarizer has a perpendicular magnetic anisotropy (PMA). The polarizer, the first free layer, the second free layer, and the AF coupling layer are included in a spin-torque oscillator (STO). The AF coupling layer is positioned between the first free layer and the second free layer.

Abstract: A magnetic tunnel junction (MTJ) device in a magnetoresistive random access memory (MRAM) and method of making the same are provided to achieve a high tunneling magnetoresistance (TMR), a high perpendicular magnetic anisotropy (PMA), good data retention, and a high level of thermal stability. The MTJ device includes a first free ferromagnetic layer, a synthetic antiferromagnetic (SAF) coupling layer, and a second free ferromagnetic layer, where the first and second free ferromagnetic layers have opposite magnetic moments.

Abstract: Systems and methods of integration of resistive memory elements with logic elements in advanced nodes with improved mechanical stability and reduced parasitic capacitance include a resistive memory element and a logic element formed in a common integration layer extending between a bottom cap layer and a top cap layer. At least a first intermetal dielectric (IMD) layer of high-K value is formed in the common integration layer and surrounding at least the resistive memory element, to provide high rigidity and mechanical stability. A second IMD layer of low-K value to reduce parasitic capacitance of the logic element is formed in either the common integration layer, a top layer above the top cap layer or an intermediate layer in between the top and bottom cap layers. Air gaps may be formed in one or more IMD layers to further reduce capacitance.

Abstract: A method includes applying a programming voltage to a drain of an access transistor, where a source of the access transistor is coupled to a drain region of a one-time programmable (OTP) device. The method also includes applying a first voltage to a gate of the OTP device and a second voltage to a terminal of the OTP device to bias a channel region of the OTP device, where the first voltage and the second voltage are substantially equal.

Abstract: An apparatus includes a first magnetic tunnel junction (MTJ) device of a differential MTJ pair. The apparatus further includes a second MTJ device of the differential MTJ pair. The first MTJ device includes a sense layer having a high coercivity portion.

Abstract: A semiconductor device may include a magnetoresistive random-access memory (MRAM) trench having a first conductive barrier liner and a second conductive barrier liner. The MRAM trench may land on a hard mask of a magnetic tunnel junction (MTJ) within an MTJ region of the semiconductor device. The semiconductor device may also include a logic trench having the first conductive barrier liner. The semiconductor device may further include a logic via having the first conductive barrier liner. The logic via may land on a first portion of a conductive interconnect (Mx) within a logic region of the semiconductor device.

Abstract: An apparatus includes a multiple time programmable (MTP) memory device. The MTP memory device includes a metal gate, a substrate material, and an oxide structure between the metal gate and the substrate material. The oxide structure includes a hafnium oxide layer and a silicon dioxide layer. The hafnium oxide layer is in contact with the metal gate and in contact with the silicon dioxide layer. The silicon dioxide layer is in contact with the substrate material. The MTP device includes a transistor, and a non-volatile state of the MTP memory device is based on a threshold voltage of the transistor.

Abstract: Systems and methods relate to providing a constant sensing current for reading a resistive memory element. A load voltage generator provides a load voltage based on a current mirror configured to supply a constant current that is invariant with process-voltage-temperature variations. A data voltage is generated based on the generated load voltage, by passing a sensing current mirrored from the constant current, through the resistive memory element. A reference voltage is generated, also based on the generated load voltage and by passing reference current mirrored from the constant current, through reference cells. A logical value stored in the resistive memory element is determined based on a comparison of the data voltage and the reference voltage, where the determination is free from effects of process-voltage-temperature variations.

Abstract: An integrated interposer may include a substrate and a resistive-type non-volatile memory (NVM) array(s). The integrated interposer may also include a contact layer on a first surface of the substrate. The contact layer may include interconnections configured to couple the resistive-type NVM array(s) to a die(s). The resistive-type NVM array(s) may be partially embedded within the contact layer of the integrated interposer.

Abstract: A sensing system may include a sense amplifier, a sensing circuit configured to sense a current difference, a data cell selectively coupled to the sensing circuit, a first reference cell selectively coupled to the sensing circuit, and a second reference cell selectively coupled to the sensing circuit. The resistance of the first reference cell and the second reference cell are different.

Abstract: Shared source line magnetic tunnel junction (MTJ) bit cells employing uniform MTJ connection patterns for reduced area are disclosed. In one aspect, a two (2) transistor, two (2) MTJ (2T2MTJ) bit cell includes a shared source line system having first and second source lines. A uniform MTJ connection pattern results in the first source line disposed in an upper metal layer and electrically coupled to a free layer of a first MTJ, and the second source line disposed in a lower metal layer and electrically coupled to a second access transistor. Middle segments are disposed in middle metal layers to reserve the middle metal layers for strap segments of a strap cell that may be used to electrically couple the first and second source lines. Electrically coupling the first and second source lines using the strap cell allows each MTJ to logically share a single source line.

Abstract: A magnetoresistive random-access memory (MRAM) integration compatible with shrinking device technologies includes a magnetic tunnel junction (MTJ) formed in a common interlayer metal dielectric (IMD) layer with one or more logic elements. The MTJ is connected to a bottom metal line in a bottom IMD layer and a top via connected to a top IMD layer. The MTJ substantially extends between one or more bottom cap layers configured to separate the common IMD layer and the bottom IMD layer and one or more top cap layers configured to separate the common IMD layer and the top IMD layer. The MTJ can include a top electrode to connect to the top via or be directly connected to the top via through a hard mask for smaller device technologies. The logic elements include vias, metal lines, and semiconductor devices.

Abstract: Magnetic tunnel junction (MTJ) memory bit cells that decouple source line layout from access transistor node size to facilitate reduced contact resistance are disclosed. In one example, an MTJ memory bit cell is provided that includes a source plate disposed above and in contact with a source contact for a source node of an access transistor. A source line is disposed above and in electrical contact with the source plate to electrically connect the source line to the source node. The source plate allows the source line to be provided in a higher metal level from the source and drain contacts of the access transistor such that the source line is not in physical contact with (i.e., decoupled from) the source contact. This allows pitch between the source line and drain column to be relaxed from the width of the source and drain nodes without having to increase contact resistance.

Abstract: A method for fabricating a multiple time programmable (MTP) device includes forming fins of a first conducting type on a substrate of a second conducting type. The method further includes forming a floating gate dielectric to partially surround the fins. The method also includes forming a floating gate on the floating gate dielectric. The method also includes forming a coupling film on the floating gate and forming a coupling gate on the coupling film.

Abstract: An MRAM cell may include a magnetic tunneling junction (MTJ). The MTJ includes a pin layer, a barrier layer, a free layer, and a capping layer. The MRAM cell further includes a bidirectional diode selector, directly coupled to an electrode of the MTJ, to enable access to the MTJ.