Abstract: A transmitter device includes a transmitter including a first oscillator circuitry, a signal processing circuitry, and a calibration circuitry, and a second oscillator circuitry. The first oscillator circuitry is configured to output a first oscillating signal. The signal processing circuitry is configured to mix calibration signals according to the first oscillating signal, in order to emit a first output signal. The calibration circuitry is configured to detect a power of the first output signal to generate coefficients, and generate the calibration signals according to the coefficients, an in-phase data signal, and a quadrature data signal. The second oscillator circuitry is disposed adjacent to the transmitter, and is configured to output a second oscillating signal. The calibration signals are configured to reduce a pulling generated by both of the first output signal and the second oscillating signal to the first oscillator circuitry.

Abstract: A method includes forming parallel first and second dummy materials in an alternating manner. The method further includes etching portions of the first and second dummy materials, using respective selective etches, to form a plurality of gaps. The method further includes filling a first gap of the plurality of gaps with a dielectric material. The method further includes filling a second gap of the plurality of gaps with a conductive material.

Abstract: The disclosure illustrates a composite substrate and a method for manufacturing the same, the method including: disposing a mask layer on an upper surface of a substrate; forming a plurality of mask patterns spaced apart from each other to form a plurality of intervals thereamong; filling a dummy metallic material into the intervals; removing the mask patterns to form a mesh-like dummy metallic layer; and removing the dummy metallic layer while depositing a nitride layer so as to form a mesh-like structure confined by the nitride layer and the substrate. The disclosure also illustrates a method for manufacturing a light-emitting device using the composite substrate.

Abstract: A signal compensation device is disclosed. The signal compensation device includes an operation circuit and a modulation circuit. The operation circuit is configured to generate a control signal according to a first data signal and a second data signal, in which the second data signal is generated according to the first data signal by a signal conversion circuit. The modulation circuit is configured to provide a loop gain according to the control signal to compensate an attenuation of the signal conversion circuit.

Abstract: The disclosure includes aspects of a system and/or method including a hash multi-table joining implementation method based on a grouping vector, which includes the following steps: 1) rewriting an SQL query command, and dividing a complete OLAP query command into a subtask of selecting-projecting-grouping-joining operation and an subtask of aggregating operation; 2) creating and generating grouping vector metadata corresponding to a GROUP-BY statement in an SQL command through the subtask of selecting-projecting-grouping-joining operation, and creating a vector index as an output result of the subtask of selecting-projecting-grouping-joining operation; 3) executing aggregation computation based on the vector index through the subtask of aggregating operation, and storing an aggregation computation result in a corresponding unit of a grouping vector aggregator with the same length as the grouping vector; and 4) merging the aggregation computation result in the grouping vector aggregator with the grouping vecto

Abstract: A semiconductor device includes a substrate. The semiconductor device further includes a first transistor on the substrate, wherein the first transistor includes a first source/drain electrode in the substrate. The semiconductor device further includes a second transistor on the substrate, wherein the second transistor includes a second source/drain electrode. The semiconductor device further includes an insulating layer extending into the substrate, wherein the insulating layer directly contacts the first source/drain electrode and the second source/drain electrode, a top surface of the insulating layer is above a top surface of the substrate, and a sidewall of the insulating layer above the substrate is aligned with a sidewall of the insulating layer within the substrate.

Abstract: The present disclosure provides a semiconductor structure, including: a transistor, including a gate structure and a source/drain structure; a source/drain contact, disposed over the source/drain structure; a gate contact, disposed over the gate structure; and a conductive bridge, disposed over the transistor, wherein the conductive bridge overlaps the source/drain contact from a top view perspective and electrically connecting the gate contact. The present disclosure also provides a method for forming the same.

Abstract: A smart sensor module for providing protection to vehicles having central lock system, which has only five connecting wires coupling the smart sensor module to the vehicle acting as security system with the remote controller come with the vehicle from the original manufacture, there are only two buttons of the remote controller, with which the smart sensor module can automatically perform ARM/DISARM function for the vehicle in response to the user's action respectively to Lock/Unlock the doors. The smart sensor module does not utilize any device for wireless transmission.

Abstract: The present invention provides a time series prediction method, wherein the time series prediction method includes the steps of: inputting a time series into a plurality of models to generate a plurality of predicted time series, respectively; using the plurality of models to calculate a plurality of uncertainty parameters, wherein the plurality of uncertainty parameters correspond to the plurality of predicted time series, respectively; determining a weight of each predicted time series according to the plurality of uncertainty parameters; and referring to the weight of each predicted time series to perform a weighting operation upon the plurality of predicted time series to generate a final predicted time series.

Abstract: An apparatus for generating synchronized clock signals is provided. The apparatus comprises a first circuit comprising a clock divider circuit configured to receive a first clock signal and to generate a second clock signal by frequency dividing the first clock signal. Further, the apparatus comprises a one or more second circuits comprising a respective synchronization circuit configured to receive the first clock signal. The synchronization circuit of one of the one or more second circuits is configured to receive the second clock signal from the first circuit and to resample the second clock signal based on the first clock signal in order to generate a replica of the second clock signal that is in phase with the second clock signal.

Abstract: A pixel driving system for AMOLED display device and driving method are disclosed. The pixel driving system for AMOLED display device includes a sub-pixel driving circuit and a node voltage generating module electrically connected to the sub-pixel driving circuit. Wherein the node voltage generating module is inputted with the a red-green-blue display data for processing the red-green-blue display data, obtaining an APL value of a current frame of the AMOLED display device, and according to the APL value and a preset node voltage calculation formula, the node voltage generating module generates a corresponding node voltage and outputting to the source of the driving thin-film transistor. Adjusting the gate-to-source voltage of the driving thin-film transistor by using the APL value, thereby adjusting the driving current flowing through the light-emitting diode to adjust the entire display brightness of the AMOLED display device.

Abstract: A semiconductor device includes a carrier, a first external contact, a second external contact, and a semiconductor die. The semiconductor die has a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed on the second main face, a third contact pad disposed on the second main face, and a vertical transistor. The semiconductor die is disposed with the first main face on the carrier. A clip connects the second contact pad to the second external contact. A first bond wire is connected between the third contact pad and the first external contact. The first bond wire is disposed at least partially under the clip.

Abstract: A semiconductor package includes a die pad having a die attach surface, a first laterally separated and vertically offset from the die pad, a semiconductor die mounted on the die attach surface and comprising a first terminal on an upper surface of the semiconductor die, an interconnect clip that is electrically connected to the first terminal and to the first lead, and a heat spreader mounted on top of the interconnect clip. The interconnect clip includes a first planar section that interfaces with the upper surface of the semiconductor die and extends past an outer edge side of the die pad. The heat spreader covers an area of the first planar section that is larger than an area of the semiconductor die. The heat spreader laterally extends past a first outer edge side of the die pad that faces the first lead.

Abstract: The embodiments of the present disclosure provide a portable oxygen concentrator. The portable oxygen concentrator may comprise an input configured to receive airflow, an input filter, a compressor configured to compress airflow, a first column comprising a first adsorbent bed, and a second column adjacent to the first column and comprising a second adsorbent bed. The portable oxygen concentrator may further comprise a first output configured to release oxygen to a user, and a second output configured to release waste gas. The first and second adsorbent beds may comprise a plurality of zeolites.

Abstract: A pixel driving system for AMOLED display device and driving method are disclosed. The pixel driving system for AMOLED display device includes a sub-pixel driving circuit and a node voltage generating module electrically connected to the sub-pixel driving circuit. Wherein the node voltage generating module is inputted with the a red-green-blue display data for processing the red-green-blue display data, obtaining an APL value of a current frame of the AMOLED display device, and according to the APL value and a preset node voltage calculation formula, the node voltage generating module generates a corresponding node voltage and outputting to the source of the driving thin-film transistor. Adjusting the gate-to-source voltage of the driving thin-film transistor by using the APL value, thereby adjusting the driving current flowing through the light-emitting diode to adjust the entire display brightness of the AMOLED display device.

Abstract: A semiconductor structure and manufacturing method thereof are provided. The semiconductor structure includes a metallization structure with a top surface. A conductive pad is over the top surface. An upper passivation layer is over the top surface and the conductive pad and includes a first implanted region. A polymer layer is over the upper passivation layer and the conductive pad. A conductive via penetrates through the upper passivation layer and the polymer layer, and electrically coupled to the conductive pad. A method for manufacturing a semiconductor structure is also provided.

Abstract: Disclosed is a device capable of compensating for amplitude-modulation to phase-modulation distortion. The device includes a transmitter and a controller. The transmitter includes an amplifier circuit, a phase-shift adjustment circuit, and an output circuit. The amplifier circuit is configured to output an amplified signal according to an input signal. The phase-shift adjustment circuit, set between the amplifier circuit and the output circuit, includes at least one of an adjustable capacitor and an adjustable inductor and is configured to adjust the phase shift of the amplified signal according to a control signal. The output circuit is configured to output an output signal according to the amplified signal. The controller is configured to generate the control signal according to the input signal, in which the control signal varies with the input signal.

Abstract: A lithography method is provided in accordance with some embodiments. The lithography method includes forming a patterned photoresist on a material layer, applying a first bonding material to a side surface of the patterned photoresist, performing a treatment on the first bonding material to bond the first bonding material to the side surface of the patterned photoresist, wherein the treatment creates a bonding site on the first bonding material configured to bond to a second bonding material, applying the second bonding material to a side surface of the first bonding material, and patterning the material layer by selectively processing a portion of the material layer exposed by the patterned photoresist, the first bonding material, and the second bonding material.

Abstract: A method for forming a semiconductor device includes providing a substrate, forming an oxide layer over the substrate, forming a plurality of first gate oxide layers by etching the oxide layer, forming a second gate oxide layer between adjacent first gate oxide layers, forming a silicon layer over the plurality of first gate oxide layers and the second gate oxide layer, and etching the plurality of first gate oxide layers, the silicon layer, and the second gate oxide layer to expose the substrate, thereby forming a plurality of gate structures. The first gate oxide layer of the plurality of first gate oxide layers has sloped sidewalls. A thickness of the second gate oxide layer is less than a thickness of the first gate oxide layer. Each gate structure includes an etched first oxide layer, a portion of the second gate oxide layer, and a portion of the silicon layer.

Abstract: Disclosed herein are compositions and methods for the treatment of conditions induced by chronic inflammation. According to some embodiments, the compositions and methods involve the use of metformin and sodium butyrate in the treatment of conditions induced by chronic inflammation.