Patents by Inventor Shang-Chih Hsieh

Shang-Chih Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250093593
    Abstract: Optical devices and methods of manufacture are presented in which a mirror structure is utilized to transmit and receive optical signals to and from an optical device. In embodiments the mirror structure receives optical signals from outside of an optical device and directs the optical signals through at least one mirror to an optical component of the optical device.
    Type: Application
    Filed: January 3, 2024
    Publication date: March 20, 2025
    Inventors: Wen-Chih Lin, Cheng-Yu Kuo, Yen-Hung Chen, Hsuan-Ting Kuo, Chia-Shen Cheng, Chao-Wei Li, Ching-Hua Hsieh, Wen-Chih Chiou, Ming-Fa Chen, Shang-Yun Hou
  • Publication number: 20250061260
    Abstract: An integrated circuit includes a plurality of routing lines extending along a first direction, the plurality of routing lines being separated in the first direction by integral multiples of a nominal minimum pitch. The integrated circuit includes a plurality of standard cells, at least one of the plurality of standard cells having a first boundary coinciding with a routing line of the plurality of routing lines, and a second boundary offset from each of the plurality of routing lines.
    Type: Application
    Filed: November 5, 2024
    Publication date: February 20, 2025
    Inventors: Shang-Chih HSIEH, Chun-Fu CHEN, Ting-Wei CHIANG, Hui-Zhong ZHUANG, Hsiang-Jen TSENG
  • Publication number: 20250020692
    Abstract: An adhered multilayer die unit includes at least one probe zone and at least one non-probe zone for probes to be inserted in the probe zone. The adhered multilayer die unit includes dies and at least one adhesive layer. Each die includes at least one connecting surface, and through holes in the at least one probe zone for the probes to be inserted through the through holes of each die. The at least one adhesive layer adheres the connecting surfaces of the dies to each other. The at least one adhesive layer is entirely in the at least one non-probe zone. Accordingly, the adhered multilayer die unit of the invention has great structural strength in large-area condition, avoids drilling process difficulty problem and size restriction of fastening combining manner, avoids adhesive spillage and its affection on probes, and avoids adhesive-caused problems of adhesive spillage and die levelness deviation.
    Type: Application
    Filed: April 15, 2024
    Publication date: January 16, 2025
    Applicant: MPI CORPORATION
    Inventors: SHENG-YU LIN, SHANG-JUNG HSIEH, CHE-WEI LIN, HSUEH-CHIH WU
  • Patent number: 12190034
    Abstract: A logic circuit (for providing a multibit flip-flop (MBFF) function) includes: a first inverter to receive a clock signal and generate a corresponding clock_bar signal; a second inverter to receive the clock_bar signal and generate a corresponding clock_bar_bar signal; a third inverter to receive a control signal and generate a corresponding control_bar signal; and a series-chain of 1-bit transfer flip-flop (TXFF) circuits, each including: a NAND circuit to receive data signals; and a 1-bit transmit gate flip-flop (TGFF) circuit to output signals Q and q, and receive an output of the NAND circuit, the signal q from the TGFF circuit of a preceding TXFF circuit in the series-chain, the clock_bar and clock_bar_bar signals, and the control and control_bar signals; and the first transfer TXFF circuit in the series-chain being configured to receive a start signal in place of the signal q from an otherwise preceding TGFF circuit.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: January 7, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chi-Lin Liu, Jerry Chang-Jui Kao, Wei-Hsiang Ma, Lee-Chung Lu, Fong-Yuan Chang, Sheng-Hsiung Chen, Shang-Chih Hsieh
  • Publication number: 20250004780
    Abstract: Disclosed herein are embodiments related to a power efficient multi-bit storage system. In one configuration, the multi-bit storage system includes a first storage circuit, a second storage circuit, a prediction circuit, and a clock gating circuit. In one aspect, the first storage circuit updates a first output bit according to a first input bit, in response to a trigger signal, and the second storage circuit updates a second output bit according to a second input bit, in response to the trigger signal. In one aspect, the prediction circuit generates a trigger enable signal indicating whether at least one of the first output bit or the second output bit is predicted to change a state. In one aspect, the clock gating circuit generates the trigger signal based on the trigger enable signal.
    Type: Application
    Filed: September 16, 2024
    Publication date: January 2, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Kai-Chi Huang, Chi-Lin Liu, Wei-Hsiang Ma, Shang-Chih Hsieh
  • Publication number: 20240411976
    Abstract: A multiplexer circuit includes first and second fins each extending in an X-axis direction. First, second, third and fourth gates extend in a Y-axis direction perpendicular to the X-axis direction and contact the first and second fins. The first, second, third and fourth gates are configured to receive first, second, third and fourth data signals, respectively. Fifth, sixth, seventh and eighth gates extend in the Y-axis direction and contact the first and second fins, the fifth, sixth, seventh and eighth gates, and are configured to receive the first, second, third and fourth select signals, respectively. An input logic circuit is configured to provide an output at an intermediate node. A ninth gate extends in the Y-axis direction and contacts the first and second fins. An output logic circuit is configured to provide a selected one of the first, second, third and fourth data signals at an output terminal.
    Type: Application
    Filed: July 30, 2024
    Publication date: December 12, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Lin Liu, Shang-Chih Hsieh, Jian-Sing Li, Wei-Hsiang Ma, Yi-Hsun Chen, Cheok-Kei Lei
  • Patent number: 12153868
    Abstract: An integrated circuit includes a plurality of metal lines extending along a first direction, the plurality of metal lines being separated, in a second direction perpendicular to the first direction, by integral multiples of a nominal minimum pitch. The integrated circuit further includes a plurality of standard cells, at least one of the plurality of standard cells having a cell height along the second direction being a non-integral multiple of the nominal minimum pitch.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: November 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shang-Chih Hsieh, Chun-Fu Chen, Ting-Wei Chiang, Hui-Zhong Zhuang, Hsiang-Jen Tseng
  • Patent number: 12147750
    Abstract: A multiplexer circuit includes first and second fins each extending in an X-axis direction. First, second, third and fourth gates extend in a Y-axis direction perpendicular to the X-axis direction and contact the first and second fins. The first, second, third and fourth gates are configured to receive first, second, third and fourth data signals, respectively. Fifth, sixth, seventh and eighth gates extend in the Y-axis direction and contact the first and second fins, the fifth, sixth, seventh and eighth gates, and are configured to receive the first, second, third and fourth select signals, respectively. An input logic circuit is configured to provide an output at an intermediate node. A ninth gate extends in the Y-axis direction and contacts the first and second fins. An output logic circuit is configured to provide a selected one of the first, second, third and fourth data signals at an output terminal.
    Type: Grant
    Filed: June 30, 2023
    Date of Patent: November 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chi-Lin Liu, Shang-Chih Hsieh, Jian-Sing Li, Wei-Hsiang Ma, Yi-Hsun Chen, Cheok-Kei Lei
  • Publication number: 20240380392
    Abstract: The present disclosure provides a semiconductor device which includes a multiplexer, a master latch, and a slave latch. The multiplexer outputs an inverse of an input data signal or an inverse scan input signal according to a scan enable signal. The master latch is coupled to an output terminal of the multiplexer, and is configured to latch the inverse of the input data signal based on an input clock signal in response to the scan enable signal being in a low-logic state. The slave latch is coupled to the output terminal of the multiplexer through a first clocked CMOS inverter, and is configured to receive the input data signal and to output a latched slave latch data based on the input clock signal. A leakage-free dummy cell is disposed in a non-critical path of the master latch and the slave latch.
    Type: Application
    Filed: July 4, 2024
    Publication date: November 14, 2024
    Inventors: YU-JHENG OU-YANG, CHI-LIN LIU, SHANG-CHIH HSIEH, WEI-HSIANG MA, KAI-CHI HUANG
  • Patent number: 12141584
    Abstract: Disclosed herein are embodiments related to a power efficient multi-bit storage system. In one configuration, the multi-bit storage system includes a first storage circuit, a second storage circuit, a prediction circuit, and a clock gating circuit. In one aspect, the first storage circuit updates a first output bit according to a first input bit, in response to a trigger signal, and the second storage circuit updates a second output bit according to a second input bit, in response to the trigger signal. In one aspect, the prediction circuit generates a trigger enable signal indicating whether at least one of the first output bit or the second output bit is predicted to change a state. In one aspect, the clock gating circuit generates the trigger signal based on the trigger enable signal.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: November 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Kai-Chi Huang, Chi-Lin Liu, Wei-Hsiang Ma, Shang-Chih Hsieh
  • Publication number: 20240372550
    Abstract: A circuit includes a level shifter circuit, an output circuit, and a first feedback circuit. The level shifter circuit is coupled to a first voltage supply, and configured to receive an enable signal, a first input signal or a second input signal, and to generate a first and second signal responsive to the enable signal or the first input signal. The output circuit coupled to the level shifter circuit and the first voltage supply, and configured to generate an output signal or a first feedback signal responsive to the first signal, and configured to latch a previous state of the output signal in response to the enable signal or an inverted enable signal. The first feedback circuit is coupled to the level shifter circuit, the output circuit and the first voltage supply, and configured to receive at least the enable signal, the inverted enable signal or the first feedback signal.
    Type: Application
    Filed: July 17, 2024
    Publication date: November 7, 2024
    Inventors: Yu-Lun OU, Ji-Yung LIN, Yung-Chen CHIEN, Ruei-Wun SUN, Wei-Hsiang MA, Jerry Chang Jui KAO, Shang-Chih HSIEH, Lee-Chung LU
  • Publication number: 20240296273
    Abstract: An integrated circuit includes a first power rail extending in a first direction, and configured to supply a first supply voltage, and a first region next to the first power rail. The first region includes a first conductive structure extending in the first direction, a first set of conductive structures extending in a second direction, and a first set of vias between the first set of conductive structures and the first conductive structure. The first set of conductive structures overlaps the first conductive structure and the first power rail, and is located on a second level. Each conductive structure of the first set of conductive structures is separated from each other in the first direction. Each via of the first set of vias is located where the first set of conductive structures overlaps the first conductive structure and couples the first set of conductive structures to the first conductive structure.
    Type: Application
    Filed: May 14, 2024
    Publication date: September 5, 2024
    Inventors: Jung-Chan YANG, Ting-Wei CHIANG, Jerry Chang-Jui KAO, Hui-Zhong ZHUANG, Lee-Chung LU, Li-Chun TIEN, Meng-Hung SHEN, Shang-Chih HSIEH, Chi-Yu LU
  • Patent number: 12081215
    Abstract: A circuit includes an input circuit, a level shifter circuit, an output circuit, and a first and a second feedback circuit. The input circuit is coupled to a first voltage supply, and configured to receive a first input signal, and to generate at least a second input signal. The level shifter circuit is coupled to a second voltage supply, and configured to generate at least a first and second signal responsive to at least the enable signal or the first input signal. The output circuit is coupled to at least the level shifter circuit and the second voltage supply, and configured to generate at least an output signal, a first and second feedback signal responsive to the first signal. The first and second feedback circuit are configured to receive the enable signal, and the inverted enable signal, and the corresponding first and second feedback signal.
    Type: Grant
    Filed: June 12, 2023
    Date of Patent: September 3, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Lun Ou, Ji-Yung Lin, Yung-Chen Chien, Ruei-Wun Sun, Wei-Hsiang Ma, Jerry Chang Jui Kao, Shang-Chih Hsieh, Lee-Chung Lu
  • Patent number: 12074603
    Abstract: The present disclosure provides a semiconductor device which includes a multiplexer, a master latch, and a slave latch. The multiplexer outputs an inverse of an input data signal or an inverse scan input signal according to a scan enable signal. The master latch is coupled to an output terminal of the multiplexer, and is configured to latch the inverse of the input data signal based on an input clock signal in response to the scan enable signal being in a low-logic state. The slave latch is coupled to the output terminal of the multiplexer through a first clocked CMOS inverter, and is configured to receive the input data signal and to output a latched slave latch data based on the input clock signal. A leakage-free dummy cell is disposed in a non-critical path of the master latch and the slave latch.
    Type: Grant
    Filed: May 8, 2023
    Date of Patent: August 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yu-Jheng Ou-Yang, Chi-Lin Liu, Shang-Chih Hsieh, Wei-Hsiang Ma, Kai-Chi Huang
  • Publication number: 20240275384
    Abstract: An integrated circuit includes a flip-flop circuit and a gating circuit. The flip-flop circuit is arranged to receive an input data for generating a master signal during a writing mode according to a first clock signal and a second clock signal, and to output an output data according to the first clock signal and the second clock signal during a storing mode. The gating circuit is arranged for generating the first clock signal and the second clock signal according to the master signal and an input clock signal. When the input clock signal is at a signal level, the first clock signal and the second clock signal are at different logic levels. When the input clock signal is at another signal level, the first clock signal and the second clock signal are at a same logic level determined according to a signal level of the master signal.
    Type: Application
    Filed: April 24, 2024
    Publication date: August 15, 2024
    Inventors: GREG GRUBER, CHI-LIN LIU, MING-CHANG KUO, LEE-CHUNG LU, SHANG-CHIH HSIEH
  • Publication number: 20240267036
    Abstract: An integrated circuit includes a first time delay circuit, a second time delay circuit, and a master-slave flip-flop having a gated input circuit and a transmission gate. The transmission gate is configured to receive the first clock signal and the second clock signal to control a transmission state of the transmission gate. The gated input circuit is configured to have an input transmission state controlled by the third clock signal at the second output of the second time delay circuit. The second time delay circuit further includes a second gate-conductor and a second gate via-connector in direct contact with the second gate-conductor.
    Type: Application
    Filed: March 25, 2024
    Publication date: August 8, 2024
    Inventors: Huaixin XIAN, Qingchao MENG, Yang ZHOU, Shang-Chih HSIEH
  • Patent number: 12015409
    Abstract: In some embodiments, a flip-flop is disposed as an integrated circuit layout on a flip-flop region of a semiconductor substrate. The flip-flop includes a first clock inverter circuit that resides within the flip-flop region, and a second clock inverter circuit residing within the flip-flop region. The first clock inverter circuit and the second clock inverter circuit are disposed on a first line. Master switch circuitry is made up of a first plurality of devices which are circumscribed by a master switch perimeter that resides within the flip-flop region of the integrated circuit layout. The master switch circuitry and the first clock inverter circuit are disposed on a second line perpendicular to the first line. Slave switch circuitry is operably coupled to an output of the master switch circuitry. The slave switch circuitry is made up of a third plurality of devices that are circumscribed by a slave switch perimeter.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: June 18, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Lin Liu, Ting-Wei Chiang, Jerry Chang-Jui Kao, Hui-Zhong Zhuang, Lee-Chung Lu, Shang-Chih Hsieh, Che Min Huang
  • Patent number: 11996842
    Abstract: An integrated circuit includes a flip-flop circuit and a gating circuit. The flip-flop circuit is arranged to receive an input data for generating a master signal during a writing mode according to a first clock signal and a second clock signal, and to output an output data according to the first clock signal and the second clock signal during a storing mode. The gating circuit is arranged for generating the first clock signal and the second clock signal according to the master signal and an input clock signal. When the input clock signal is at a signal level, the first clock signal and the second clock signal are at different logic levels. When the input clock signal is at another signal level, the first clock signal and the second clock signal are at a same logic level determined according to a signal level of the master signal.
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: May 28, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Greg Gruber, Chi-Lin Liu, Ming-Chang Kuo, Lee-Chung Lu, Shang-Chih Hsieh
  • Patent number: 11983479
    Abstract: A method of fabricating an integrated circuit includes placing a first set of conductive feature patterns on a first level, placing a second set of conductive feature patterns on a second level, placing a first set of via patterns between the second set of conductive feature patterns and the first set of conductive feature patterns, placing a third set of conductive feature patterns on a third level different from the first level and the second level, placing a second set of via patterns between the third set of conductive feature patterns and the second set of conductive feature patterns, and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jung-Chan Yang, Ting-Wei Chiang, Jerry Chang-Jui Kao, Hui-Zhong Zhuang, Lee-Chung Lu, Li-Chun Tien, Meng-Hung Shen, Shang-Chih Hsieh, Chi-Yu Lu
  • Publication number: 20240128955
    Abstract: An integrated circuit includes a semiconductor substrate and a plurality of circuit elements in or on the substrate. The circuit elements are defined by standard layout cells selected from a cell library. The circuit elements including a plurality of flip-flops. Each flip-flop has a data input terminal, a data output terminal, a clock input terminal, and a clock output terminal. A first one of the flip-flops directly abuts a second flip-flop such that the clock output terminal of the first flip-flop electrically connects with the clock input terminal of the second flip-flop.
    Type: Application
    Filed: April 24, 2023
    Publication date: April 18, 2024
    Inventors: Shao-Yu Steve Wang, Chien-Te Wu, Shang-Chih Hsieh, Nick Tsai