Abstract: An image synthesis method of a virtual object and the apparatus thereof are provided. The image synthesis method of the virtual object comprises providing a first depth image of a scene and a first two-dimensional image of the scene; providing a second depth image of the virtual object; adjusting a second depth value of the virtual object in the first depth image according to an objective location in the first depth image and a reference point of the second depth image; rendering a second two-dimensional image of the virtual object; and synthesizing the first two-dimensional image and the second two-dimensional image according to a lighting direction of the first two-dimensional image, an adjusted second depth value and the objective location in the first depth image.

Abstract: A method and structure for providing high-quality transferred graphene layers for subsequent device fabrication includes transferring graphene onto a hydrophobic surface of a hydrophobic layer and performing a thermal treatment process. In various embodiments, a substrate including an insulating layer is provided, and a hydrophobic layer is formed over the insulating layer. In some examples, a graphene layer is transferred onto the hydrophobic layer. By way of example, the transferred graphene layer has a first carrier mobility. In some embodiments, after transferring the graphene layer, an annealing process is performed, and the annealed graphene layer has a second carrier mobility greater than the first carrier mobility.

Abstract: The present invention provides a heavy metal detecting device and the fabricating method thereof. The heavy metal detecting device includes a substrate and a nano-metal-particle array. The fabricating method of the heavy metal detecting device includes following steps of: (S1) preparing a substrate, cleaning the substrate with a first liquid, and drying the substrate with a first gas; (S2) soaking the substrate in a first solution; (S3) after soaking the substrate for a first period of time, cleaning and drying the substrate with the first liquid and the first gas respectively; (S4) soaking the substrate in a pre-synthesized nano-metal-particle solution; and (S5) after soaking the substrate for a second period of time, cleaning and drying the substrate with a second liquid and the first gas respectively. Compared to the prior arts, the heavy metal detecting device of the present invention has the advantages of simplicity and rapidity.

Abstract: The present invention provides a packaging structure of ultraviolet light-emitting diodes, comprising: a substrate having an electrode; an UV LED chip disposed on the substrate and electrically connected to the electrode; a transparent cap covering the substrate and the chip; an adhesive layer disposed between the substrate and the transparent cap; and a light reflective layer disposed between the adhesion layer and the transparent cap, wherein the transparent cap is fixed onto the substrate via the light reflective layer and the adhesion layer. And the light reflective layer of the case is made by metal, the adhesive layer is optional.

Abstract: The invention provides a packaging method for ultraviolet light emitting diode, comprising: (S1) providing a carrier, connected to an electrode; (S2) fixing an UV LED chip on the carrier and electrically connecting the UV LED chip to the electrodes; (S3) covering the UV LED chip with transparent silicon-and-oxygen-containing solution; and (S4) performing a thermal curing process.

Abstract: The present invention provides a heavy metal detecting device and the fabricating method thereof. The heavy metal detecting device comprises a substrate and a nano-metal-particle array. The fabricating method of the heavy metal detecting device comprises following steps of: (S1) preparing a substrate, cleaning the substrate with a first liquid, and drying the substrate with a first gas; (S2) soaking the substrate in a first solution; (S3) after soaking the substrate for a first period of time, cleaning and drying the substrate with the first liquid and the first gas respectively; (S4) soaking the substrate in a pre-synthesized nano-metal-particle solution; and (S5) after soaking the substrate for a second period of time, cleaning and drying the substrate with a second liquid and the first gas respectively. Compared to the prior arts, the heavy metal detecting device of the present invention has the advantages of simplicity and rapidity.

Abstract: A clustered energy-storing micro-grid system includes a renewable energy device, a clustered energy-storing device, an electrical power conversion device and a local controller. Before coordinating and allocating power to a plurality of loads, the clustered energy-storing device stores and releases the power in a centralized manner. This, coupled with the control exercised by the local controller over the electrical power conversion device, controls the micro-grid system in its entirety so that the micro-grid system operates in cost-efficient optimal conditions, under a predetermined system operation strategy, and in a system operation mode.

Abstract: An image processing apparatus is disclosed. The splitter duplicates an original image signal into a first image signal and a second image signal. The first signal converter converts the second image signal having a first image format to the second image signal having a second image format. The image processor stores the second image signal in the memory according to an enable signal and continuously compares whether the current frame of the second image signal is the same as the previous frame of the second image signal. If they are different, the image processor continuously receives the second image signal and stores it in the memory. If they are the same, the image processor stops receiving the second image signal. The second converter converts the second image signal having the second image format to the second image signal having the first image format.

Abstract: A simulation test system of a cluster-based microgrid integrated with energy storages is characterized in that an operation simulation test of a physical microgrid system is conducted with a computer as well as a power generation data and a power consumption data which are imported. Hence, the user can verify the feasibility of applying various design concepts and ideas, such as controller parameter design and system energy management strategies, to a physical microgrid system, without installing or using any physical apparatuses.

Abstract: A method and structure for providing high-quality transferred graphene layers for subsequent device fabrication includes transferring graphene onto a hydrophobic surface of a hydrophobic layer and performing a thermal treatment process. In various embodiments, a substrate including an insulating layer is provided, and a hydrophobic layer is formed over the insulating layer. In some examples, a graphene layer is transferred onto the hydrophobic layer. By way of example, the transferred graphene layer has a first carrier mobility. In some embodiments, after transferring the graphene layer, an annealing process is performed, and the annealed graphene layer has a second carrier mobility greater than the first carrier mobility.

Abstract: An object scanning method comprising following steps is provided. An object is scanned and a depth information of the object is captured by a depth sensor. A motor is moved and another depth information of the object after the movement of the motor is captured at least once. Under the circumstance that the axis coordinate of the motor are not calibrated, a movement amount of the motor is captured. A comparison of at least one feature point is made between two depth information of the object according to the movement amount of the motor, and an iterative algorithm is used to obtain corresponding coordinate of each feature point until the comparison of each feature point is completed. A 3D model of the object is created according to the corresponding coordinate of each feature point.

Abstract: An optical coupling module includes a top surface, a bottom surface parallel and opposite to the top surface, a front side surface, and a rear side surface parallel and opposite to the front side surface. The bottom surface defines a bottom groove including a first optical surface. Optical coupling lenses are arranged on the first optical surface. The bottom groove further includes a mounting surface parallel to the first optical surface and perpendicularly connected with the front side surface. Grooves in the mounting surface receive and locate optical fibers, which intersect with a straight line along the optical axes of the optical coupling lenses, the straight line runs between the optical coupling lenses and the photoelectric conversion members.

Abstract: The present invention provides a heavy metal detecting device and the fabricating method thereof. The heavy metal detecting device comprises a substrate and a nano-metal-particle array. The fabricating method of the heavy metal detecting device comprises following steps of: (S1) preparing a substrate, cleaning the substrate with a first liquid, and drying the substrate with a first gas; (S2) soaking the substrate in a first solution; (S3) after soaking the substrate for a first period of time, cleaning and drying the substrate with the first liquid and the first gas respectively; (S4) soaking the substrate in a pre-synthesized nano-metal-particle solution; and (S5) after soaking the substrate for a second period of time, cleaning and drying the substrate with a second liquid and the first gas respectively. Compared to the prior arts, the heavy metal detecting device of the present invention has the advantages of simplicity and rapidity.

Abstract: A method of fabricating a semiconductor device is provided. A plurality of sacrificial gates and a plurality of sacrificial gate dielectric layers thereunder are formed on a substrate. An interlayer dielectric layer is filled between the sacrificial gates. A protective layer is formed on the interlayer dielectric layer. The sacrificial gates and the sacrificial gate dielectric layers are removed to form an opening, wherein the interlayer dielectric layer is protected by the protective layer from recessing. A stacked gate structure is formed in the opening, wherein the protective layer is removed.

Abstract: An optical coupling module includes a top surface, a bottom surface parallel and opposite to the top surface, a front side surface, and a rear side surface parallel and opposite to the front side surface. The bottom surface defines a bottom groove including a first optical surface. Optical coupling lenses are arranged on the first optical surface. The bottom groove further includes a mounting surface parallel to the first optical surface and perpendicularly connected with the front side surface. Grooves in the mounting surface receive and locate optical fibers, which intersect with a straight line along the optical axes of the optical coupling lenses, the straight line runs between the optical coupling lenses and the photoelectric conversion members.

Abstract: A packaging method for light emitting diodes and structure thereof are provided, more particularly, provided are packaging method and structure thereof, which innovates packaging processes in fabrication distinct from and even contrary to those of conventional technologies, and obviate required Gold Wire Bonding Processes traditionally.

Abstract: The present invention is related to a LED package structure, which includes a substrate having a carrier surface, a light-emitting chip disposed on the carrier surface, electrically connecting to the substrate; and a transparent protective shield disposed on the carrier surface; a hermetic receiving space is formed between the transparent protective shield and the substrate. The light-emitting chip is disposed in the hermetic receiving space. A gap is formed between the light-emitting chip and the transparent protective shield.

Abstract: A semiconductor structure and its manufacturing method including multiple steps are provided. First, a patterned circuit board having a substrate and a patterned circuit layer is provided. The substrate includes a first surface, a second surface, at least one connecting channel, and at least one conductive through hole, wherein patterned circuit layer is disposed on the first surface, a second surface, and the inside wall of the conductive through hole. Then, the patterned circuit board is disposed on a carrier, and the patterned circuit layer disposed on one of the first surface and the second surface is touched with the carrier. Then, a filling process is applied. A filling material flows to the conductive through hole via the first surface or the second surface from the connecting channel. Then, a package material is provided to produce a semiconductor structure.

Abstract: An electronic device includes an integrated circuit, a connector, and a circuit board. The integrated circuit includes a first signal processing circuit, a second signal processing circuit, and an interface multiplexer having a first input port electrically connected to the first signal processing circuit, a second input port electrically connected to the second signal processing circuit, and an output port arranged to be electrically connected to the first input port or the second input port. The circuit board carries the integrated circuit and has a plurality of connector placement sites, including at least a first connector placement site each dedicated to the first signal processing circuit and at least a second connector placement site each dedicated to the second signal processing circuit. The connector placement sites and the output port of the interface multiplexer are electrically connected in series. The connector is installed on one of the connector placement sites.

Abstract: An electroluminescence device comprises a sandwich structure and a first luminous unit. The sandwich structure comprises a first metal layer, an insulation layer, and a second metal layer stacked in sequence along a stacking direction. The first luminous unit is disposed on a sidewall of the sandwich structure parallel to the stacking direction, wherein the first luminous unit comprises a first electrode and a second electrode connected to the first metal layer and the second metal layer by a solder ball respectively.