Abstract: A method for fabricating a silicon submount for LED packaging. A silicon substrate is provided. A reflection layer is formed on the silicon substrate. Portions of the reflection layer and the silicon substrate are removed to form openings. A wafer backside grinding process is carried out to thin the silicon substrate thereby turning the openings into through silicon vias. An insulating layer is then deposited to cover the reflection layer and the silicon substrate. A seed layer is formed on the insulating layer. A resist pattern is then formed on the seed layer. A metal layer is formed on the seed layer not covered by the resist pattern. The resist pattern is then stripped. The seed layer not covered by the metal layer is then removed.

Abstract: A device for extracting a synchronization signal from a video signal has a first comparator and an adjustment circuit. The first comparator receives the video signal, compares the video signal with a first threshold, and generates the synchronization signal according to the compared result. The adjustment circuit receives the video signal, compares the video signal with a plurality of second thresholds of different values, and changes the first threshold according to the compared results.

Abstract: An offset calibration method is provided. Two input terminals of an equalizer are switched to a common voltage at a first time point, wherein the equalizer generates a first equalized signal and a second equalized signal according to the common voltage. It is determined whether a first offset voltage is present in the equalizer according to the first and second equalized signals generated from the common voltage. If the first offset voltage is determined to be present in the equalizer, a first compensation voltage is provided to the equalizer.

Abstract: A method and apparatus for tracking a target object are provided. A plurality of images is received, and one of the images is selected as a current image. A specific color of the current image is extracted. And the current image is compared with a template image to search a target object in the current image. If the target object is not found in the current image, a previous image with the target object is searched in the images received before the current image. And the target object is searched in the current image according to an object feature of the previous image. The object feature and an object location are updated into a storage unit when the target object is found.

Abstract: A light emitting device package structure is described. The light emitting device package structure includes a substrate serving as a carrier supporting a light emitting device chip. The substrate and the light emitting device chip have a chip side and a substrate side separately. A first electrode layer is disposed on a first surface of the light emitting device chip and a second electrode layer is disposed on a second surface of the light emitting device chip, in which the first surface and the second surface are not coplanar. A first conductive trace is electrically connected to the first electrode layer and a second conductive trace is electrically connected to the second electrode layer. At least the first conductive trace or the second conductive trace is formed along the chip side and the substrate side simultaneously.

Abstract: A speech enhancement device and a method for the same are included. The device includes a down-converter, a speech enhancement processor, and an up-converter. The method includes steps of down-converting audio signals to generate down-converted audio signals; performing speech enhancement on the down-converted audio signals to generate speech-enhanced audio signals; and up-converting the speech enhancement audio signals to generate up-converted audio signals.

Abstract: The invention provides novel mesoporous particles and methods for the selective sequestration of organic compounds from microorganisms, such as from various genera and species of algae that produce important organic compounds. The organic compounds can be selectively sequestered, for example, in favor of biodiesel impurities such as sterols and chlorophyll, to provide substantially pure free fatty acids. The free fatty acids can then be esterified to provide pure biodiesel.

Abstract: Compositions and methods are disclosed relating to use of fractions, polysaccharides, and oligosaccharides of Dendrobium huoshanense. The fractions, polysaccharides, and oligosaccharides are able to effect an increase in beneficial cytokines and chemokines.

Abstract: A display apparatus including an image generator, a projection lens set, a depth detecting module detecting the position of user, and a control unit is provided, wherein the control unit is electrically connected to the image generator, the projection lens set and the depth detecting module. An image displayed by the image generator is projected through the projection lens set and generates a floating real image between the projection lens set and the user. Each beam forming the floating real image has a light-cone angle ?. The image generator and the projection lens adjust the position of the floating real image according to the position of user.

Abstract: A semiconductor package structure and a manufacturing method thereof are provided. The semiconductor package structure includes a semiconductor die, a thermally conductive film, a substrate, a plurality of electrically conductive film patterns, and at least one insulator. The thermally conductive film is disposed on the bottom of the semiconductor die. The substrate is substantially comprised of the electrically conductive material or semiconductor material. Furthermore, a first hole is disposed on and passed all the way through the substrate, and the semiconductor die is disposed in the first hole. The electrically conductive film patterns are disposed on the substrate, and not contacting with each other. In addition, the insulator is connected between the semiconductor die and the substrate.

Abstract: The invention provides an article comprising, a mesoporous silicate matrix, such as a particle, having one or more pores; and one or more releasable caps obstructing one or more of the pores. The articles are useful as delivery vehicles for encapsulated agents such as therapeutic agents, polynucleotides, polypeptides and the like.

Abstract: An embodiment of the invention provides a package structure for chip. The package structure for chip includes: a carrier substrate having an upper surface and an opposite lower surface; a chip overlying the carrier substrate and having a first surface and an opposite second surface facing the upper surface, wherein the chip includes a first electrode and a second electrode; a first conducting structure overlying the carrier substrate and electrically connecting the first electrode; a second conducting structure overlying the carrier substrate and electrically connecting the second electrode; a first through-hole penetrating the upper surface and the lower surface of the carrier substrate and disposed next to the chip without overlapping the chip; a first conducting layer overlying a sidewall of the first through-hole and electrically connecting the first conducting electrode; and a third conducting structure overlying the carrier substrate and electrically connecting the second conducting structure.

Abstract: A method and apparatus for tracking a target object are provided. A plurality of images is received, and one of the images is selected as a current image. A specific color of the current image is extracted. And the current image is compared with a template image to search a target object in the current image. If the target object is not found in the current image, a previous image with the target object is searched in the images received before the current image. And the target object is searched in the current image according to an object feature of the previous image. The object feature and an object location are updated into a storage unit when the target object is found.

Abstract: An optical fiber connector adapter has a housing, a front sleeve holder, a rear sleeve holder, a sleeve and detachable positioning member. The housing has a cavity, two limiting protrusions and two positioning slots. The cavity and positioning slots are defined in the housing. The limiting protrusions are formed in the cavity. The front and sleeve holders are mounted in the cavity and each has a tube and a mount abutting the limiting protrusions. The sleeve is mounted in the tubes. The detachable positioning member is mounted on the housing and has two stoppers extending respectively the positioning slots to make the mounts clamped between the limiting protrusions and the stoppers. The optical fiber connector adapter with the detachable positioning member may be detached easily to facilitate rework.

Abstract: A light emitting diode package is provided, which includes a semiconductor substrate having a first surface and a second surface; at least a through-hole passing through the semiconductor substrate; a thermal via formed extending from the second surface toward the first surface of the semiconductor substrate, wherein the thermal via has a first end near the first surface and a second end near the second surface; an insulating layer overlying a sidewall of the through-hole and extending overlying the first surface and the second surface of the semiconductor substrate, wherein the insulating layer further covers at least one of the first end, the second end and a sidewall of the thermal via; a conducting layer overlying the insulating layer in the through-hole and extending to the first surface and the second surface of the semiconductor substrate; and an LED chip disposed overlying the semiconductor substrate.

Abstract: In order to automatically measure a signal skew between a first test signal and a second test signal by using an oscilloscope, a method is provided by the present invention. The method includes: capturing a band center of the first test signal; capturing a first sampling point and a second sampling point of the second test signal; comparing a voltage difference between the first sampling point and the second sampling point of the second test signal with a threshold value so as to decide and capture a rising band center and a falling band center of the second test signal. By using the invented method, the signal skew between the first test signal and the second test signal can be calculated according to the band center of the first test signal, the rising band center and the falling band center of the second test signal.

Abstract: An electronic device includes an integrated circuit, a connector, and a circuit board. The integrated circuit includes a first signal processing circuit, a second signal processing circuit, and an interface multiplexer having a first input port electrically connected to the first signal processing circuit, a second input port electrically connected to the second signal processing circuit, and an output port arranged to be electrically connected to the first input port or the second input port. The circuit board carries the integrated circuit and has a plurality of connector placement sites, including at least a first connector placement site each dedicated to the first signal processing circuit and at least a second connector placement site each dedicated to the second signal processing circuit. The connector placement sites and the output port of the interface multiplexer are electrically connected in series. The connector is installed on one of the connector placement sites.

Abstract: A light emitting device package structure is described. The light emitting device package structure includes a carrier substrate with a top surface and a bottom surface, having at least two through holes. A dielectric mirror structure is formed on the top surface of the carrier substrate, wherein the dielectric mirror structure includes laminating at least five dielectric layer groups, wherein each of the dielectric layer group includes an upper first dielectric layer having a first reflective index and an lower second dielectric layer having a second reflective index smaller than the first reflective index. A first conductive trace and a second conductive trace isolated from each other are formed on the dielectric mirror structure, respectively extending from the top surface to the bottom surface of the carrier substrate along sides of the different through holes. A light emitting device chip is mounted on the top surface of the carrier substrate.

Abstract: According to an embodiment of the invention, a light emitting chip package is provided, which includes a carrier substrate having a first surface and an opposite second surface, a cavity extending from the first surface toward the second surface, at least a electrical conductive via and at least a thermal conductive via, located outside of the cavity and penetrating through the first surface and the second surface of the carrier substrate, a light emitting element having contact electrodes and disposed in the cavity, wherein the contact electrode are electrically connected to the electrical conductive via and are electrically insulated from the thermal conductive via.

Abstract: A heat dissipation device is used for dissipating heat generated from a plurality of memory modules inserted on a motherboard. The memory modules are parallel to each other. Two hooks are disposed at two ends of the slot of each memory connector, respectively, to clamp the memory module corresponding to the slot when the memory module is inserted in the slot. The heat dissipation device includes two fixing frames, a connection frame, and two fans. The two fixing frames are disposed at two opposite ends of the memory connectors and fastened with the hooks at two ends of each slot, respectively. Additionally, the connection frame is connected between the two fixing frames. The two fans are disposed on the two fixing frames, respectively. An air inlet of one of the two fans faces an air outlet of the other one.