Patents by Inventor Shawn Hall

Shawn Hall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device Account Upgrade-At-Claim
    Publication number: 20140046856
    Abstract: A method of upgrading a device account is provided, the method comprising: disposing a processor in communication with a software package, wherein said software package is capable of receiving a data file containing a current device account status indicator from a device account status data provider; referencing said data file to inform a decision regarding whether a device account owner is eligible for an account upgrade at the time a device account claim is processed; and notifying said owner whether a device protection account upgrade is available.
    Type: Application
    Filed: October 14, 2013
    Publication date: February 13, 2014
    Applicant: Asurion, LLC.
    Inventors: Jeff Kulla, Shawn Hall
  • SALES LEAD GENERATION SYSTEM FOR A COMPANY IN A SERVICE INDUSTRY AND RELATED METHODS
    Publication number: 20130282509
    Abstract: A sales lead generation system for a company in a service industry is disclosed. The sales lead generation system may comprise a master database for storing information for customers of the company, and a mobile device for communicating sales lead information for service work to the master database. The sales lead information may include identifying information for the customers and at least one media file indicating an anomaly condition at a location of the customer. A related method and computer-readable medium are also disclosed.
    Type: Application
    Filed: April 24, 2012
    Publication date: October 24, 2013
    Applicant: YOUNG ELECTRIC SIGN COMPANY
    Inventors: Warren G. Strong, Cody T. Ahlquist, Shawn A. Hall
  • METHOD AND APPARATUS FOR SINGLE-LOOP TEMPERATURE CONTROL OF A COOLING METHOD
    Publication number: 20130098598
    Abstract: An apparatus for cooling N heat-producing devices, where AT is an integer no smaller than one, using a cooling fluid that may be supplied at a temperature below the dew-point temperature of ambient air. To avoid condensation on the heat-producing devices, the cold fluid is warmed, upstream of the heat-producing devices, to a temperature T0 that is above the dew-point. The warming is accomplished, in a heat exchanger, by the warm fluid returning from the heat-producing devices. The amount of warming is controlled by periodically measuring T0 as well as the N temperatures downstream of the N heat-producing devices, and sending these N+1 temperature measurements to a control element that implements a control algorithm whose purpose is to achieve a set-point value of T0 by regulating, via N control valves, the flow of fluid to the N heat-producing devices. Also provided is a method for cooling the N heat-pro during devices pursuant to the inventive apparatus by a temperature control over the cooling fluid.
    Type: Application
    Filed: June 12, 2009
    Publication date: April 25, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Shawn A. Hall
  • Establishing Parse Scope
    Publication number: 20130097131
    Abstract: Example apparatus, methods, and computers control establishing a shared parse scope between two computers that intend to be involved in a shared de-duplication action. One example method includes, upon determining that a first de-duplication logic and a second de-duplication logic are to participate in a shared de-duplication action for an object, controlling the first de-duplication logic to establish a shared parse scope with the second de-duplication logic. Establishing the shared parse scope may include negotiations between the computers, where the negotiations transfer dialect information. The dialect information may take the form of rules. The method may also include persisting the shared parse scope.
    Type: Application
    Filed: May 3, 2012
    Publication date: April 18, 2013
    Applicant: QUANTUM CORPORATION
    Inventors: Jeffrey Vincent TOFANO, Shawn Hall
  • Through board stacking of multiple LGA-connected components
    Patent number: 8278745
    Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
    Type: Grant
    Filed: August 18, 2009
    Date of Patent: October 2, 2012
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Shawn A. Hall, Gareth G. Hougham, Alphonso P. Lanzetta, Rick A. Rand
  • Through board stacking of multiple LGA-connected components
    Patent number: 8174106
    Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: May 8, 2012
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Shawn A. Hall, Gareth G. Hougham, Alphonso P. Lanzetta, Rick A. Rand
  • Fire-code-compatible, collapsible partitions to prevent unwanted airflow between computer-room cold aisles and hot aisles
    Patent number: 8037644
    Abstract: An arrangement for the cooling of computer data centers. More particularly, the arrangement eliminates the problems present in the uneven or inadequate cooling of computer racks due to unwanted airflows, which are encountered between so-called hot aisles and cold aisles present in a computer data center. Specifically, this problem is solved through the provision of partitions which, under normal circumstances, prevent the unwanted airflows by standing in a vertical orientation, yet which, in the event of a fire, collapse from the vertical orientation to a horizontal orientation, thereby avoiding interference with water sprays from sprinkler heads, and thus complying with fire codes and ordinances. Moreover, also employed is a method of preventing the unwanted air flows by utilization of the novel arrangement comprising the fire-code-compatible, collapsible partitions.
    Type: Grant
    Filed: January 7, 2008
    Date of Patent: October 18, 2011
    Assignee: International Business Machines Corporation
    Inventor: Shawn A. Hall
  • MULTI-PETASCALE HIGHLY EFFICIENT PARALLEL SUPERCOMPUTER
    Publication number: 20110219208
    Abstract: A Multi-Petascale Highly Efficient Parallel Supercomputer of 100 petaOPS-scale computing, at decreased cost, power and footprint, and that allows for a maximum packaging density of processing nodes from an interconnect point of view. The Supercomputer exploits technological advances in VLSI that enables a computing model where many processors can be integrated into a single Application Specific Integrated Circuit (ASIC).
    Type: Application
    Filed: January 10, 2011
    Publication date: September 8, 2011
    Applicant: International Business Machines Corporation
    Inventors: Sameh Asaad, Ralph E. Bellofatto, Michael A. Blocksome, Matthias A. Blumrich, Peter Boyle, Jose R. Brunheroto, Dong Chen, Chen-Yong Cher, George L. Chiu, Norman Christ, Paul W. Coteus, Kristan D. Davis, Gabor J. Dozsa, Alexandre E. Eichenberger, Noel A. Eisley, Matthew R. Ellavsky, Kahn C. Evans, Bruce M. Fleischer, Thomas W. Fox, Alan Gara, Mark E. Giampapa, Thomas M. Gooding, Michael K. Gschwind, John A. Gunnels, Shawn A. Hall, Rudolf A. Haring, Philip Heidelberger, Todd A. Inglett, Brant L. Knudson, Gerard V. Kopcsay, Sameer Kumar, Amith R. Mamidala, James A. Marcella, Mark G. Megerian, Douglas R. Miller, Samuel J. Miller, Adam J. Muff, Michael B. Mundy, John K. O'Brien, Kathryn M. O'Brien, Martin Ohmacht, Jeffrey J. Parker, Ruth J. Poole, Joseph D. Ratterman, Valentina Salapura, David L. Satterfield, Robert M. Senger, Brian Smith, Burkhard Steinmacher-Burow, William M. Stockdell, Craig B. Stunkel, Krishnan Sugavanam, Yutaka Sugawara, Todd E. Takken, Barry M. Trager, James L. Van Oosten, Charles D. Wait, Robert E. Walkup, Alfred T. Watson, Robert W. Wisniewski, Peng Wu
  • Method of making a land-grid-array (LGA) interposer
    Patent number: 7975379
    Abstract: LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces.
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: July 12, 2011
    Assignee: International Business Machines Corporation
    Inventors: Gareth G. Hougham, Brian S. Beaman, John S. Corbin, Paul Coteus, Shawn A. Hall, Kathleen C. Hinge, Theron L. Lewis, Frank R. Libsch, Amanda E. E. Mikhail
  • METHOD AND APPARATUS FOR SINGLE-LOOP TEMPERATURE CONTROL OF A COOLING METHOD
    Publication number: 20100314094
    Abstract: An apparatus for cooling N heat-producing devices, where AT is an integer no smaller than one, using a cooling fluid that may be supplied at a temperature below the dew-point temperature of ambient air. To avoid condensation on the heat-producing devices, the cold fluid is warmed, upstream of the heat-producing devices, to a temperature T0 that is above the dew-point. The warming is accomplished, in a heat exchanger, by the warm fluid returning from the heat-producing devices. The amount of warming is controlled by periodically measuring T0 as well as the N temperatures downstream of the N heat-producing devices, and sending these N+1 temperature measurements to a control element that implements a control algorithm whose purpose is to achieve a set-point value of T0 by regulating, via N control valves, the flow of fluid to the N heat-producing devices. Also provided is a method for cooling the N heat-pro during devices pursuant to the inventive apparatus by a temperature control over the cooling fluid.
    Type: Application
    Filed: June 12, 2009
    Publication date: December 16, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Shawn A. Hall
  • Ultrascalable petaflop parallel supercomputer
    Patent number: 7761687
    Abstract: A massively parallel supercomputer of petaOPS-scale includes node architectures based upon System-On-a-Chip technology, where each processing node comprises a single Application Specific Integrated Circuit (ASIC) having up to four processing elements. The ASIC nodes are interconnected by multiple independent networks that optimally maximize the throughput of packet communications between nodes with minimal latency. The multiple networks may include three high-speed networks for parallel algorithm message passing including a Torus, collective network, and a Global Asynchronous network that provides global barrier and notification functions. These multiple independent networks may be collaboratively or independently utilized according to the needs or phases of an algorithm for optimizing algorithm processing performance. The use of a DMA engine is provided to facilitate message passing among the nodes without the expenditure of processing resources at the node.
    Type: Grant
    Filed: June 26, 2007
    Date of Patent: July 20, 2010
    Assignee: International Business Machines Corporation
    Inventors: Matthias A. Blumrich, Dong Chen, George Chiu, Thomas M. Cipolla, Paul W. Coteus, Alan G. Gara, Mark E. Giampapa, Shawn Hall, Rudolf A. Haring, Philip Heidelberger, Gerard V. Kopcsay, Martin Ohmacht, Valentina Salapura, Krishnan Sugavanam, Todd Takken
  • Topography compensating land grid array interposer
    Publication number: 20100173505
    Abstract: LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces. For those LGA types made by molding techniques such as the metal-in-polymer type (eg. Tyco Electronics MPI, or Shin Etsu RP) or the Metal-on-Elastomer type (IBM), using molds with the desired topography provides the desired LGA topography.
    Type: Application
    Filed: August 11, 2009
    Publication date: July 8, 2010
    Inventors: Gareth G. Hougham, Brian S. Beaman, John S. Corbin, Paul Coteus, Shawn A. Hall, Kathleen C. Hinge, Theron L. Lewis, Frank R. Libsch, Amanda E. E. Mikhail
  • THROUGH BOARD STACKING OF MULTIPLE LGA-CONNECTED COMPONENTS
    Publication number: 20090315168
    Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
    Type: Application
    Filed: August 18, 2009
    Publication date: December 24, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Paul W. Coteus, Shawn A. Hall, Gareth G. Hougham, Alphonso P. Lanzetta, Rick A. Rand
  • FIRE-CODE-COMPATIBLE, COLLAPSIBLE PARTITIONS TO PREVENT UNWANTED AIRFLOW BETWEEN COMPUTER-ROOM COLD AISLES AND HOT AISLES
    Publication number: 20090173017
    Abstract: An arrangement for the cooling of computer data centers. More particularly, the arrangement eliminates the problems present in the uneven or inadequate cooling of computer racks due to unwanted airflows, which are encountered between so-called hot aisles and cold aisles present in a computer data center. Specifically, this problem is solved through the provision of partitions which, under normal circumstances, prevent the unwanted airflows by standing in a vertical orientation, yet which, in the event of a fire, collapse from the vertical orientation to a horizontal orientation, thereby avoiding interference with water sprays from sprinkler heads, and thus complying with fire codes and ordinances. Moreover, also employed is a method of preventing the unwanted air flows by utilization of the novel arrangement comprising the fire-code-compatible, collapsible partitions.
    Type: Application
    Filed: January 7, 2008
    Publication date: July 9, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Shawn A. Hall
  • WATER-ASSISTED AIR COOLING FOR A ROW OF CABINETS
    Publication number: 20090122483
    Abstract: A cooling apparatus and method including a plurality of heat-producing devices positioned in a plurality of cabinets arranged in a row that allows flow of a first fluid through the heat-producing devices and cabinets where the flow is directed from an upstream end of the row to a downstream end of the row. The cabinets have a space therebetween wherein a heat exchanger is positioned between and adjacent to the cabinets, thereby the cabinets and heat exchangers alternate in the row. Each heat exchanger allows flow of a second fluid therethrough for cooling the first fluid. A fluid-moving device is positioned adjacent the heat-producing devices for encouraging flow of the first fluid through the cabinets' heat-producing devices and through the heat exchangers, thereby encouraging heat transfer in each of the heat exchangers from the first fluid to the second fluid.
    Type: Application
    Filed: November 13, 2007
    Publication date: May 14, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Shawn A. Hall
  • Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling
    Patent number: 7486513
    Abstract: A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: February 3, 2009
    Assignee: International Business Machines Corporation
    Inventors: Shawn A. Hall, Shurong Tian, Paul W. Coteus, John P. Karidis, Evan G. Colgan, Robert W. Guernsey, Jr.
  • Folded-sheet-metal heatsinks for closely packaged heat-producing devices
    Patent number: 7474529
    Abstract: A folded heatsink for cooling heat-producing devices. The folded heatsink includes a substantially planar base having a first end and a second end. The base is intended to be affixed in thermal contact to an exposed, substantially planar surface of one or more heat-producing devices. The folded heatsink also includes two shoulders each having a proximal end and a distal end. The proximal ends of the shoulders project substantially at right angles from the first and second ends of the base. The folded heatsink also includes two arms each having a proximal end and a distal end. The proximal ends of the arms project substantially at right angles from the distal ends of the shoulders such that the base, shoulders and arms from a nearly closed rectangular tube formed from a continuous sheet of metal.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: January 6, 2009
    Assignee: International Business Machines Corporation
    Inventors: Shurong Tian, Shawn A. Hall, Paul W. Coteus
  • ULTRASCALABLE PETAFLOP PARALLEL SUPERCOMPUTER
    Publication number: 20090006808
    Abstract: A novel massively parallel supercomputer of petaOPS-scale includes node architectures based upon System-On-a-Chip technology, where each processing node comprises a single Application Specific Integrated Circuit (ASIC) having up to four processing elements. The ASIC nodes are interconnected by multiple independent networks that optimally maximize the throughput of packet communications between nodes with minimal latency. The multiple networks may include three high-speed networks for parallel algorithm message passing including a Torus, collective network, and a Global Asynchronous network that provides global barrier and notification functions. These multiple independent networks may be collaboratively or independently utilized according to the needs or phases of an algorithm for optimizing algorithm processing performance. Novel use of a DMA engine is provided to facilitate message passing among the nodes without the expenditure of processing resources at the node.
    Type: Application
    Filed: June 26, 2007
    Publication date: January 1, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Matthias A. Blumrich, Dong Chen, George Chiu, Thomas M. Cipolla, Paul W. Coteus, Alan G. Gara, Mark E. Giampapa, Shawn Hall, Rudolf A. Haring, Philip Heidelberger, Gerard V. Kopcsay, Martin Ohmacht, Valentina Salapura, Krishnan Sugavanam, Todd Takken
  • METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING
    Publication number: 20080212282
    Abstract: A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
    Type: Application
    Filed: March 5, 2008
    Publication date: September 4, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Shawn A. Hall, Shurong Tian, Paul W. Coteus, John P. Karidis, Evan G. Colgan, Robert W. Guernsey
  • FOLDED-SHEET-METAL HEATSINKS FOR CLOSELY PACKAGED HEAT-PRODUCING DEVICES
    Publication number: 20080123300
    Abstract: A folded heatsink for cooling heat-producing devices. The folded heatsink includes a substantially planar base having a first end and a second end. The base is intended to be affixed in thermal contact to an exposed, substantially planar surface of one or more heat-producing devices. The folded heatsink also includes two shoulders each having a proximal end and a distal end. The proximal ends of the shoulders project substantially at right angles from the first and second ends of the base. The folded heatsink also includes two arms each having a proximal end and a distal end. The proximal ends of the arms project substantially at right angles from the distal ends of the shoulders such that the base, shoulders and arms from a nearly closed rectangular tube formed from a continuous sheet of metal.
    Type: Application
    Filed: November 29, 2006
    Publication date: May 29, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Shurong Tian, Shawn A. Hall, Paul W. Coteus