Abstract: A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.

Abstract: A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.

Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

Abstract: A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.

Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

Abstract: LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating serfaces. For those LGA types made by molding techniques such as the metal-in-polymer type (eg. Tyco Electronics MPI, or Shin Etsu RP) or the Metal-on-Elastomer type (IBM), using molds with the desired topography provides the desired LGA topography.

Abstract: A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.

Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

Abstract: Where a fluid cooling medium cools a plurality of heat-producing devices arranged in a row along a generalized coordinate direction, with a space between each adjacent pair of devices, each space may have a partition that defines a boundary between a first plenum and a second plenum. The first plenum carries cooling medium across an entrance and thence into a first heat-producing device located on a first side of the partition facing the first plenum. The second plenum carries cooling medium away from a second heat-producing device located on a second side of the partition facing the second plenum and thence across an exit. The partition is disposed so that the first plenum becomes smaller in cross-sectional area as distance increases from the entrance, and the second plenum becomes larger in cross sectional area as distance decreases toward the exit.

Abstract: A system and method for seamlessly combining client-only rendering techniques with server-only rendering techniques. The approach uses a composite stream containing three distinct streams. One stream is available to send geometry from the server to the client. Another stream contains video with transparent pixels that allow the client-rendered object to appear in the context of the server rendered objects. The third stream contains camera information. The invention can satisfy a number of viewing applications. For example, initially the most relevant geometry can stream to the client for high quality local rendering while the server delivers renderings of less relevant geometry at lower resolutions. After the most relevant geometry has been delivered to the client, the less important geometry can be optionally streamed to the client to increase the fidelity of the entire scene.

Abstract: A system and method for seamlessly combining client-only rendering techniques with server-only rendering techniques. The approach uses a composite stream containing three distinct streams. Two of the streams are synchronized and transmit camera definition, video of server-rendered objects, and a time dependent depth map for the server-rendered object. The third stream is available to send geometry from the server to the client, for local rendering if appropriate. The invention can satisfy a number of viewing applications. For example, initially the most relevant geometry can stream to the client for high quality local rendering while the server delivers renderings of less relevant geometry at lower resolutions. After the most relevant geometry has been delivered to the client, the less important geometry can be optionally streamed to the client to increase the fidelity of the entire scene.

Abstract: A method for aligning a substantially co-linear array of lasers with a substantially co-linear array of optical fibers, comprising the steps of activating a laser in proximity to a first end of said laser array, positioning the laser array with respect to the fiber array to maximize energy coupled from the activated laser to its corresponding fiber, activating a laser in proximity to a second end of said laser array; and positioning the laser array with respect to the fiber array to maximize energy coupled from the activated laser to its corresponding fiber.

Abstract: An apparatus for aligning a substantially co-linear array of optical devices with a substantially co-linear array of optical fibers comprising; a carrier having a slot for receiving the array of devices and the array of optical fibers; a first support plate having a first holder for holding the array of devices in place with respect to the first support plate, and electrical connections for electrically connecting to selected ones of the devices in the array of devices; a second support plate having a second holder for holding the array of fibers in rough alignment with the array of devices; and a positioner for positioning the carrier with respect to the first holder and the second holder so that when the holders are activated, the array of devices and the array of fibers are held in approximate alignment without the presence of the carrier.

Abstract: A rotary viscosity pump is provided that has a housing and an impeller. The housing has a conical chamber with an outlet at a narrow end of the chamber. The impeller has a conical section with a logarithmic spiral groove along its exterior. The spacing between the housing and the impeller can have either a constant gap or a gap that decreases along the length of the impeller. The depth of the groove can be constant, increase, or decrease in depth along the length of the impeller.

Abstract: The trajectory of an electromagnetic actuator is adjusted by pulse-width-modulating feedback control of the waveform which energizes the coil. As applied to actuators for impact printing, the objectives of the control scheme are to regulate the armature's time of flight and its velocity at impact, in spite of disturbances, thereby to provide higher-quality printing at increased speed. Each actuation is produced by energizing the coil with a series of pulses. Regulation is accomplished under microprocessor control by measuring the state variables of the system--armature position, armature velocity, and coil current--at the beginning of each pulse, comparing these measurements to ideal values, and modulating the width of the pulse as a function of the errors. In general, the appropriate functional relationship between the measured errors and the pulse-width modulation is nonlinear, and is different for each pulse in the series. Systematic means for determining these relationships are given.