Abstract: A semiconductor device is provided. The semiconductor device includes a first pull-down transistor, a first pull-up transistor, a second pull-down transistor, a second pull-up transistor, a first pass gate transistor, a second pass gate transistor, a first bit line, a second bit line, a word line and a voltage supply line. The first pull-down transistor and the first pull-up transistor form a first inverter. The second pull-down transistor and the second pull-up transistor form a second inverter. An input of the first inverter is connected to an output of the second inverter through a first node butted contact. The first node butted contact includes a metal contact directly contacted a gate of the first pull-down transistor and the first pull-up transistor and directly contacted a source/drain of the second pull-down transistor, the second pull-up transistor and the second pass gate transistor.

Abstract: The present disclosure relates to a system and a method for data accessing. The method includes: obtaining a request from a user of the user terminal; obtaining a type of the request, obtaining request tolerance data of the user; and determining a delay time for transmitting the request to a backend server corresponding to the request according to the type of the request and the request tolerance data of the user.

Abstract: A power converter is provided. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms a receiving space, wherein the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing, and disposed in the receiving space. The heat dissipation module includes an inner path that communicates the first housing port with the second housing port. Working fluid enters the inner path via the first housing port. The working fluid leaves the inner path via the second housing port. The first circuit board includes a first circuit board body and a first heat source, wherein the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the inner path of the heat dissipation module.

Abstract: A method for fabricating a semiconductor device includes the steps of first providing a substrate having a high electron mobility transistor (HEMT) region and a capacitor region, forming a buffer layer on the substrate, forming a mesa isolation on the HEMT region, forming a HEMT on the mesa isolation, and then forming a capacitor on the capacitor region. Preferably, a bottom electrode of the capacitor contacts the buffer layer directly.

Abstract: Various embodiments of the present disclosure provide a semiconductor device structure. In one embodiment, the semiconductor device structure includes a first source/drain feature and a second source/drain feature, a plurality of semiconductor layers vertically stacked and disposed between the first and second source/drain features, a gate electrode layer surrounding a portion of each of the plurality of the semiconductor layers, and an interfacial layer (IL) disposed between the gate electrode layer and one of the plurality of the semiconductor layers, wherein a topmost semiconductor layer of the plurality of the semiconductor layers has a first length, and the IL has a second length greater than the first length.

Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.

Abstract: In an embodiment, a method includes: forming active devices over a semiconductor substrate; forming an interconnect structure over the active devices, the interconnect structure comprising a first portion of a seal ring over the semiconductor substrate, the seal ring being electrically insulated from the active devices; forming a first passivation layer over the interconnect structure; forming a first metal pad and a second metal pad extending through the first passivation layer and over the interconnect structure, the first metal pad having a bowl shape, the second metal pad having a step shape; and depositing a second passivation layer over the first metal pad and the second metal pad.

Abstract: Semiconductor device and methods of manufacture are provided. In an embodiment, the a semiconductor device may include a first semiconductor die; an oxide layer on the first semiconductor die, wherein the first semiconductor die has a first top surface opposite the oxide layer; a first insulating material encapsulating the first semiconductor die and the oxide layer, wherein the first insulating material has a second top surface planar with the first top surface; and a first polymer buffer disposed between a sidewall of the first semiconductor die and a sidewall of the oxide layer, wherein the first polymer buffer has a third top surface planar with both the first top surface and the second top surface.

Abstract: An adhered multilayer die unit includes at least one probe zone and at least one non-probe zone for probes to be inserted in the probe zone. The adhered multilayer die unit includes dies and at least one adhesive layer. Each die includes at least one connecting surface, and through holes in the at least one probe zone for the probes to be inserted through the through holes of each die. The at least one adhesive layer adheres the connecting surfaces of the dies to each other. The at least one adhesive layer is entirely in the at least one non-probe zone. Accordingly, the adhered multilayer die unit of the invention has great structural strength in large-area condition, avoids drilling process difficulty problem and size restriction of fastening combining manner, avoids adhesive spillage and its affection on probes, and avoids adhesive-caused problems of adhesive spillage and die levelness deviation.

Abstract: A semiconductor device includes: a substrate; a seed layer disposed on the substrate; a compound semiconductor stack layer disposed on the seed layer; and a source metal layer and a drain metal layer disposed on the compound semiconductor stack layer. The semiconductor device further includes a conductive layer at least partially covering the source metal layer and the drain metal layer, and covering opposing side surfaces of the seed layer and opposing side surfaces of the compound semiconductor stack layer. The conductive layer electrically connects the seed layer and the source metal layer.

Abstract: A display device is provide. The display device is within a transportation device having a first seating area, including a display unit, a mechanical platform, and a mechanical shaft assembly. The mechanical platform is configured to correspond to the first seating area. The mechanical shaft assembly is disposed on the mechanical platform and including a first shaft portion, a second shaft portion, and a third shaft portion. The first shaft portion is connected to the display unit and driving the display unit to move along a horizontal direction. The second shaft portion is connected to an upper end of the display unit and driving the display unit to rotate around a second axis. The third shaft portion is connected to the second shaft portion and driving the display unit to rotate around a third axis.

Abstract: The technology disclosed relates to user interfaces for controlling augmented reality environments. Real and virtual objects can be seamlessly integrated to form an augmented reality by tracking motion of one or more real objects within view of a wearable sensor system using a combination a RGB (red, green, and blue) and IR (infrared) pixels of one or more cameras. It also relates to enabling multi-user collaboration and interaction in an immersive virtual environment. In particular, it relates to capturing different sceneries of a shared real world space from the perspective of multiple users. The technology disclosed further relates to sharing content between wearable sensor systems. In particular, it relates to capturing images and video streams from the perspective of a first user of a wearable sensor system and sending an augmented version of the captured images and video stream to a second user of the wearable sensor system.

Abstract: A power source control circuit and a power steering system are provided. The power source control circuit comprises: a signal input circuit that includes at least two input ends, and each of the at least two input ends is used for collecting a first control signal which indicates whether an external device corresponding to the input end is abnormal; and a control circuit that is used for generating, according to the first control signals collected by each of the at least two input ends, a second control signal, which is used for controlling the turning-off of a power source.

Abstract: A hydraulic brake and electronic parking integrated caliper includes a base, a main body movable relative to the base, two brake pads movable relative to the main body, two hydraulic pistons for pushing the brake pads, an electronic drive fixed to the main body, a threaded rod driven by the electronic drive to rotate, and a linearly displacing member displaceable relative to the threaded rod. When moving from a first position to a second position, the linearly displacing member pushes a hydraulic piston and a brake pad toward a direction to press against a brake disc. When moving from the second position to a third position, the linearly displacing member moves the threaded rod, electronic drive and main body toward another direction to make the other hydraulic piston and brake pad press against the brake disc. The caliper has simple structure and generates larger clamping force.

Abstract: A compact personal transport device convertible between a riding configuration and a stowed configuration is described. In one embodiment, a seat post release and handlebar holding mechanism for the personal transport device includes a frame post attached internally and a seat post including an opening on one side that fits onto the frame post. The seat post release and handlebar holding mechanism also includes a latch connected inside the frame post to a pivot point. The latch extends outwards from one side of the frame post and extends through the opening in the seat post in a secured position. The seat post release and handlebar holding mechanism also includes a lever member attached to the latch at a first end and having an engaging surface at an opposite second end extending out from the frame post on an opposite side from the latch.

Abstract: A foldable seat assembly for a personal transport device is described. The seat assembly includes a seat having a seat surface and a seat post attached to an underside of the seat. The seat assembly also includes a latching mechanism having a pivot mechanism, a clamp located above the pivot mechanism, a latch arm attached to the pivot mechanism at a pivot end of the latch arm, a hooked catch disposed at a catch end of the latch arm opposite the pivot end, and a catch receiver associated with the underside of the seat. The catch receiver engages with the hooked catch of the latch arm. When the clamp is in a locked position, the hooked catch exerts a downward clamping force on the catch receiver to secure the seat in a riding configuration so that the seat surface has a horizontal orientation.

Abstract: A connecting seat for a disc brake includes a main body and a plurality of bushings. The main body includes a plurality of through holes. The bushings are fixedly jammed in the through holes of the main body respectively. The hardness of the bushings is larger than the hardness of the main body. Each bushing includes a first end surface, a second end surface, and a threaded hole penetrating through the first end surface and the second end surface. As a result, the connecting seat has advantages of light weight and great connecting strength.

Abstract: A projection lens module includes a projection lens and an adjustment device connected to the projection lens and adjusting a movement of the projection lens. The adjustment device includes a turntable, a combination plate, and an assembly member. The combination plate has an elastic member having a first combination unit. The assembly member includes a contact plate and a screw rod connecting the first surface of the contact plate. The second surface of the contact plate has a second combination unit clamped to the first combination unit. When the turntable rotates, the first combination unit drives the second combination unit to rotate around the axis. When the turntable maintains rotation and the assembly member is fixed, the elastic member generates elastic deformation, and therefore the first and second combination units are separated from each other so that the combination plate and the assembly member rotate relatively.