Patents by Inventor Sheng YU

Sheng YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11493536
    Abstract: A probe head includes upper and lower die units, and a linear probe inserted therethrough and thereby defined with tail, body and head portions. A first bottom surface of the upper die unit and a second top surface of the lower die unit face each other, thereby defining an inner space wherein the body portion is located and includes a plurality of sections each having front width larger than or equal to back width, including a narrowest section whose upper and lower ends have a distance from the first bottom surface and the second top surface respectively. The head and tail portions are offset from each other along two horizontal axes and the body portion is thereby curved. The present invention is favorable in dynamic behavior control of the linear probe which is easy in manufacturing, lower in cost and has more variety in material.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: November 8, 2022
    Assignee: MPI CORPORATION
    Inventors: Tzu-Yang Chen, Chin-Yi Lin, Chen-Rui Wu, Sheng-Yu Lin, Ming-Ta Hsu, Chia-Ju Wei
  • Patent number: 11469683
    Abstract: An active bridge rectifying control apparatus includes a bridge rectifying unit and a rectifying control module. The rectifying control module includes a phase control unit, a low-side drive unit, and a self-drive unit. The phase control unit provides a live line signal and a ground line signal according to a positive half cycle and a negative half cycle of an AC power source. The low-side drive unit provides a low-side control signal according to the live line signal and the ground line signal. The self-drive unit establishes a drive voltage according to the positive half cycle and the negative half cycle of the AC power source, and provides a high-side control signal according to the low-side control signal. The bridge rectifying unit rectifies the AC power source into a DC power source according to the low-side control signal, the high-side control signal, and the drive voltage.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: October 11, 2022
    Assignee: DELTA ELECTRONICS INC.
    Inventors: Sheng-Yu Wen, Cheng-Yi Lin, Jen-Chieh Tsai
  • Patent number: 11455287
    Abstract: Embodiments are described for a system and method to analyze data at a plurality of data sources. A data analytic workflow may be received. The data analytic workflow may include at least one operation to be performed on a plurality of data sets stored at a plurality of data sources. Instructions may be created based on the operation to be performed and a type of platform that operates the data sources. Furthermore, the instructions may be transmitted to the data sources such that the data sources may execute the operations on the data sets stored at the data sources.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: September 27, 2022
    Assignee: TIBCO Software Inc.
    Inventors: Steven Hillion, Yi-Ling Chen, Zhe Dong, Yong-Sheng Yu, Yong Zhao
  • Patent number: 11437415
    Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: September 6, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ming-Hung Chen, Yung I. Yeh, Chang-Lin Yeh, Sheng-Yu Chen
  • Patent number: 11429027
    Abstract: An extreme ultraviolet lithography (EUVL) method includes providing at least two phase-shifting mask areas having a same pattern. A resist layer is formed over a substrate. An optimum exposure dose of the resist layer is determined, and a latent image is formed on a same area of the resist layer by a multiple exposure process. The multiple exposure process includes a plurality of exposure processes and each of the plurality of exposure processes uses a different phase-shifting mask area from the at least two phase-shifting mask areas having a same pattern.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: August 30, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shinn-Sheng Yu, Ru-Gun Liu, Hsu-Ting Huang, Chin-Hsiang Lin
  • Patent number: 11425713
    Abstract: A method and system are provided having an uplink control structure and a pilot signal having minimal signal overhead for providing channel estimation and data demodulation in a wireless communication network. The uplink control structures enable mobile terminals to communicate with corresponding base stations to perform various functions including obtaining initial system access, submitting a bandwidth request, triggering a continuation of negotiated service, or providing a proposed allocation re-configuration header. A dedicated random access channel is provided to communicatively couple the base station and the mobile terminal so that the mobile terminal can select a random access signaling identification. A resource request is received at the base station to uplink resource information from the mobile terminal and an initial access information request is received from the mobile terminal to configure the base station connection.
    Type: Grant
    Filed: June 14, 2020
    Date of Patent: August 23, 2022
    Assignee: Apple Inc.
    Inventors: Sophie Vrzic, Jun Yuan, Mo-Han Fong, Robert Novak, Dong-Sheng Yu, Jianglei Ma
  • Publication number: 20220260931
    Abstract: A method of manufacturing a semiconductor device includes dividing a number of dies along an x axis in a die matrix in each exposure field in an exposure field matrix delineated on the semiconductor substrate, wherein the x axis is parallel to one edge of a smallest rectangle enclosing the exposure field matrix. A number of dies is divided along a y axis in the die matrix, wherein the y axis is perpendicular to the x axis. Sequences SNx0, SNx1, SNx, SNxr, SNy0, SNy1, SNy, and SNyr are formed. p*(Nbx+1)?2 stepping operations are performed in a third direction and first sequence exposure/stepping/exposure operations and second sequence exposure/stepping/exposure operations are performed alternately between any two adjacent stepping operations as well as before a first stepping operation and after a last stepping operation. A distance of each stepping operation in order follows the sequence SNx.
    Type: Application
    Filed: April 29, 2022
    Publication date: August 18, 2022
    Inventors: Shinn-Sheng YU, Ru-Gun LIU, Hsu-Ting HUANG, Kenji YAMAZOE, Minfeng CHEN, Shuo-Yen CHOU, Chin-Hsiang LIN
  • Patent number: 11419221
    Abstract: A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: August 16, 2022
    Assignee: ELEADTK CO., LTD.
    Inventors: Ching-Nan Chang, Sheng-Yu Lin, Ming-Chan Chen
  • Publication number: 20220248389
    Abstract: To effectively and efficiently provide control information, a broadcast pointer channel (BPCH) may be used to identify the type and perhaps relative location of control information that is being provided in a given frame structure, such as a sub-frame, frame, or superframe. A sub-frame (or like framing entity, such a frame or superframe) may have a BPCH and a corresponding system control information segment in which control information may reside. The system control information segment may have any number of control information blocks, wherein each control information block that is present may correspond to a particular type of control information. The BPCH is used to identify the type of control information that is present in a corresponding system control information segment, and if needed or desired, the relative locations of the various control information.
    Type: Application
    Filed: April 21, 2022
    Publication date: August 4, 2022
    Inventors: Mo-Han Fong, Hang Zhang, Sophie Vrzic, Robert Novak, Jun Yuan, Dong-Sheng Yu
  • Patent number: 11398860
    Abstract: Methods and devices are provided for MIMO OFDM transmitter and receivers having odd and/even numbers of transmit antennas. Various methods for pre-coding information bits before space time coding (STC) are described for enabling transmission of information bits over all antennas. Methods of decoding received signals that have been pre-coded and STC coded are also provided by embodiments of the invention. Pilot patterns for downlink and uplink transmission between a base station and one or more wireless terminals for three transmit antenna transmitters are also provided. Variable rate codes are provided that combine various fixed rate codes in a manner that results in codes whose rates are dependent on all the various fixed rate codes that are combined.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: July 26, 2022
    Assignee: Apple Inc.
    Inventors: Mahmoud Taherzadehboroujeni, Hosein Nikopour, Amir Khandani, Wen Tong, Ming Jia, Peiying Zhu, Dong-Sheng Yu, Jianglei Ma
  • Publication number: 20220229968
    Abstract: A method of enhancing a layout pattern includes determining a target layout pattern comprising a disk shape associated with a hole. The method includes defining a polygon having a plurality of vertices on the disk shape. The plurality of vertices coincide with a boundary of the disk shape and the polygon is an initial layout pattern of the hole. The method includes performing an iterative correction of the initial layout pattern. The iterative correction includes projecting the layout pattern of the hole onto a substrate, determining an error between the target layout pattern and the projected layout pattern, and adjusting the layout pattern by moving the vertices of the polygon to generate a next iteration of the layout pattern. The method includes continuing the adjusting, projecting, and determining until a criterion is satisfied and a final iteration of the layout pattern of the hole is generated.
    Type: Application
    Filed: April 4, 2022
    Publication date: July 21, 2022
    Inventor: Shinn-Sheng YU
  • Patent number: 11391317
    Abstract: A suction cup comprises a suction cup member, a press ring, a first housing and an insertion pin. The suction cup member includes an assembly surface and a suction surface. The assembly surface includes a first protrusion having a first cut-out slot formed thereon. The press ring is pressed onto an upper outer edge of the suction cup member. The first housing is pressed onto the press ring and includes a second protrusion for mounting onto the first protrusion. One side of the second protrusion includes a first through hole corresponding to the first cut-out slot to expose the first cut-out slot. The insertion pin partially engages with the first housing and slidably engages with the first through hole and the first cut-out slot to move in the first cut-out slot and to drive the suction cup member to move upward while forming a vacuum space underneath thereof simultaneously.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: July 19, 2022
    Assignees: FREE-FREE(USA) INC, FREE-FREE INDUSTRIAL CORP
    Inventor: Sheng-Yu Liu
  • Publication number: 20220223489
    Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.
    Type: Application
    Filed: March 29, 2022
    Publication date: July 14, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Sheng-Yu CHEN, Chang-Lin YEH, Ming-Hung CHEN
  • Publication number: 20220216134
    Abstract: A manufacturing method for an air bridge structure includes forming a first photoresist structure on a substrate. The first photoresist structure includes a first opening that reveals the substrate. The manufacturing method further includes forming a bridge supporting structure on the substrate by depositing an inorganic bridge supporting material on the substrate based on the first opening in the first photoresist structure, and stripping the first photoresist structure after the deposition. Then, the manufacturing method includes forming a second photoresist structure on the substrate. The second photoresist structure includes at least a second opening that reveals at least a portion of the bridge supporting structure on the substrate. Then, the method include forming the air bridge structure by depositing an air bridge material on the substrate based on the second opening and stripping the second photoresist structure after the deposition. Further, the bridge supporting structure can be removed.
    Type: Application
    Filed: March 24, 2022
    Publication date: July 7, 2022
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Wenlong ZHANG, Chuhong YANG, Sainan HUAI, Yarui ZHENG, Sheng Yu ZHANG, Jiagui FENG, Kanglin XIONG, Biao WU, Yongdan HUANG, Xiao CHEN, Sunan DING
  • Publication number: 20220212644
    Abstract: A hydraulic brake and electronic parking integrated caliper includes a base, a main body movable relative to the base, two brake pads movable relative to the main body, two hydraulic pistons for pushing the brake pads, an electronic drive fixed to the main body, a threaded rod driven by the electronic drive to rotate, and a linearly displacing member displaceable relative to the threaded rod. When moving from a first position to a second position, the linearly displacing member pushes a hydraulic piston and a brake pad toward a direction to press against a brake disc. When moving from the second position to a third position, the linearly displacing member moves the threaded rod, electronic drive and main body toward another direction to make the other hydraulic piston and brake pad press against the brake disc. The caliper has simple structure and generates larger clamping force.
    Type: Application
    Filed: December 15, 2021
    Publication date: July 7, 2022
    Applicant: CCYS HI-TECH INTERNATIONAL LTD.
    Inventor: SHENG-YU WANG
  • Patent number: 11366629
    Abstract: A presentation server establishes a network connection with a presentation device and a client device. The presentation server is able to receive frame data transmitted by the presentation device and pointer coordinates transmitted by the client device. Therefore, the presentation server is able to display a virtual pointer on the presentation frame according to the pointer coordinates, so that the participant can operate the pointing device of the client device to control the virtual pointer so as to participate effectively in the presentation and interact with the speaker.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: June 21, 2022
    Assignee: BARCO N.V.
    Inventors: Hsing Yung Wang, Po-Yuan Yu, Way Lu-Chen, Sheng-Yu Sun, JR-Rong Fan, Hsing-Yu Chen
  • Publication number: 20220183019
    Abstract: A method and system are provided for scheduling data transmission in a Multiple-Input Multiple-Output (MIMO) system. The MIMO system may comprise at least one MIMO transmitter and at least one MIMO receiver. Feedback from one or more receivers may be used by a transmitter to improve quality, capacity, and scheduling in MIMO communication systems. The method may include generating or receiving information pertaining to a MIMO channel metric and information pertaining to a Channel Quality Indicator (CQI) in respect of a transmitted signal; and sending a next transmission to a receiver using a MIMO mode selected in accordance with the information pertaining to the MIMO channel metric, and an adaptive coding and modulation selected in accordance with the information pertaining to the CQI.
    Type: Application
    Filed: February 23, 2022
    Publication date: June 9, 2022
    Inventors: Ming JIA, Jianming WU, Dong-Sheng YU, Peiying ZHU, Wen TONG
  • Patent number: 11334360
    Abstract: The present invention performs high-throughput disassembly for executable code comprising a plurality of instructions. An input of the executable code is received. Exhaustive disassembly is performed on the executable code to produce a set of exhaustively disassembled instructions. An instruction flow graph is constructed from the exhaustively disassembled instructions. Instruction embedding is performed on the exhaustively disassembled instructions to construct embeddings.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: May 17, 2022
    Assignees: DEEPBITS TECHNOLOGY INC., THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Xunchao Hu, Sheng Yu, Heng Yin
  • Patent number: D959951
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: August 9, 2022
    Inventor: Wan-Sheng Yu
  • Patent number: D962432
    Type: Grant
    Filed: June 30, 2018
    Date of Patent: August 30, 2022
    Assignee: A PLUS BIOTECHNOLOGY COMPANY LIMITED
    Inventors: Kai-Hsing Wu, Hsiang-Wei Lo, Kun-Jhih Lin, Ping-Sheng Yu