Abstract: A weight estimation apparatus 1 includes: an impulsive force calculation unit 2 calculating an impulsive force using an acceleration response indicating vibration generated in a structure by the moving object (vehicle 27) moving through the structure, and a weight estimation unit 3 estimating a weight of the moving object using the impulsive force.

Abstract: A heating device using an LED is provided. The heating device includes a heater for heating a target with LED light, an LED controller for controlling power supplied to the LED such that a temperature of the target is adjusted with the power being in the range where a current thereof does not exceed an allowable current Imax, a correction unit for correcting Imax, and a voltage measurement unit for measuring a voltage of the LED. The correction unit estimates a junction temperature Tjm of the LED when Imax is supplied based on a measurement result by the voltage measurement unit when an estimation current Ie is supplied after Imax is supplied to the LED for correction. When Tjm of the LED when Imax is supplied exceeds Tmax corresponding to Imax, the correction unit corrects Imax.

Abstract: A power supply for supplying a power to a heating mechanism used for heating a measurement target that emits a measurement signal includes an input device configured to output an input signal that reflects a control signal in a differentiable periodic waveform having a frequency of 1 kHz or less. The power supply includes a switching amplifier configured to amplify the input signal from the input device and output the amplified signal.

Abstract: There is provided a control method of a test device, the test device comprising a chuck on which an object to be tested is mounted, a tester configured to supply electric power to the object to be tested to test the object to be tested, and a controller configured to control a temperature of the chuck. The control method comprises: when an actual temperature of the object to be tested cannot be fed back, estimating a temperature difference between the temperature of the chuck and the temperature of the object to be tested on the basis of a heat amount of the object to be tested; correcting a target temperature of the chuck on the basis of a target temperature of the object to be tested and the temperature difference; and controlling the temperature of the chuck on the basis of the corrected target temperature of the chuck and an actual temperature of the chuck.

Abstract: A state estimation apparatus 1 includes an acquisition unit 2 that acquires deterioration information indicating a deterioration state of each structural object and a learning unit 3 that learns common information that is common between pieces of the deterioration information and estimation index information that is used for estimating a deterioration state of a target structural object, using the deterioration information as input.

Abstract: A testing device for inspecting an electronic device by causing contact terminals to electrically contact the electronic device, includes: a mounting table formed with a light transmission member opposite the side on which a inspection object is placed and having therein a coolant flow path through which a coolant capable of transmitting light flows; a light irradiation mechanism disposed so as to face the surface opposite the inspection object placement side of the mounting table, and having LEDs pointing toward the inspection object; and a controller controlling absorption of heat by the coolant and heating by the lights from the LEDs to control the temperature of the electronic device to be inspected. The controller controls the light output from the LEDs based on the measured temperature of the electronic device to be inspected and controls the absorption of heat by the coolant based on the LED light output.

Abstract: Disclosed is a method for controlling the temperature of a heater which has a single plate-shaped member formed of a semiconductor substrate, and three or more electrodes formed on a side surface of the single plate-shaped member while being spaced apart from each other in a circumference direction, the method comprising a step for heating the plate-shaped member by supplying a power between the electrodes and sequentially changing the pair of electrodes to which the power is supplied, wherein a period of time in which the power is supplied between the electrodes in the heating step is individually determined for each set of electrodes.

Abstract: A structure diagnosis apparatus 1 for diagnosing a state of a structure in which there is a small change in the natural frequency includes: a natural vibration extraction unit 2 configured to acquire, from a plurality of sensors 21 that a structure is provided with 20, vibration information indicating vibration generated in the structure 20, and extracting natural vibration using the vibration information; a spectral shape extraction unit 3 configured to extract spectral shape information indicating a shape of a spectrum using the natural vibration; an index calculation unit 4 for calculating an index indicating a relationship between the spectral shape information and reference spectral shape information that is a preset reference; and a state estimation unit 5 for estimating the state of the structure based on the index.

Abstract: A bearing diagnosis apparatus 1 that accurately diagnoses the state of a bearing includes: an extraction unit 2 configured to extract a feature amount using first index information indicating a response of a structure 21 to an external force and second index information indicating a response, to the external force, of a bearing 23 provided to the structure 21; and an assessment unit 3 configured to assess the state of the bearing 23 based on the extracted feature amount.

Abstract: There is provided a placement table having an upper surface on which a device to be processed is placed. The placement table comprises: a top plate having a placement surface for the device; a heating unit configured to heat the top plate; a plurality of temperature sensors configured to acquire temperature of the top plate at desired measurement positions in a plan view; and a positioning unit electrically connected to the temperature sensors and configured to position the temperature sensors at the measurement positions in a plan view. The positioning unit is formed of a flexible substrate having flexibility.

Abstract: A diagnosis apparatus 1 including: a target vibration information generation unit 2 that generates pieces of target vibration information; a comparative relationship information generation unit 3 that generates pieces of comparative relationship information indicating relationships among the pieces of target vibration information, or the pieces of comparative relationship information indicating relationships among pieces of reference vibration information and the pieces of target vibration information, the pieces of reference vibration information indicating vibrations in the target mode among vibrations that are measured in a reference period; and a diagnosis unit 5 that diagnoses that a change has occurred in the structure 20 between the diagnosis period and the reference period based on a result of comparison between a distribution of pieces of reference relationship information and the distribution that has been calculated in relation to the pieces of comparative relationship information.

Abstract: A particle radiation therapy apparatus 10 includes: a bed 15 for positioning of a patient 12; irradiation ports 16 (16a, 16b) that output a particle beam in a treatment room 11; a horizontal-direction imaging unit 21 composed of a first X-ray source 25 and a first X-ray detector 26 that face each other with the bed 15 interposed therebetween; a vertical-direction imaging unit 22 composed of a second X-ray source 27 and a second X-ray detector 28 that face each other with the bed 15 interposed therebetween; a storage room 18 for housing the first X-ray detector 26 under the floor when the horizontal-direction imaging unit 21 is not used; and a support member 23 that moves the first X-ray detector 26 above the floor and supports it between the bed 15 and the side of the irradiation ports 16 when the horizontal-direction imaging unit 21 is used.

Abstract: A method for adjusting a temperature of a substrate support is provided. In an apparatus for inspecting a target device, a substrate placement surface of the substrate support is divided into multiple regions and a heater is disposed in each of the multiple regions. The method comprises controlling the heater in a main region corresponding to the target device such that a temperature of the main region becomes a set temperature, and controlling the heater in a sub-region adjacent to the main region. When overshoot has not occurred in the temperature of the main region, the heater in the sub-region is controlled such that a temperature difference between the main region and the sub-region becomes a predetermined value, and when overshoot has occurred, the heater of the sub-region is controlled such that a difference between the set temperature and the temperature in the sub-region becomes the predetermined value.

Abstract: Provided is an electronic device inspection apparatus that suppresses cost increase. A prober is provided with a stage on which a carrier or a wafer is placed. The stage is provided with a stage cover on which the carrier is placed, a cooling unit in contact with the stage cover, and an LED irradiation unit facing the carrier across the stage cover and the cooling unit. Each of the stage cover and the cooling unit is formed of light-transmitting material. A light-transmitting coolant flows in a coolant flow path in the cooling unit. The LED irradiation unit has a plurality of LEDs oriented to the carrier. The carrier is formed of a glass substrate having a substantially disk-like shape. A plurality of electronic devices is arranged on a surface of the carrier at predetermined intervals.

Abstract: In an inspection apparatus for inspecting an inspection target device formed on an inspection object, the inspection target device is a back-illuminated imaging device into which light is incident from a rear surface opposite to a side of a wiring layer. The inspection apparatus includes a stage having the inspection object placed such that the inspection object faces the rear surface. The stage includes a light transmitter made of a light-transmissive material. The inspection object is placed on the light transmitter below which a light illuminator is disposed. The light illuminator includes a flat light guide plate having a facing surface facing the inspection object. A light source is provided laterally outside the light guide plate configured to diffuse light emitted from the light source incident from a side end surface of the light guide plate, and to emit the light as planar light from the facing surface.

Abstract: An inspection apparatus for inspecting a backside irradiation type imaging device formed on an inspection object includes: a stage on which the inspection object is mounted such that the stage faces a rear surface of the backside irradiation type imaging device, wherein the stage includes: a transmitter including a flat plate formed of a light transmitting material, and configured to mount the inspection object on the transmitter; and a light emitter disposed at a location facing the inspection object with the transmitter interposed between the light emitter and the inspection object, and configured to emit light toward the transmitter, and wherein the transmitter transmits the light from the light emitter while diffusing the light.

Abstract: A temperature control device for controlling a temperature of an object, the temperature control device includes a heater having a heating source configured to heat the object, a cooler having a cooling source configured to cool the object; and a temperature controller configured to control the heating source and the cooling source. The temperature controller includes a sliding mode controller configured to supply power to the heating source as an operation amount, a cooling mode controller configured to supply power to the cooling source as an operation amount, and a switching controller configured to determine whether an output of the sliding mode controller will be output to the heating source as a first operation amount, or an output of the cooling mode controller will be used as a second operation amount, based on a nonlinear term value of the output of the sliding mode controller.

Abstract: A diagnosis apparatus 1 includes: a generation unit 2 configured to acquire vibration information indicating vibration produced in a structure 20 from a plurality of sensors 21 provided to the structure 20, and to generate, using the vibration information, natural vibration mode information indicating a natural vibration mode shape; an occurrence rate calculation unit 3 configured to calculate a rate of occurrence of a normal natural vibration mode shape based on the number of times vibration was applied to the structure 20 and the number of times the normal natural vibration mode shape was generated when the vibration was applied; and a diagnosis unit 4 configured to diagnose whether or not repair and reinforcement performed on the structure were effective based on the rate of occurrence and a reference value.

Abstract: A prober includes: a stage that places a substrate formed with a plurality of chips thereon in a matrix; a contact that sequentially contacts with electrode pads of the plurality of chips thereby performing an inspection on electrical characteristic of the plurality of chips; a plurality of LED units provided on a side opposite to a placing surface of the stage so as to independently heat a plurality of areas where the plurality of chips are located, respectively, and each including one or a plurality of LEDs; and a controller that outputs a control signal to drive, among the plurality of LED units, at least an LED unit corresponding to an area of a chip to be inspected, among the area of the chip to be inspected and peripheral areas of the corresponding area.

Abstract: A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.