Patents by Inventor Shih-Ming Chen

Shih-Ming Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200369512
    Abstract: The present disclosure relates to a method of manufacturing a MEMS device. In some embodiments, a first interlayer dielectric layer is formed over a substrate, and a diaphragm is formed over the first interlayer dielectric layer. Then, a second interlayer dielectric layer is formed over the diaphragm. A first etch is performed to form an opening through the second interlayer dielectric layer and the diaphragm and reaching into an upper portion of the first interlayer dielectric layer. A second etch is performed to the first interlayer dielectric layer and the second interlayer dielectric layer to form recesses above and below the diaphragm and to respectively expose a portion of a top surface and a portion of a bottom surface of the diaphragm. A sidewall stopper is formed along a sidewall of the diaphragm into the recesses of the first interlayer dielectric layer and the second interlayer dielectric layer.
    Type: Application
    Filed: August 11, 2020
    Publication date: November 26, 2020
    Inventors: Shih-Wei Lin, Chang-Ming Wu, Ting-Jung Chen
  • Publication number: 20200369511
    Abstract: The present disclosure relates to a microphone. In some embodiments, the microphone may comprise a diaphragm, a backplate, and a sidewall stopper. The diaphragm has a venting hole disposed therethrough. The backplate is disposed over and spaced apart from the diaphragm. The sidewall stopper is disposed along a sidewall of the diaphragm exposing to the venting hole. Thus, the sidewall stopper is not limited by a distance between the movable part and the stable part of the microphone. Also, the sidewall stopper does not alternate the shape of movable part, and thus will less likely introduce crack to the movable part. In some embodiments, the sidewall stopper may be formed like a sidewall stopper by a self-alignment process, such that no extra mask is needed.
    Type: Application
    Filed: August 11, 2020
    Publication date: November 26, 2020
    Inventors: Shih-Wei Lin, Chang-Ming Wu, Ting-Jung Chen
  • Patent number: 10842229
    Abstract: A pressure fixing device applied to a shoe is disclosed. The pressure fixing device includes an inflatable shoe tongue, a first air pump and a control module. The control module drives the air to flow out of the inflatable shoe tongue according to a second enabling signal so that the inflatable shoe tongue tends to shrink and moves toward the wear space to attach to a user's instep. The control module drives the first air pump to pump the air flowing into the inflatable shoe tongue according to a first enabling signal, so that the inflatable shoe tongue tends to expand due to the air inflated and moves away from the wear space to enlarge the opening, by which the user can wear or take off the shoe easily.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: November 24, 2020
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Li-Pang Mo, Shih-Chang Chen, Yung-Lung Han, Wei-Ming Lee
  • Patent number: 10847460
    Abstract: Examples of an integrated circuit a having an advanced two-dimensional (2D) metal connection with metal cut and methods of fabricating the same are provided. An example method for fabricating a conductive interconnection layer of an integrated circuit may include: patterning a conductive connector portion on the conductive interconnection layer of the integrated circuit using extreme ultraviolet (EUV) lithography, wherein the conductive connector portion is patterned to extend across multiple semiconductor structures in a different layer of the integrated circuit; and cutting the conductive connector portion into a plurality of conductive connector sections, wherein the conductive connector portion is cut by removing conductive material from the metal connector portion at one or more locations between the semiconductor structures.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: November 24, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Kam-Tou Sio, Ru-Gun Liu, Shun Li Chen, Shih-Wei Peng, Tien-Lu Lin
  • Patent number: 10833061
    Abstract: Gate structures extending continuously above a first active region, a second active region and a non-active region of a substrate of a semiconductor structure are arranged. At least one local interconnect over the non-active region and between two of the gate structures is selectively arranged, to couple at least one of contacts that is arranged above the first active region to at least one of the contacts that is arranged above the second active region.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: November 10, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Charles Chew-Yuen Young, Chih-Liang Chen, Chih-Ming Lai, Jiann-Tyng Tzeng, Shun-Li Chen, Kam-Tou Sio, Shih-Wei Peng, Chun-Kuang Chen, Ru-Gun Liu
  • Patent number: 10816892
    Abstract: In a method of manufacturing a photo mask for lithography, circuit pattern data are acquired. A pattern density, which is a total pattern area per predetermined area, is calculated from the circuit pattern data. Dummy pattern data for areas having pattern density less than a threshold density are generated. Mask drawing data is generated from the circuit pattern data and the dummy pattern data. By using an electron beam from an electron beam lithography apparatus, patterns are drawn according to the mask drawing data on a resist layer formed on a mask blank substrate. The drawn resist layer is developed using a developing solution. Dummy patterns included in the dummy pattern data are not printed as a photo mask pattern when the resist layer is exposed with the electron beam and is developed.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: October 27, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chien-Cheng Chen, Chia-Jen Chen, Hsin-Chang Lee, Shih-Ming Chang, Tran-Hui Shen, Yen-CHeng Ho, Chen-Shao Hsu
  • Publication number: 20200318633
    Abstract: A micro piezoelectric pump module includes a microprocessor, a driving element, and a piezoelectric pump. The driving element is connected to the microprocessor to receive a modulating signal and a control signal and to output a driving signal. The driving signal includes a driving voltage and a driving frequency. The piezoelectric pump is actuated by the driving signal, and the piezoelectric pump is set to be actuated at an actuation frequency and be applied with an actuation voltage value. The microprocessor drives the driving element to output the driving voltage having an initial voltage value at the driving frequency to the piezoelectric pump, and adjusts the driving frequency to the same with the actuation frequency. After the driving frequency is adjusted to reach the actuation frequency, the microprocessor drives the driving element to gradually increase the initial voltage value to reach the actuation voltage value.
    Type: Application
    Filed: March 30, 2020
    Publication date: October 8, 2020
    Inventors: Hao-Jan Mou, Shen-Wen Chen, Shih-Chang Chen, Chi-Feng Huang, Yung-Lung Han, Wei-Ming Lee, Chun-Yi Kuo
  • Publication number: 20200312817
    Abstract: A three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is bonded to a first IC die by a first bonding structure. A third IC die is bonded to the second IC die by a second bonding structure. The second bonding structure is arranged between back sides of the second IC die and the third IC die opposite to corresponding interconnect structures and comprises a first TSV (through substrate via) disposed through a second substrate of the second IC die and a second TSV disposed through a third substrate of the third IC die. The second bonding structure further comprises conductive features with oppositely titled sidewalls disposed between the first TSV and the second TSV.
    Type: Application
    Filed: June 16, 2020
    Publication date: October 1, 2020
    Inventors: Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao, Yung-Lung Lin, Shih-Han Huang, I-Nan Chen
  • Patent number: 10786011
    Abstract: An electronic cigarette includes a power supply device, an atomizer, a liquid storage structure, a fluid transportation device, a casing and a mouthpiece. The atomizer includes an electric heater and a liquid conduit. The electric heater is disposed around liquid conduit. The liquid storage structure includes a liquid container for storing cigarette liquid. The fluid transportation device includes an input channel in communication with the liquid container and an output channel in communication with the liquid conduit. The cigarette liquid is transferred to the liquid conduit through the fluid transportation device at a certain amount. Consequently, an atomized vapor is generated. The casing has an inlet in communication with the atomizer through an airflow chamber. The inlet and the airflow chamber form an airflow path for an airflow to pass through. The mouthpiece is located at an end of the casing and in communication with the airflow path.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: September 29, 2020
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Li-Pang Mo, Shih-Chang Chen, Chi-Feng Huang, Yung-Lung Han, Wei-Ming Lee, Chia-Hao Chang
  • Publication number: 20200303351
    Abstract: A method for manufacturing three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is formed and bonded to a first IC die by a first bonding structure. A third IC die is formed and bonded to the second IC die by a second bonding structure. The second bonding structure is formed between back sides of the second IC die and the third IC die opposite to corresponding interconnect structures and comprises a first TSV (through substrate via) disposed through a second substrate of the second IC die and a second TSV disposed through a third substrate of the third IC die. In some further embodiments, the second bonding structure is formed by forming conductive features with oppositely titled sidewalls disposed between the first TSV and the second TSV.
    Type: Application
    Filed: June 9, 2020
    Publication date: September 24, 2020
    Inventors: Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao, Yung-Lung Lin, Shih-Han Huang, I-Nan Chen
  • Patent number: 10772379
    Abstract: A dynamic pressure controlled air cushion device disposed on a bottom part of a shoe comprises a first air bag and a second air bag communicated with each other through an air passage, and the first air bag and the second air bag are respectively disposed corresponding to a front foot sole and a rear foot sole of a user.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: September 15, 2020
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Li-Pang Mo, Shih-Chang Chen, Yung-Lung Han, Wei-Ming Lee
  • Patent number: 10774824
    Abstract: A miniature fluid control device for transporting gas is disclosed, which includes a gas inlet plate, a resonance plate, a piezoelectric actuator and a gas collecting plate stacked on each other. The gas inlet plate includes at least one inlet, at least one convergence channel and a circular cavity which forms a convergence chamber. The resonance plate has a central aperture. The piezoelectric actuator includes a suspension plate, an outer frame and a piezoelectric plate, wherein the suspension plate has a cylindrical bulge aligned with the circular cavity. The ratio of a second diameter of the cylindrical bulge to a first diameter of the circular cavity is set in a specified range to optimize the gas pressure of the transported gas, thus assuring efficiency of gas transmission of the miniature fluid control device.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: September 15, 2020
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hung-Hsin Liao, Shih-Chang Chen, Jia-Yu Liao, Yung-Lung Han, Chi-Feng Huang, Wei-Ming Lee
  • Patent number: 10777466
    Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin on a substrate, a second fin on the substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes an insulating liner and a fill material on the insulating liner. The insulating liner abuts a first sidewall of the first fin and a second sidewall of the second fin. The insulating liner includes a material with a band gap greater than 5 eV.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: September 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Wen Huang, Chia-Hui Lin, Jaming Chang, Jei Ming Chen, Kai Hung Cheng
  • Patent number: 10766763
    Abstract: The present disclosure relates to a microphone. In some embodiments, the microphone may comprise a substrate, a diaphragm, a backplate, and a sidewall stopper. The substrate has an opening disposed through the substrate. The diaphragm is disposed over the substrate and facing the opening of the substrate. The diaphragm has a venting hole overlying the opening of the substrate. A backplate is disposed over and spaced apart from the diaphragm. A sidewall stopper is disposed along a sidewall of the venting hole of the diaphragm and thus is not limited by a distance between the movable part and the stable part. Also, the sidewall stopper does not alternate the shape of movable part, and thus will less likely introduce crack to the movable part. In some embodiments, the sidewall stopper may be formed like a sidewall stopper by a self-alignment process, such that no extra mask is needed.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: September 8, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Wei Lin, Chang-Ming Wu, Ting-Jung Chen
  • Patent number: 10752673
    Abstract: Disclosed herein are methods for high-throughput screening of a functional antibody fragment for an immunoconjugate that targets a protein antigen. The method combines a phage-displayed synthetic antibody library and high-throughput cytotoxicity screening of non-covalently assembled immunotoxins or cytotoxic drug to identify highly functional synthetic antibody fragments for delivering toxin payloads.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: August 25, 2020
    Assignee: ACADEMIA SINICA
    Inventors: An-Suei Yang, Hong-Sen Chen, Chung-Ming Yu, Shin-Chen Hou, Wei-Ying Kuo, Yi-Kai Chiu, Yueh-Liang Tsou, Hung-Ju Hsu, Hwei-Jiung Wang, Shih-Hsien Chuang, Chao-Pin Lee
  • Patent number: 10751970
    Abstract: A three-dimensional structure includes a plate and a three-dimensional component disposed on the plate. The three-dimensional component contains at least one first structure and at least one second structure. The first structure is an auxetic structure, and the second structure is different from the first structure. The at least one first structure and the at least one second structure are provided layer by layer along a thickness direction of the plate on the plate.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: August 25, 2020
    Assignee: Industrial Technology Research Institute
    Inventors: Jih-Hsiang Yeh, Yu-Tsung Chiu, Shih-Ming Chen, Chih-Kang Peng
  • Publication number: 20200266274
    Abstract: A semiconductor device includes an epitaxial straining region formed within a semiconductor substrate, the straining region being positioned adjacent to a gate stack, the gate stack being positioned above a channel. The straining region comprises a defect comprising two crossing dislocations such that a cross-point of the dislocations is closer to a bottom of the straining region than to a top of the straining region. The straining region comprises an element with a smaller lattice constant than a material forming the substrate.
    Type: Application
    Filed: May 4, 2020
    Publication date: August 20, 2020
    Inventors: Hsiu-Ting Chen, Yi-Ming Huang, Shih-Chieh Chang, Hsing-Chi Chen, Pei-Ren Jeng
  • Patent number: 10740122
    Abstract: A system module applied to the machine controller for simulating a machine operation screen based on a non-invasive data-extraction system, is disclosed. An image capture device of the system module can receive an original operation screen outputted from the machine controller, and transmit the original operation screen to the non-invasive data-extraction system and a high-speed image process unit for extraction of the information shown on the operation screen. The software control system can extract the operational information of the machine controller in real time, to create a machine operation flow for generating a simulated machine operation screen which is then outputted to a screen of the machine controller. As a result, the site working staff can be provided with operational information associated with the machine in real time, for example, the operational information includes currently executed operation screen, position of mouse cursor and pop-up window detection result.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: August 11, 2020
    Assignee: Adlink Technology Inc.
    Inventors: Chua-Hong Ng, Chao-Tung Yang, Wei-Hung Chen, Tsan-Ming Yu, Shih-Hsun Lin, Yang-Chung Tseng, Chih-Fu Hsu, Chien-Hsun Tu, Ren-Yu Wu, Chieh-Yuan Lo, Chih-Kai Shiao, Hsiao-Ling Chang, Te-Cheng Tseng, Chun-Liang Chen
  • Patent number: 10732738
    Abstract: A system module of customizing a screen image based on a non-invasive data-extraction system, and a method thereof are disclosed. The system module is applicable to a machine controller controlling a machine, and sensors are disposed around the machine. In the system module, an image capture device receives an image of an original screen from the machine controller, and transmits the image to the non-invasive data-extraction system for extracting information, and a software control system integrates data measured by the sensors with the information, and combined the integration result with a customized screen image, and an extra control component is embedded in an original operation screen of the machine controller. The customized screen image is shown on the machine controller to display information by more visual manner. Furthermore, the signal receiving device and an HID simulation device can be used to provide a basic function of a KVM switch.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: August 4, 2020
    Assignee: Adlink Technology Inc.
    Inventors: Chua-Hong Ng, Chao-Tung Yang, Wei-Hung Chen, Tsan-Ming Yu, Shih-Hsun Lin, Yang-Chung Tseng, Chih-Fu Hsu, Chien-Hsun Tu, Te-Cheng Chiu, Yi-Wei Lin, Jen-Chi Hsu
  • Patent number: D894850
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: September 1, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Chun-Fu Tsai, Yao-Ning Chan, Yi-Tang Lai, Yi-Ming Chen, Shih-Chang Lee