Patents by Inventor Shih-Ming Chen

Shih-Ming Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12161748
    Abstract: A topical formulation comprising (a) a therapeutically effective amount of tofacitinib; (b) at least one solvent; and (c) optionally one or more other pharmaceutically acceptable excipients is provided. Also provided is a method for treating and/or preventing autoimmune diseases in a subject administering said topical formulation.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: December 10, 2024
    Assignee: TWI BIOTECHNOLOGY, INC.
    Inventors: Chih-Ming Chen, Guang-Wei Lu, Ling-Ying Liaw, Fan-Lun Liu, Shih-Fen Liao, Chou-Hsiung Chen, Yu-Han Kao, Yu-Yin Chen
  • Publication number: 20240404871
    Abstract: Methods for forming a dielectric isolation region between two active regions are disclosed herein. A mandrel is formed on a substrate, then etched to form a trench. Spacers are formed on the sidewalls of the mandrel. The mandrel is removed, and the substrate is etched to form fins extending in a first direction in the two active regions, and of fins extending in a second direction. A mask is formed that exposes the substrate between the fins extending in the second direction. The substrate is etched to form a trench. The trench is filled with a dielectric material up to the top of the fins to form the dielectric isolation region. The methods provide better depth control during etching between the two active regions, and also permit the trench to extend deeper into the substrate due to reduced depth/width ratios during the etching steps.
    Type: Application
    Filed: June 2, 2023
    Publication date: December 5, 2024
    Inventors: Wei Che Tsai, Yuan Tsung Tsai, Hsin-Yi Tsai, Ying Ming Wang, Hsien Hua Tseng, Shih-Hao Chen
  • Patent number: 12158156
    Abstract: A ceiling fan infrared detection and control system has a wall-mounted controller, a ceiling fan controller, and a motor. The wall-mounted controller has an infrared sensor that is arranged outwardly and horizontally. The wall-mounted controller is pivotally equipped with a lens outside the infrared sensor for detecting infrared rays of a human body within a detection range. The control unit can output a wireless signal to the ceiling fan controller to control the motor according to the infrared detection result. The ceiling fan infrared detection and control system uses the technical feature that the lens is rotatable relative to the wall-mounted controller, so that the detection range can be moved synchronously along with the lens. The detection range has directivity and the function of adjusting the detection position, which can avoid false detection of a pet below the height of the detection range.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: December 3, 2024
    Assignee: AIR COOL INDUSTRIAL CO., LTD.
    Inventor: Shih-Ming Chen
  • Patent number: 12152917
    Abstract: A flow meter includes a meter body and a pressure sensor. The meter body has a liquid impact surface, a sensing surface opposite to the liquid impact surface, and a mounting hole extending from the sensing surface toward the liquid impact surface. The mounting hole is a blind hole. The pressure sensor is mounted in the mounting hole, and has a resistance value that can be measured and that can be changed correspondingly with a change in liquid pressure caused by a change in flow rate. A device for producing an active hydroxyl free radical solution is also disclosed.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: November 26, 2024
    Inventors: Shih-Chin Chou, Teng-Kang Chang, Chun-Ming Chen
  • Publication number: 20240387534
    Abstract: A semiconductor device according to the present disclosure includes a bottom dielectric feature on a substrate, a plurality of channel members directly over the bottom dielectric feature, a gate structure wrapping around each of the plurality of channel members, two first epitaxial features sandwiching the bottom dielectric feature along a first direction, and two second epitaxial features sandwiching the plurality of channel members along the first direction.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Inventors: Huan-Chieh Su, Li-Zhen Yu, Chun-Yuan Chen, Shih-Chuan Chiu, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang
  • Publication number: 20240387362
    Abstract: A semiconductor device includes a semiconductor substrate, an interconnection layer and an inductor pattern. The interconnection layer is disposed on the semiconductor substrate. The inductor pattern is electrically connected to the interconnection layer. The inductor pattern includes a first conductive line joined with a first terminal, a second conductive line joined with a second terminal, and a plurality of conductive coils. The conductive coils are joining the first conductive line to the second conductive line, and includes an outer coil joined with the first conductive line, an inner coil joined with the second conductive line and the outer coil. The second conductive line is spaced apart from a first side of the inner coil in a first direction by distance Y, the second terminal is spaced apart from a second side of the inner coil in a second direction by distance X1, wherein X1>1.25Y.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Hsien Lai, Shih-Ming Chen, Han-Chang Hsieh
  • Patent number: 12148805
    Abstract: A semiconductor structure includes an epitaxial region having a front side and a backside. The semiconductor structure includes an amorphous layer formed over the backside of the epitaxial region, wherein the amorphous layer includes silicon. The semiconductor structure includes a first silicide layer formed over the amorphous layer. The semiconductor structure includes a first metal contact formed over the first silicide layer.
    Type: Grant
    Filed: August 9, 2023
    Date of Patent: November 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Chuan Chiu, Huan-Chieh Su, Pei-Yu Wang, Cheng-Chi Chuang, Chun-Yuan Chen, Li-Zhen Yu, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang
  • Publication number: 20240381608
    Abstract: A transistor includes a gate structure that has a first gate dielectric layer and a second gate dielectric layer. The first gate dielectric layer is disposed over the substrate. The first gate dielectric layer contains a first type of dielectric material that has a first dielectric constant. The second gate dielectric layer is disposed over the first gate dielectric layer. The second gate dielectric layer contains a second type of dielectric material that has a second dielectric constant. The second dielectric constant is greater than the first dielectric constant. The first dielectric constant and the second dielectric constant are each greater than a dielectric constant of silicon oxide.
    Type: Application
    Filed: July 23, 2024
    Publication date: November 14, 2024
    Inventors: Chih-Yu Hsu, Jian-Hao Chen, Chia-Wei Chen, Shan-Mei Liao, Hui-Chi Chen, Yu-Chia Liang, Shih-Hao Lin, Kuei-Lun Lin, Kuo-Feng Yu, Feng-Cheng Yang, Yen-Ming Chen
  • Publication number: 20240373136
    Abstract: This document describes methods and systems for a hybrid white balance, HWB, mode (114), which is a hybrid of automatic and manual WB modes, in a camera system (104) of an electronic device (102). The HWB mode may provide options for a user to select a WB setting, via a camera user interface (118) in a live-preview mode (110), along a continuous WB-adjustment range. In this way, the user's desired color can be applied with respect to images or video captured by the camera system. The camera UI includes a manual WB control (112) to manually adjust the white balance. A WB module (108) determines target WB gains corresponding to the manual WB control relative to an initial automatic WB decision for a current frame displayed in the live-preview mode of the camera application. In aspects, a look-up-table correlating to the manual WB control is used to compute the target WB gains.
    Type: Application
    Filed: May 20, 2021
    Publication date: November 7, 2024
    Inventors: Liang Liang, Michelle Y. Chen, Isaac William Reynolds, Shih-Ming Wang
  • Publication number: 20240364332
    Abstract: A CMOS data clearing circuit is provided. The CMOS data clearing circuit is configured to clear CMOS data of a main board of an electronic device. The electronic device includes a control chip and a pin header. The CMOS data clearing circuit includes a controller and a connection port. The controller generates a pulse signal and an operation signal. The connection port has an input pin and an output pin. The output pin is coupled to a first pin of the pin header. The connection port connects the input pin to the output pin in response to the operation signal, so as to transmit the pulse signal to the first pin of the pin header via the output pin. The control chip clears the CMOS data of the main board according to the pulse signal received by the first pin.
    Type: Application
    Filed: February 29, 2024
    Publication date: October 31, 2024
    Applicant: ASRock Industrial Computer Corporation
    Inventors: Yu-Lin Lai, Yu-Tso Chen, Shih-Ming Lin
  • Publication number: 20240355784
    Abstract: A three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, the 3D IC comprises a first IC die comprising a first substrate, a first interconnect structure disposed over the first substrate, and a first through substrate via (TSV) disposed through the first substrate. The 3D IC further comprises a second IC die comprising a second substrate, a second interconnect structure disposed over the second substrate, and a second TSV disposed through the second substrate. The 3D IC further comprises a bonding structure arranged between back sides of the first IC die and the second IC die opposite to corresponding interconnect structures and bonding the first IC die and the second IC die. The bonding structure comprises conductive features disposed between and electrically connecting the first TSV and the second TSV.
    Type: Application
    Filed: June 28, 2024
    Publication date: October 24, 2024
    Inventors: Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao, Yung-Lung Lin, Shih-Han Huang, I-Nan Chen
  • Patent number: 12125852
    Abstract: A semiconductor device according to the present disclosure includes a bottom dielectric feature on a substrate, a plurality of channel members directly over the bottom dielectric feature, a gate structure wrapping around each of the plurality of channel members, two first epitaxial features sandwiching the bottom dielectric feature along a first direction, and two second epitaxial features sandwiching the plurality of channel members along the first direction.
    Type: Grant
    Filed: July 28, 2023
    Date of Patent: October 22, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Huan-Chieh Su, Li-Zhen Yu, Chun-Yuan Chen, Shih-Chuan Chiu, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang
  • Patent number: 12125956
    Abstract: A semiconductor device is provided, which includes a semiconductor stack and a first contact structure. The semiconductor stack includes an active layer and has a first surface and a second surface. The first contact structure is located on the first surface and includes a first semiconductor layer, a first metal element-containing structure and a first p-type or n-type layer. The first metal element-containing structure includes a first metal element. The first p-type or n-type layer physically contacts the first semiconductor layer and the first metal element-containing structure. The first p-type or n-type layer includes an oxygen element (O) and a second metal element and has a thickness less than or equal to 20 nm, and the first semiconductor layer includes a phosphide compound or an arsenide compound.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: October 22, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Yu-Tsu Lee, Yi-Yang Chiu, Chun-Wei Chang, Min-Hao Yang, Wei-Jen Hsueh, Yi-Ming Chen, Shih-Chang Lee, Chung-Hao Wang
  • Publication number: 20240341061
    Abstract: A charging device includes a liquid cooled cable, a charging gun, a charging station, a station connector and a communicating pipe. The liquid cooled cable has a gun end and a station end. The liquid cooled cable includes a first insulating tube, a second insulating tube, a tape, a filler and a sheath. The first insulating tube has a first channel. The second insulating tube has a second channel and a braided copper mesh. The charging gun is connected to the gun end of the liquid cooled cable. The charging gun includes a gun connector and a first liquid return channel. The station connector includes a second liquid return channel and a connection part. One end of the second liquid return channel communicates to the second channel. The connection part is connected to the station end of the liquid cooled cable.
    Type: Application
    Filed: May 9, 2023
    Publication date: October 10, 2024
    Inventors: Ko-Ming CHEN, Duan-Yih LIN, Cheng-Hong CHEN, Shih-Wei WANG, Shih-Hsiang WANG
  • Publication number: 20240337951
    Abstract: In a method of manufacturing a photo mask for lithography, circuit pattern data are acquired. A pattern density, which is a total pattern area per predetermined area, is calculated from the circuit pattern data. Dummy pattern data for areas having pattern density less than a threshold density are generated. Mask drawing data is generated from the circuit pattern data and the dummy pattern data. By using an electron beam from an electron beam lithography apparatus, patterns are drawn according to the mask drawing data on a resist layer formed on a mask blank substrate. The drawn resist layer is developed using a developing solution. Dummy patterns included in the dummy pattern data are not printed as a photo mask pattern when the resist layer is exposed with the electron beam and is developed.
    Type: Application
    Filed: June 17, 2024
    Publication date: October 10, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Cheng CHEN, Chia-Jen CHEN, Hsin-Chang LEE, Shih-Ming CHANG, Tran-Hui SHEN, Yen-Cheng HO, Chen-Shao HSU
  • Publication number: 20240309442
    Abstract: The disclosure relates to methods for determining an endometrial status using a sample, for example, an endometrial biopsy, from a woman, comprising: (a) performing an assay on the endometrial sample from the woman to determine a microRNA (miRNA) expression profile of the endometrial sample, wherein the miRNA expression profile comprises expression levels of a plurality of miRNAs, for example, 167 miRNAs having the sequences of SEQ ID NOs:1-167, respectively; and (b) analyzing the miRNA expression profile to obtain a receptivity predictive score using, for example, a computer-based algorithm. Aspects of the disclosure further relate to kits suitable for performing the methods, as well as uses of the kits for diagnostic and therapeutic purposes.
    Type: Application
    Filed: June 5, 2024
    Publication date: September 19, 2024
    Applicant: Inti Taiwan, Inc.
    Inventors: Shih-Ting Kang, Wei-Ming Chen
  • Patent number: 12085768
    Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: September 10, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shih-Chieh Tang, Lu-Ming Lai, Yu-Che Huang, Ying-Chung Chen
  • Publication number: 20240291985
    Abstract: Video processing methods and apparatuses in a video encoding or decoding system. A method receives input data associated with a current block in a current picture, determines if the current block is an out-of-bounds node, wherein the out-of-bounds node is a coding tree node of the current picture with a block region across a current picture boundary, and determines whether the current block is larger than a predefined size. The method further determines an inferred splitting type if the current block is an out-of-bounds node and the current block is larger than the predefined size and applies the inferred splitting type to split the current block into child blocks if the current block is an out-of-bounds node and the current block is larger than the predefined size, and then adaptively splitting each child block into one or more leaf blocks.
    Type: Application
    Filed: May 9, 2024
    Publication date: August 29, 2024
    Inventors: Chia-Ming TSAI, Chih-Wei HSU, Tzu-Der CHUANG, Ching-Yeh CHEN, Yu-Wen HUANG, Shih-Ta HSIANG
  • Patent number: 12074206
    Abstract: A device includes a semiconductor substrate, a fin structure on the semiconductor substrate, a gate structure on the fin structure, and a pair of source/drain features on both sides of the gate structure. The gate structure includes an interfacial layer on the fin structure, a gate dielectric layer on the interfacial layer, and a gate electrode layer of a conductive material on and directly contacting the gate dielectric layer. The gate dielectric layer includes nitrogen element.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: August 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Wei Chen, Chih-Yu Hsu, Hui-Chi Chen, Shan-Mei Liao, Jian-Hao Chen, Cheng-Hao Hou, Huang-Chin Chen, Cheng Hong Yang, Shih-Hao Lin, Tsung-Da Lin, Da-Yuan Lee, Kuo-Feng Yu, Feng-Cheng Yang, Chi On Chui, Yen-Ming Chen
  • Publication number: 20240282638
    Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin on a substrate, a second fin on the substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes an insulating liner and a fill material on the insulating liner. The insulating liner abuts a first sidewall of the first fin and a second sidewall of the second fin. The insulating liner includes a material with a band gap greater than 5 eV.
    Type: Application
    Filed: April 16, 2024
    Publication date: August 22, 2024
    Inventors: Shih-Wen Huang, Jaming Chang, Kai Hung Cheng, Chia-Hui Lin, Jei Ming Chen