Shih-Ming Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: The present disclosure relates to a method of manufacturing a MEMS device. In some embodiments, a first interlayer dielectric layer is formed over a substrate, and a diaphragm is formed over the first interlayer dielectric layer. Then, a second interlayer dielectric layer is formed over the diaphragm. A first etch is performed to form an opening through the second interlayer dielectric layer and the diaphragm and reaching into an upper portion of the first interlayer dielectric layer. A second etch is performed to the first interlayer dielectric layer and the second interlayer dielectric layer to form recesses above and below the diaphragm and to respectively expose a portion of a top surface and a portion of a bottom surface of the diaphragm. A sidewall stopper is formed along a sidewall of the diaphragm into the recesses of the first interlayer dielectric layer and the second interlayer dielectric layer.
Abstract: The present disclosure relates to a microphone. In some embodiments, the microphone may comprise a diaphragm, a backplate, and a sidewall stopper. The diaphragm has a venting hole disposed therethrough. The backplate is disposed over and spaced apart from the diaphragm. The sidewall stopper is disposed along a sidewall of the diaphragm exposing to the venting hole. Thus, the sidewall stopper is not limited by a distance between the movable part and the stable part of the microphone. Also, the sidewall stopper does not alternate the shape of movable part, and thus will less likely introduce crack to the movable part. In some embodiments, the sidewall stopper may be formed like a sidewall stopper by a self-alignment process, such that no extra mask is needed.
Abstract: A pressure fixing device applied to a shoe is disclosed. The pressure fixing device includes an inflatable shoe tongue, a first air pump and a control module. The control module drives the air to flow out of the inflatable shoe tongue according to a second enabling signal so that the inflatable shoe tongue tends to shrink and moves toward the wear space to attach to a user's instep. The control module drives the first air pump to pump the air flowing into the inflatable shoe tongue according to a first enabling signal, so that the inflatable shoe tongue tends to expand due to the air inflated and moves away from the wear space to enlarge the opening, by which the user can wear or take off the shoe easily.
Abstract: Examples of an integrated circuit a having an advanced two-dimensional (2D) metal connection with metal cut and methods of fabricating the same are provided. An example method for fabricating a conductive interconnection layer of an integrated circuit may include: patterning a conductive connector portion on the conductive interconnection layer of the integrated circuit using extreme ultraviolet (EUV) lithography, wherein the conductive connector portion is patterned to extend across multiple semiconductor structures in a different layer of the integrated circuit; and cutting the conductive connector portion into a plurality of conductive connector sections, wherein the conductive connector portion is cut by removing conductive material from the metal connector portion at one or more locations between the semiconductor structures.
September 25, 2019
Date of Patent:
November 24, 2020
Taiwan Semiconductor Manufacturing Company Limited
Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Kam-Tou Sio, Ru-Gun Liu, Shun Li Chen, Shih-Wei Peng, Tien-Lu Lin
Abstract: Gate structures extending continuously above a first active region, a second active region and a non-active region of a substrate of a semiconductor structure are arranged. At least one local interconnect over the non-active region and between two of the gate structures is selectively arranged, to couple at least one of contacts that is arranged above the first active region to at least one of the contacts that is arranged above the second active region.
Abstract: In a method of manufacturing a photo mask for lithography, circuit pattern data are acquired. A pattern density, which is a total pattern area per predetermined area, is calculated from the circuit pattern data. Dummy pattern data for areas having pattern density less than a threshold density are generated. Mask drawing data is generated from the circuit pattern data and the dummy pattern data. By using an electron beam from an electron beam lithography apparatus, patterns are drawn according to the mask drawing data on a resist layer formed on a mask blank substrate. The drawn resist layer is developed using a developing solution. Dummy patterns included in the dummy pattern data are not printed as a photo mask pattern when the resist layer is exposed with the electron beam and is developed.
Abstract: A micro piezoelectric pump module includes a microprocessor, a driving element, and a piezoelectric pump. The driving element is connected to the microprocessor to receive a modulating signal and a control signal and to output a driving signal. The driving signal includes a driving voltage and a driving frequency. The piezoelectric pump is actuated by the driving signal, and the piezoelectric pump is set to be actuated at an actuation frequency and be applied with an actuation voltage value. The microprocessor drives the driving element to output the driving voltage having an initial voltage value at the driving frequency to the piezoelectric pump, and adjusts the driving frequency to the same with the actuation frequency. After the driving frequency is adjusted to reach the actuation frequency, the microprocessor drives the driving element to gradually increase the initial voltage value to reach the actuation voltage value.
Abstract: A three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is bonded to a first IC die by a first bonding structure. A third IC die is bonded to the second IC die by a second bonding structure. The second bonding structure is arranged between back sides of the second IC die and the third IC die opposite to corresponding interconnect structures and comprises a first TSV (through substrate via) disposed through a second substrate of the second IC die and a second TSV disposed through a third substrate of the third IC die. The second bonding structure further comprises conductive features with oppositely titled sidewalls disposed between the first TSV and the second TSV.
Abstract: An electronic cigarette includes a power supply device, an atomizer, a liquid storage structure, a fluid transportation device, a casing and a mouthpiece. The atomizer includes an electric heater and a liquid conduit. The electric heater is disposed around liquid conduit. The liquid storage structure includes a liquid container for storing cigarette liquid. The fluid transportation device includes an input channel in communication with the liquid container and an output channel in communication with the liquid conduit. The cigarette liquid is transferred to the liquid conduit through the fluid transportation device at a certain amount. Consequently, an atomized vapor is generated. The casing has an inlet in communication with the atomizer through an airflow chamber. The inlet and the airflow chamber form an airflow path for an airflow to pass through. The mouthpiece is located at an end of the casing and in communication with the airflow path.
Abstract: A method for manufacturing three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is formed and bonded to a first IC die by a first bonding structure. A third IC die is formed and bonded to the second IC die by a second bonding structure. The second bonding structure is formed between back sides of the second IC die and the third IC die opposite to corresponding interconnect structures and comprises a first TSV (through substrate via) disposed through a second substrate of the second IC die and a second TSV disposed through a third substrate of the third IC die. In some further embodiments, the second bonding structure is formed by forming conductive features with oppositely titled sidewalls disposed between the first TSV and the second TSV.
Abstract: A dynamic pressure controlled air cushion device disposed on a bottom part of a shoe comprises a first air bag and a second air bag communicated with each other through an air passage, and the first air bag and the second air bag are respectively disposed corresponding to a front foot sole and a rear foot sole of a user.
Abstract: A miniature fluid control device for transporting gas is disclosed, which includes a gas inlet plate, a resonance plate, a piezoelectric actuator and a gas collecting plate stacked on each other. The gas inlet plate includes at least one inlet, at least one convergence channel and a circular cavity which forms a convergence chamber. The resonance plate has a central aperture. The piezoelectric actuator includes a suspension plate, an outer frame and a piezoelectric plate, wherein the suspension plate has a cylindrical bulge aligned with the circular cavity. The ratio of a second diameter of the cylindrical bulge to a first diameter of the circular cavity is set in a specified range to optimize the gas pressure of the transported gas, thus assuring efficiency of gas transmission of the miniature fluid control device.
Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin on a substrate, a second fin on the substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes an insulating liner and a fill material on the insulating liner. The insulating liner abuts a first sidewall of the first fin and a second sidewall of the second fin. The insulating liner includes a material with a band gap greater than 5 eV.
Abstract: The present disclosure relates to a microphone. In some embodiments, the microphone may comprise a substrate, a diaphragm, a backplate, and a sidewall stopper. The substrate has an opening disposed through the substrate. The diaphragm is disposed over the substrate and facing the opening of the substrate. The diaphragm has a venting hole overlying the opening of the substrate. A backplate is disposed over and spaced apart from the diaphragm. A sidewall stopper is disposed along a sidewall of the venting hole of the diaphragm and thus is not limited by a distance between the movable part and the stable part. Also, the sidewall stopper does not alternate the shape of movable part, and thus will less likely introduce crack to the movable part. In some embodiments, the sidewall stopper may be formed like a sidewall stopper by a self-alignment process, such that no extra mask is needed.
Abstract: Disclosed herein are methods for high-throughput screening of a functional antibody fragment for an immunoconjugate that targets a protein antigen. The method combines a phage-displayed synthetic antibody library and high-throughput cytotoxicity screening of non-covalently assembled immunotoxins or cytotoxic drug to identify highly functional synthetic antibody fragments for delivering toxin payloads.
Abstract: A three-dimensional structure includes a plate and a three-dimensional component disposed on the plate. The three-dimensional component contains at least one first structure and at least one second structure. The first structure is an auxetic structure, and the second structure is different from the first structure. The at least one first structure and the at least one second structure are provided layer by layer along a thickness direction of the plate on the plate.
December 28, 2017
Date of Patent:
August 25, 2020
Industrial Technology Research Institute
Abstract: A semiconductor device includes an epitaxial straining region formed within a semiconductor substrate, the straining region being positioned adjacent to a gate stack, the gate stack being positioned above a channel. The straining region comprises a defect comprising two crossing dislocations such that a cross-point of the dislocations is closer to a bottom of the straining region than to a top of the straining region. The straining region comprises an element with a smaller lattice constant than a material forming the substrate.
Abstract: A system module applied to the machine controller for simulating a machine operation screen based on a non-invasive data-extraction system, is disclosed. An image capture device of the system module can receive an original operation screen outputted from the machine controller, and transmit the original operation screen to the non-invasive data-extraction system and a high-speed image process unit for extraction of the information shown on the operation screen. The software control system can extract the operational information of the machine controller in real time, to create a machine operation flow for generating a simulated machine operation screen which is then outputted to a screen of the machine controller. As a result, the site working staff can be provided with operational information associated with the machine in real time, for example, the operational information includes currently executed operation screen, position of mouse cursor and pop-up window detection result.
Abstract: A system module of customizing a screen image based on a non-invasive data-extraction system, and a method thereof are disclosed. The system module is applicable to a machine controller controlling a machine, and sensors are disposed around the machine. In the system module, an image capture device receives an image of an original screen from the machine controller, and transmits the image to the non-invasive data-extraction system for extracting information, and a software control system integrates data measured by the sensors with the information, and combined the integration result with a customized screen image, and an extra control component is embedded in an original operation screen of the machine controller. The customized screen image is shown on the machine controller to display information by more visual manner. Furthermore, the signal receiving device and an HID simulation device can be used to provide a basic function of a KVM switch.