Abstract: A brushless DC motor control device for a ceiling fan is electrically connected to a brushless DC motor and includes at least one switch, a processor, and a driving module. The processor includes at least one detection module and a processing module. The switch transmits a switch signal to the detection module for detection. After the detection module detects an operating electric potential and a normal electric potential of the switch signal, the detection module outputs a detection signal to the processing module. The processing module outputs a control signal to the driving module, so that the driving module transmits a driving signal to the brushless DC motor to control the rotational speed, stop and rotational direction of the brushless DC motor.

Abstract: A brushless DC motor control device for a ceiling fan is electrically connected to a brushless DC motor and includes at least one switch, a processor, and a driving module. The processor includes at least one detection module and a processing module. The switch transmits a switch signal to the detection module for detection. After the detection module detects an operating electric potential and a normal electric potential of the switch signal, the detection module outputs a detection signal to the processing module. The processing module outputs a control signal to the driving module, so that the driving module transmits a driving signal to the brushless DC motor to control the rotational speed, stop and rotational direction of the brushless DC motor.

Abstract: A fireproof battery module including a plurality of battery cells and at least one fireproof layer. The battery cells are electrically connected to one another. The at least one fireproof layer is located between two of the plurality of battery cells that are adjacent to each other. The fireproof layer includes a heat absorbing part and a heat insulation part that are connected to each other. The heat absorbing part includes a vaporizable material and a thermal conductivity of the heat insulation part is lower than a thermal conductivity of the heat absorbing part.

Abstract: A method of forming a semiconductor device includes forming a plurality of metal pads over a semiconductor substrate of a wafer, forming a passivation layer covering the plurality of metal pads, patterning the passivation layer to reveal the plurality of metal pads, forming a first polymer layer over the passivation layer, forming a plurality of redistribution lines extending into the first polymer layer and the passivation layer to connect to the plurality of metal pads, forming a second polymer layer over the first polymer layer, and patterning the second polymer layer to reveal the plurality of redistribution lines. The first polymer layer is further revealed through openings in remaining portions of the second polymer layer.

Abstract: A fiber spreading apparatus which is configured to spread a carbon fiber bundle, and includes a feeding roll, a winding roll, a vibrating roller, and a first nozzle. The vibrating roller is disposed between the feeding roll and the winding roll, and is in contact with the carbon fiber bundle. The vibrating roller is rotated according to an axis of rotation, and is vibrated along a vibrating direction perpendicular to the axis of rotation. The first nozzle is disposed between the vibrating roller and the winding roll, and blows the carbon fiber bundle.

Abstract: A method of forming a semiconductor device includes forming a plurality of metal pads over a semiconductor substrate of a wafer, forming a passivation layer covering the plurality of metal pads, patterning the passivation layer to reveal the plurality of metal pads, forming a first polymer layer over the passivation layer, forming a plurality of redistribution lines extending into the first polymer layer and the passivation layer to connect to the plurality of metal pads, forming a second polymer layer over the first polymer layer, and patterning the second polymer layer to reveal the plurality of redistribution lines. The first polymer layer is further revealed through openings in remaining portions of the second polymer layer.

Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.

Abstract: The invention provides a method for improving temperature management of a battery pack. The battery pack may comprise a battery cell charged via at least one supply trace of a PCB (printed circuit board), a protection circuit module mounted on the PCB and coupled to the at least one supply trace, and a plurality of temperature sensors respectively reflecting a temperature of the battery cell and a temperature of the PCB. The method may comprise: measuring a cell temperature and a PCB temperature by the temperature sensors; when charging the battery cell by a charging current and a charging voltage, controlling the charging voltage and the charging current according to the cell temperature, and adjusting the charging current further according to the PCB temperature, so as to constrain the temperature of the PCB.

Abstract: A charging method, a charging system and an electronic device are provided. The charging method includes the following steps: An inputting current limit is set. An inputting current of at least one charger is measured. A power source voltage of a power source is adjusted until a current difference between the inputting current and the inputting current limit is within a predetermined range.

Abstract: A three-dimensional structure includes a plate and a three-dimensional component disposed on the plate. The three-dimensional component contains at least one first structure and at least one second structure. The first structure is an auxetic structure, and the second structure is different from the first structure. The at least one first structure and the at least one second structure are provided layer by layer along a thickness direction of the plate on the plate.

Abstract: A fireproof battery module including a plurality of battery cells and at least one fireproof layer. The battery cells are electrically connected to one another. The at least one fireproof layer is located between two of the plurality of battery cells that are adjacent to each other. The fireproof layer includes a heat absorbing part and a heat insulation part that are connected to each other. The heat absorbing part includes a vaporizable material and a thermal conductivity of the heat insulation part is lower than a thermal conductivity of the heat absorbing part.

Abstract: An electronic device includes: a connector, arranged for coupling to a power supply external to the electronic device, wherein the power supply is arranged to provide a supply voltage to the electronic device to charge a battery of the electronic device; and a charger, coupled to the connector and selectively operated in a normal mode or a self-test mode, wherein when the charger operates in the normal mode, the charger is arranged for receiving the supply voltage via a power pin of the connector to charge the battery of the electronic device; and when the charger operates in the self-test mode, the charger provides a specific voltage to the power pin of the connector. The charger includes a detector to detect the current or voltage of at least one pin of the connector to generate a detecting result, and the supply voltage is set based on the detecting result.

Abstract: A method of forming a semiconductor device includes forming a plurality of metal pads over a semiconductor substrate of a wafer, forming a passivation layer covering the plurality of metal pads, patterning the passivation layer to reveal the plurality of metal pads, forming a first polymer layer over the passivation layer, forming a plurality of redistribution lines extending into the first polymer layer and the passivation layer to connect to the plurality of metal pads, forming a second polymer layer over the first polymer layer, and patterning the second polymer layer to reveal the plurality of redistribution lines. The first polymer layer is further revealed through openings in remaining portions of the second polymer layer.

Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.

Abstract: According to at least one aspect, a device is provided. The device comprises: a connector configured to electrically couple to an external device and comprising a plurality of terminals including a supply terminal; a monitoring circuit coupled to the supply terminal and configured to apply an electrical signal to the supply terminal and measure at least one of a voltage level and a current level on the supply terminal; a controller communicatively coupled to the monitoring circuit and configured to: determine whether an impedance between the supply terminal and at least one other terminal in the plurality of terminals is above a threshold using the at least one of the voltage level and the current level on the supply terminal; and output at least one message responsive to the impedance being below the threshold.

Abstract: A method of forming a semiconductor device includes forming a plurality of metal pads over a semiconductor substrate of a wafer, forming a passivation layer covering the plurality of metal pads, patterning the passivation layer to reveal the plurality of metal pads, forming a first polymer layer over the passivation layer, forming a plurality of redistribution lines extending into the first polymer layer and the passivation layer to connect to the plurality of metal pads, forming a second polymer layer over the first polymer layer, and patterning the second polymer layer to reveal the plurality of redistribution lines. The first polymer layer is further revealed through openings in remaining portions of the second polymer layer.

Abstract: A jumper is adapted to be disposed between two sockets. Each of the sockets has at least one conductive terminal. The jumper includes an insulative body and at least one conductive body, which includes a main body portion, a first engaging portion, and a second engaging portion. The main body portion is connected to the insulative body. The first and second engaging portions are respectively located at two opposite sides of the main body portion, and extend respectively from two opposite sides of the insulative body. The first engaging portion engages the conductive terminal of one of the sockets. The second engaging portion engages the conductive terminal of another one of the sockets, such that the conductive terminals are electrically connected. A power distribution device is also provided.

Abstract: A three-dimensional structure includes a plate and a three-dimensional component disposed on the plate. The three-dimensional component contains at least one first structure and at least one second structure. The first structure is an auxetic structure, and the second structure is different from the first structure. The at least one first structure and the at least one second structure are provided layer by layer along a thickness direction of the plate on the plate.

Abstract: A protective structure is provided, which includes a porous layer and a surface layer disposed on the porous layer. The porous layer includes a first copolymer, a plurality of pores, and a plurality of first silica particles, wherein the first copolymer is polymerized from a first monomer composition. The first monomer composition includes N,N-dimethylacrylamide and N-vinylpyrrolidone. The surface layer includes a second copolymer, a plurality of fibers, and a plurality of second silica particles, wherein the second copolymer is polymerized from a second monomer composition. The second monomer composition includes N,N-dimethylacrylamide and N-vinylpyrrolidone.

Abstract: A composition consisting of BSG and PLA is produced by the following steps: processing brewer's spent grains; mixing the BSG with the PLA at a specific proportion; the BSG and the PLA are well mixed by a binder and then subjected to a granulation process to form plastic granules. Adding BSG to the PLA can reduce the use of PLA. Furthermore, the composition consisting of BSG and PLA and the method for making the same are further utilized to make utensils, bottles, cans, containers, parts and other biological plastic products to achieve the purpose of adding value to the BSG.