Abstract: A system can receive a request to modify a universal integrated circuit card, generate a package comprising configuration data for modifying the universal integrated circuit card, instruct an over-the-air system to transmit the package encrypting the package with a transport key to generate an encrypted package, and transmit the encrypted package to a communication device communicatively coupled to the universal integrated circuit card to provision the universal integrated circuit card. The system can provide a mobile network operator trusted service manager system information relating to the configuration data to enable the mobile network operator trusted service manager system to manage content and memory allocation of the universal integrated circuit card.

Abstract: A system that incorporates the subject disclosure may include, for example, a system for receiving a request to modify a universal integrated circuit card, generating a package comprising configuration data for modifying the universal integrated circuit card, encrypting the package with a transport key to generate an encrypted package, transmitting the encrypted package to a communication device communicatively coupled to the universal integrated circuit card to provision the universal integrated circuit card, and providing a mobile network operator trusted service manager system information relating to the configuration data to enable the mobile network operator trusted service manager system to manage content and memory allocation of the universal integrated circuit card. Other embodiments are disclosed.

Abstract: A heat dissipating device applied to a heat generating element includes a cooling device, a vapor chamber and a heat pipe, and the vapor chamber is attached to the heat generating element, and the heat pipe is thermally coupled to the cooling device and communicated with the vapor chamber, and the heat pipe has at least one flexible portion. The heat pipe may be bent or deformed at any angle or in any direction through the flexible portion, so that the heat pipe can be installed and aligned and the height difference can be adjusted with respect to the cooling device, the vapor chamber and the heat generating element in a better way. In the meantime, the heat dissipating device has a shock absorbing capability.

Abstract: A power amplifier circuit including a power transistor, a variable impedance circuit, first and second envelope detecting circuits is provided. The power transistor receives an input signal and outputs an output signal. The variable impedance circuit includes an impedance control transistor and a first filter capacitor. An equivalent impedance of the variable impedance circuit varies with the input signal. The impedance control transistor is coupled to the power transistor and receives a control voltage. The first filter capacitor is coupled between the impedance control transistor and ground. Both the first and the second envelope detecting circuits detect the input signal to dynamically control the equivalent impedance of the variable impedance circuit.

Abstract: A vapor chamber having no gas discharging protrusion includes: a lower shell member, formed with an upper surface divided into an inner zone and an outer zone and an outer peripheral wall formed with a planar surface, the inner zone is formed with capillary channels, the outer zone is formed with a recess, and one thereof is communicated with at least one of the capillary channels and the other end thereof penetrates the planar surface; and an upper shell member, engaged with the upper surface and sealed with the lower shell member, and a gas discharging hole is formed between the recess and the upper shell member. Accordingly, a conventional gas discharging protrusion is not required on the vapor chamber thereby advantages of small and thin in volume and compact in structure being provided.

Abstract: A power amplifier circuit including a power transistor, a variable impedance circuit, first and second envelope detecting circuits is provided. The power transistor receives an input signal and outputs an output signal. The variable impedance circuit includes an impedance control transistor and a first filter capacitor. An equivalent impedance of the variable impedance circuit varies with the input signal. The impedance control transistor is coupled to the power transistor and receives a control voltage. The first filter capacitor is coupled between the impedance control transistor and ground. Both the first and the second envelope detecting circuits detect the input signal to dynamically control the equivalent impedance of the variable impedance circuit.

Abstract: A firmware loading system including a first memory device and a calculation unit. The first memory device includes a first firmware code, wherein the first firmware code has a predetermined code and a plurality of parameter tables, and the parameter tables are arranged to set up a plurality of registers of a second memory device. The calculation unit is arranged to perform a firmware insertion procedure, wherein, during the firmware insertion procedure, the calculation unit selects one of the parameter tables according to a selection signal, compiles the selected parameter table and the predetermined code into a second firmware code, and writes the second firmware code in a flash memory of the second memory device.

Abstract: A vapor chamber structure for at least one heating element includes a main body having a heat receiving plate. The heat receiving plate has at least one wrinkled ring portion. An inner portion of the wrinkled ring portion surrounds a contact portion. The contact portion is in contact with the heating element. Thereby, one heating element provides the contact portion a thrust when the contact portion is in contact with the heating element. The wrinkled ring portion is therefore forced to deform for helping the contact portion slightly adjust its position. This ensures a tight and even contact between the contact portion and the heating element, thereby improving the heat dissipation efficiency of the vapor chamber structure.

Abstract: A vapor chamber structure includes a plate-shaped shell and at least one stretchable heated member. The plate-shaped shell has a hollow interior to form a cavity and has a base on which at least one throughhole is disposed. The throughhole communicates with the cavity. The stretchable heated member is disposed on the base of the plate-shaped shell. The stretchable heated member includes a heated plate and a hollow stretchable tube. The heated plate is sealedly connected to one end of the stretchable tube and the throughhole of the plate-shaped shell is sealedly connected to the other end of the stretchable tube.

Abstract: A vapor chamber having no gas discharging protrusion includes: a lower shell member, formed with an upper surface divided into an inner zone and an outer zone and an outer peripheral wall formed with a planar surface, the inner zone is formed with capillary channels, the outer zone is formed with a recess, and one thereof is communicated with at least one of the capillary channels and the other end thereof penetrates the planar surface; and an upper shell member, engaged with the upper surface and sealed with the lower shell member, and a gas discharging hole is formed between the recess and the upper shell member. Accordingly, a conventional gas discharging protrusion is not required on the vapor chamber thereby advantages of small and thin in volume and compact in structure being provided.

Abstract: A thin vapor chamber includes a heat conducting plate having an upper surface, a metal cover sealed and covering on the heat conducting plate, and a wick structure disposed between the heat conducting plate and the metal cover. A plurality of hollow supports are formed on the metal cover by pressing and face the heat conducting plate. The wick structure is provided with plural throughholes. The hollow supports are individually disposed through the corresponding throughholes and attached to the upper surface. Thus, the heat of the heat conducting plate is transferred to the metal cover through the hollow supports. Besides, the metal cover is pressed to have an uneven shape to increase heat-dissipating area and structural strength, which achieves excellent heat transfer efficiency and heat diffusion of the thin vapor chamber.

Abstract: A heat plate sealing method and structure thereof includes a) providing a bottom plate and a cover plate engaging with each other; b) providing a welding frame; c) disposing the welding frame between the bottom plate and the cover plate; d) placing solder on the welding frame; e) sandwiching the welding frame having the solder thereon between the bottom plate and the cover plate; and f) conducting thermal melting on the solder to seal the bottom plate and the cover plate. Therefore, a sealing structure is strengthened and the airtightness during a sealing process is enhanced.

Abstract: The present invention relates to an oblique-driven platform having three coplanar driving axes, in which three oblique driving modules are disposed on an identical base, so as to drive a work platform to rotate and carry out 2-dimensional motion by the controlling of the three oblique driving modules. Thus, this design could solve the problems occurring in the conventional stacked machine tools; such as the deformation or the displacement of the sever axis or the rotation axis caused by the upper-layer machine tools. Moreover, by the disposing of the three oblique driving modules, the work platform can be driven to stably rotate and carry out 2-dimensional motion with high precision and high accuracy.

Abstract: A system that incorporates the subject disclosure may include, for example, a system for receiving a request to modify a universal integrated circuit card, generating a package comprising configuration data for modifying the universal integrated circuit card, encrypting the package with a transport key to generate an encrypted package, transmitting the encrypted package to a communication device communicatively coupled to the universal integrated circuit card to provision the universal integrated circuit card, and providing a mobile network operator trusted service manager system information relating to the configuration data to enable the mobile network operator trusted service manager system to manage content and memory allocation of the universal integrated circuit card. Other embodiments are disclosed.

Abstract: A heat plate sealing method and structure thereof includes a) providing a bottom plate and a cover plate engaging with each other; b) providing a welding frame; c) disposing the welding frame between the bottom plate and the cover plate; d) placing solder on the welding frame; e) sandwiching the welding frame having the solder thereon between the bottom plate and the cover plate; and f) conducting thermal melting on the solder to seal the bottom plate and the cover plate. Therefore, a sealing structure is strengthened and the airtightness during a sealing process is enhanced.

Abstract: A system that incorporates the subject disclosure may include, for example, a system for receiving a request to modify a universal integrated circuit card, generating a package comprising configuration data for modifying the universal integrated circuit card, encrypting the package with a transport key to generate an encrypted package, transmitting the encrypted package to a communication device communicatively coupled to the universal integrated circuit card to provision the universal integrated circuit card, and providing a mobile network operator trusted service manager system information relating to the configuration data to enable the mobile network operator trusted service manager system to manage content and memory allocation of the universal integrated circuit card. Other embodiments are disclosed.

Abstract: Systems and methods are provided for suturing tissue. An elongated deployment shaft carries a needle deployment assembly with needles carrying suture material and a stabilizer that is reconfigurable between an unexpanded insertion profile and an expanded profile. A catcher tube over the shaft having a catcher at a distal end may retain at least a portion of the needles carrying the suture material when the needles are passed through the tissue to be sutured into engagement with the catcher. A sheath over the catcher tube may sandwich tissue to be sutured against the stabilizer when expanded. A first actuator may move the catcher tube distally relative to the shaft to decrease a distance between the proximal end of the stabilizer and the distal end of the stabilizer to expand the stabilizer and may move the sheath distally relative to the shaft to sandwich the tissue.

Abstract: Systems and methods are provided for suturing tissue. An elongated deployment shaft carries a needle deployment assembly with needles carrying suture material. A needle catcher is disposed over the shaft and configured to engage and retain at least a portion of each of the needles carrying the suture material when the needles are passed through the tissue to be sutured to a proximal position.

Abstract: The present invention relates to an oblique-driven platform having three coplanar driving axes, in which three oblique driving modules are disposed on an identical base, so as to drive a work platform to rotate and carry out 2-dimensional motion by the controlling of the three oblique driving modules. Thus, this design could solve the problems occurring in the conventional stacked machine tools; such as the deformation or the displacement of the sever axis or the rotation axis caused by the upper-layer machine tools. Moreover, by the disposing of the three oblique driving modules, the work platform can be driven to stably rotate and carry out 2-dimensional motion with high precision and high accuracy.

Abstract: A firmware loading system including a first memory device and a calculation unit. The first memory device includes a first firmware code, wherein the first firmware code has a predetermined code and a plurality of parameter tables, and the parameter tables are arranged to set up a plurality of registers of a second memory device. The calculation unit is arranged to perform a firmware insertion procedure, wherein, during the firmware insertion procedure, the calculation unit selects one of the parameter tables according to a selection signal, compiles the selected parameter table and the predetermined code into a second firmware code, and writes the second firmware code in a flash memory of the second memory device.