Patents by Inventor Shin-Wen Chen

Shin-Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • VOICE COIL MOTOR, CAMERA MODULE, AND ELECTRONIC DEVICE USING THE SAME
    Publication number: 20200266693
    Abstract: A voice coil motor in a camera module with a means of being mounted robustly on a base comprises a casing and the base. The casing is hollow, the casing comprises a top surface and a side wall around the top surface. The base comprises a base portion and projections, the base portion being in contact with the side wall of the casing and engaged with the casing to form a cavity. The side wall is provided with recesses external to the cavity to accept the projections, the projections lending structural reinforcement to the casing.
    Type: Application
    Filed: September 5, 2019
    Publication date: August 20, 2020
    Inventors: XIAO-MEI MA, SHIN-WEN CHEN, LONG-FEI ZHANG, KUN LI
  • Lens module
    Patent number: 10748946
    Abstract: A lens module includes a circuit board, a hollow mounting bracket, a photosensitive chip, a lens base, and a lens. The photosensitive chip is mounted within the hollow mounting bracket on a surface of the circuit board. The lens base is mounted on a surface of the mounting bracket opposite to the circuit board. The lens base axially defines a through hole. The lens is mounted within the lens base. The lens base includes a screw thread formed along an inner wall of the through hole. The lens includes mating threads formed along a periphery of the lens contacting the inner wall of the through hole. The mating threads define at least one thread slot which defines a gap with the screw threads of the inner wall of the through hole.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: August 18, 2020
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Yu-Shuai Li, Shin-Wen Chen, Kun Li, Ke-Hua Fan
  • Encapsulation structure for image sensor chip and method for manufacturing the same
    Patent number: 10748829
    Abstract: An encapsulation structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a supporting portion, a protecting film and a package portion. The image sensor chip is mounted on the printed circuit board and the supporting portion is mounted on the printed circuit board to surround the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the supporting portion and the protecting film, and portion of surface of the protecting sheet away from the image sensor chip.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: August 18, 2020
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN CO.LTD.
    Inventors: Chia-Wei Chen, Shin-Wen Chen
  • Encapsulation structure for image sensor chip and method for manufacturing the same
    Patent number: 10749046
    Abstract: An encapsulating structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a protecting sheet, and a package portion. The image sensor chip is mounted on the printed circuit board and the protecting sheet is mounted on the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the image sensor chip, the protecting sheet, and portion of surface of the protecting sheet away from the image sensor chip. A method for manufacturing same is also disclosed.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: August 18, 2020
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    Inventors: Chia-Wei Chen, Shin-Wen Chen
  • Camera module with reduced light leakage and electronic device using same
    Patent number: 10743415
    Abstract: A camera module has a reduced light leakage. The camera module includes a printed circuit board and a mounting bracket mounted on the printed circuit board. The printed circuit board includes a first surface and at least one side surface perpendicularly connected to the first surface. Gaps are formed on the printed circuit board. The gaps extend from the first surface to a thickness direction of the first surface. Bumps are formed on the mounting bracket and correspondingly placed according to the gaps. Each of the bumps is received and fixed in a corresponding one of the gaps.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: August 11, 2020
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventors: Jing-Wei Li, Shin-Wen Chen, Yu-Shuai Li, Sheng-Jie Ding
  • CAMERA MODULE AND ELECTRONIC DEVICE USING SAME
    Publication number: 20200228718
    Abstract: A camera module of minimal size but with zoom function includes a zoom assembly, a base, and a fixed focus assembly. The zoom assembly and the fixed focus assembly are fixed in the base. The zoom assembly is driven by piezoelectric element instead of voice coil motor and includes an actuator and an optical unit. The actuator defines a first receiving groove holding the optical unit in place over the first through hole. When powered, the piezoelectric element changes a shape of the optical unit to change a focal length of the zoom assembly. An electronic device including such a camera module is also provided.
    Type: Application
    Filed: April 17, 2019
    Publication date: July 16, 2020
    Inventors: SHIN-WEN CHEN, LONG-FEI ZHANG, HO-KAI LIANG, PO-CHENG LEE, KUN LI, XIAO-MEI MA
  • Optical projection module with improved heat dissipation
    Patent number: 10712642
    Abstract: An optical projection module with improved heat dissipation includes a circuit board having a first surface and a second surface opposite the first surface. A semiconductor substrate is mounted on the first surface. The semiconductor substrate has a third surface facing the first surface and a fourth surface opposite to the third surface. A light source and an optical member are mounted on the fourth surface. The optical member includes a lens holder. The lens holder defines a receiving space for receiving the light source. The lens holder further defines at least one escaping hole. A heat dissipation block is received in each escaping hole.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: July 14, 2020
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventors: Shuai-Peng Li, Jing-Wei Li, Shin-Wen Chen, Sheng-Jie Ding
  • PHOTOSENSITIVE CHIP, LENS MODULE HAVING THE PHOTOSENSITIVE CHIP AND ELECTRONIC DEVICE HAVING THE LENS MODULE
    Publication number: 20200218027
    Abstract: A photosensitive chip includes a photosensitive region, a non-photosensitive region and an adhesive layer. The non-photosensitive region protrudes from a periphery of the photosensitive region to surround the photosensitive region. The adhesive layer covers the non-photosensitive region to absorb light and reduce an intensity of light reflected from the adhesive layer. The disclosure also provides a lens module having the photosensitive chip, and an electronic device having the lens module.
    Type: Application
    Filed: April 22, 2019
    Publication date: July 9, 2020
    Inventors: SHIN-WEN CHEN, JIAN-CHAO SONG, SHENG-JIE DING, JING-WEI LI
  • LENS MODULE AND ELECTRONIC DEVICE HAVING THE SAME
    Publication number: 20200218028
    Abstract: A lens module includes a lens holder and a lens. The lens holder comprises a through-hole. The lens holder comprises an inner wall surrounding to define the through-hole. A first thread is formed on the inner wall. A second thread is formed on an outer sidewall of the lens. The first thread cooperates with the second thread to fix the lens on the lens holder. At least one first slot is defined on the outer sidewall of the lens and around a periphery of the lens, and a seal ring is received in each first slot. At least one second slot is defined on the outer sidewall of the lens along a direction of an optic axis of the lens. Each second slot passes through each first slot to form a receiving space. The disclosure also provides an electronic device having the lens module.
    Type: Application
    Filed: September 5, 2019
    Publication date: July 9, 2020
    Inventors: KUN LI, LONG-FEI ZHANG, SHIN-WEN CHEN, HAO-ZHONG LIU
  • ADJUSTABLE THREE-DIMENSIONAL IMAGE-CAPTURING DEVICE
    Publication number: 20200221065
    Abstract: A three-dimensional image-capturing device includes a first camera, a second camera, a driving member and a sensing member. The second camera is at one side of the first camera and is capable of being moved laterally by the driving member. After depth-sensing and establishing orientations in an image, the driving member is able to drive the second camera to move relative to the first camera, to change a distance between the first camera and the second camera. Such relative movement allows a greater range of three dimensionality for face recognition and other purposes.
    Type: Application
    Filed: February 20, 2019
    Publication date: July 9, 2020
    Inventors: YE-QUANG CHEN, SHIN-WEN CHEN, JING-WEI LI, CHIA-WEI CHEN, SHENG-JIE DING
  • LENS MODULE WITH IMPROVED IMAGE QUALITY AND ELECTRONIC DEVICE WITH THE SAME
    Publication number: 20200209441
    Abstract: A lens module with enhanced absorption of stray light includes a sensor and a mounting bracket. The sensor includes a photosensitive area and a non-photosensitive area arranged surrounding the photosensitive area. The sensor is received in the mounting bracket and a window is defined in the mounting bracket. An annular flange extends from an inner wall of the window towards a center axis of the window. The annular flange includes a reflecting surface facing away from the inner wall of the window and tilted towards the sensor. The photosensitive area is exposed in a through hole of the annular flange. Diffusing reflection structures are formed on the reflecting surface and are configured to diffuse light incident on the non-photosensitive area away from the photosensitive area.
    Type: Application
    Filed: April 15, 2019
    Publication date: July 2, 2020
    Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    Inventors: SHIN-WEN CHEN, JIAN-CHAO SONG, JING-WEI LI, SHENG-JIE DING
  • CAMERA MODULE OF CAMERA
    Publication number: 20200200594
    Abstract: A camera module includes a base, a circuit board bearing the base, and a metal plate bearing the circuit board and the base. The base includes a receiving portion and a bearing portion. The bearing portion surrounds the receiving portion. The bearing portion defines a cutout to receive an electronic component of the circuit board.
    Type: Application
    Filed: January 23, 2019
    Publication date: June 25, 2020
    Inventors: SHIN-WEN CHEN, JIAN-CHAO SONG, SHENG-JIE DING, JING-WEI LI
  • LENS AND ASSEMBLY METHOD THEREOF
    Publication number: 20200205282
    Abstract: A lens module includes a circuit board, a photosensitive chip, a mounting bracket, a filter, a lens base, and a lens. The circuit board defines a first through hole. The photosensitive chip is mounted within the first through hole. Gold fingers are mounted on the circuit board surrounding the photosensitive chip. Metal wires are mounted on a periphery of the photosensitive chip. Each of the metal wires is coupled to a corresponding one of the gold fingers. The metal wires are encapsulated by a colloid so that the metal wires do not contact each other. The mounting bracket is mounted on the circuit board. The filter is mounted on the mounting bracket and aligned with the photosensitive chip. The lens base is mounted on the mounting bracket. The lens is mounted within the lens base and aligned with the photosensitive chip.
    Type: Application
    Filed: January 23, 2019
    Publication date: June 25, 2020
    Inventors: SHIN-WEN CHEN, LONG-FEI ZHANG, KE-HUA FAN, KUN LI
  • LENS MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
    Publication number: 20200192064
    Abstract: A lens module includes a circuit board, a carrier, and an optical filter. The carrier is fixed on a surface of the circuit board. The carrier defines a through hole. The optical filter is mounted on the carrier. The carrier defines at least one gas escape structure. A receiving space is between the optical filter and the circuit board, and the gas escape structure communicates with the receiving space to release water vapor in the receiving space and allow air pressure equalization and thus the relief of stress. The disclosure further provides an electronic device including the lens module.
    Type: Application
    Filed: September 4, 2019
    Publication date: June 18, 2020
    Inventors: KUN LI, SHIN-WEN CHEN, LONG-FEI ZHANG, XIAO-MEI MA
  • LENS MODULE
    Publication number: 20200192050
    Abstract: A lens module includes a circuit board, a carrier, and a filter. The carrier is mounted to a surface of the circuit board and includes a through hole. The filter is mounted within the through hole. The carrier includes at least one air hole passing through the carrier. The filter and the circuit board close respective opposite sides of the carrier to form a receiving space. The air hole connects to the receiving space to allow heat from within the receiving space to be released out.
    Type: Application
    Filed: January 16, 2019
    Publication date: June 18, 2020
    Inventors: KUN LI, SHIN-WEN CHEN, YU-SHUAI LI, LONG-FEI ZHANG
  • CAMERA MODULE
    Publication number: 20200183254
    Abstract: A camera module includes a circuit board, an image sensor, a lens holder, and a lens. The image sensor is arranged on the circuit board. The lens holder is covered over the image sensor. The lens is arranged on the lens holder. The lens holder is adhered to the circuit board by a colloid. The lens holder includes a projection on a side of the lens holder facing the circuit board. The projection is embedded within the colloid.
    Type: Application
    Filed: January 16, 2019
    Publication date: June 11, 2020
    Inventors: XIAO-MEI MA, SHIN-WEN CHEN, LONG-FEI ZHANG, KUN LI
  • CIRCUIT BOARD ASSEMBLY, CAMERA MODULE, AND ELECTRONIC DEVICE INCLUDING THE SAME
    Publication number: 20200186684
    Abstract: A circuit board assembly for a twin-camera module to avoid any heat-induced misalignments in manufacture is disclosed, to improve the production yield of the camera module. The circuit board assembly comprises at least two daughter boards and at least one first flexible printed circuit board. Each of the flexible printed circuit boards connects to adjacent two of the daughter boards. The disclosure also provides the twin-camera module comprising the circuit board assembly, and an electronic device comprising the camera module.
    Type: Application
    Filed: August 22, 2019
    Publication date: June 11, 2020
    Inventors: SHIN-WEN CHEN, SHENG-JIE DING, JING-WEI LI, JIAN-CHAO SONG
  • Holder for camera module and camera module with holder
    Patent number: 10681255
    Abstract: A holder for a camera module includes first and second surfaces, an optical filter receiving groove is recessed from the first surface to the second surface to form a step portion and a glue receiving portions extend from angled abutments of the step portion. A sensor receiving groove is recessed from the second surface to the first surface, and the sensor receiving groove communicates with the optical filter receiving groove. At least one escape passage is defined in the holder, the at least one escape passage communicates with the optical filter receiving groove and the sensor receiving groove. The at least one escape passage abuts the glue receiving portions and provides an escape path for captured moisture and gases expanding or shrinking because of temperature variations.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: June 9, 2020
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Sheng-Jie Ding, Shin-Wen Chen, Jing-Wei Li, Jian-Chao Song
  • CAMERA FOR MOUNTING ON A VEHICLE AND VEHICLE WITH THE SAME
    Publication number: 20200172019
    Abstract: A camera for mounting on a vehicle includes a holder, a lens, and a polarizing film. The lens includes an optical lens body and an annular body. A part of the optical lens body is received in the holder and the other part of the optical lens body extends out of the holder. The annular body is disposed around an outer circumference of a portion of the optical lens body extending out of the holder. The polarizing film in the annular body faces the lens and weakens the effects of strong lights on images captured by the camera.
    Type: Application
    Filed: April 4, 2019
    Publication date: June 4, 2020
    Inventors: SHENG-JIE DING, SHIN-WEN CHEN, LONG-FEI ZHANG, KUN LI, JING-WEI LI
  • 3D SENSING CAMERA OF ELECTRONIC DEVICE
    Publication number: 20200169721
    Abstract: A 3D sensing device includes a base, an infrared emitting module, a first infrared receiver, a second infrared receiver, a color camera module, a first moving member, a second moving member, a first driving member, and a second driving member. The first moving member and the second moving member are slidably mounted on the base. The first driving member and the second riving member respectively drive the first moving member and the second moving member to slide along the base. The infrared emitting module is mounted on the first moving member. The color camera module is located between the first infrared receiver and the infrared emitter. The second infrared receiver is mounted on the second moving member. The first moving member and the second moving member respectively move the infrared emitting module and the second infrared receiver along the base relative to the first infrared receiver.
    Type: Application
    Filed: January 16, 2019
    Publication date: May 28, 2020
    Inventors: SHIN-WEN CHEN, YE-QUANG CHEN, JING-WEI LI, SHENG-JIE DING, CHIA-WEI CHEN