Patents by Inventor Shin-Wen Chen

Shin-Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Imaging chip packaging structure and camera device having the same
    Patent number: 10666843
    Abstract: An imaging chip packaging structure includes a circuit substrate, an imaging chip, and a pedestal. The circuit substrate has a first through hole extending through the circuit substrate. The imaging chip comprises a photosensitive area, and the first through hole through the substrate exposes the photosensitive area. The pedestal is integrated with the circuit substrate. The pedestal is formed on a first surface of the circuit substrate and comprises a second through hole on an optical path of the light reaching the imaging chip.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: May 26, 2020
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventors: Kun Li, Shin-Wen Chen, Long-Fei Zhang, Xiao-Mei Ma
  • Optical projector device
    Patent number: 10663744
    Abstract: A optical projector device less vulnerable to deformation of projected light by generated heat includes a printed circuit board, a light source, and an optical module. The heat-generating light source emits a laser beam, the optical module being mounted on the printed circuit board and surrounding the light source. The optical module comprises a lens holder, a collimating optical element received in the lens holder, and a diffractive optical element away from the light source. The lens holder comprises an outer lens holder and an inner lens holder fixed in the outer lens holder, and the diffractive optical element is received in the inner lens holder, this arrangement enables the dissipation of any heat-expansion force away from these elements.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: May 26, 2020
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Jing-Wei Li, Shin-Wen Chen, Sheng-Jie Ding, Jian-Chao Song
  • VOICE COIL MOTOR AND ELECTRONIC DEVICE HAVING THE SAME
    Publication number: 20200161956
    Abstract: A voice coil motor includes a housing, a cover plate, an upper elastic member; a movable assembly, an immovable assembly, a lower elastic member, and a base cooperating with the housing to receive the cover plate, the upper elastic member, the movable assembly, the immovable assembly, and the lower elastic member. The base is made of laser direct structuring material. A metal layer is formed on a region of the base connecting the housing by Laser Direct Structuring processes, and the metal layer is fixed on the housing by laser welding or solder paste spot welding. The disclosure also provides an electronic device having the voice coil motor.
    Type: Application
    Filed: January 30, 2019
    Publication date: May 21, 2020
    Inventors: LONG-FEI ZHANG, SHIN-WEN CHEN, YU-SHUAI LI, KUN LI
  • Optical projection module
    Patent number: 10645352
    Abstract: An optical projection module with improved heat dissipation efficiency includes a circuit board, a semiconductor substrate mounted on a surface of the circuit board, and a light source and an optical member mounted on a surface of the semiconductor substrate opposite from the circuit board. A hollow area is defined in the circuit board and in the semiconductor substrate to draw heat directly away from the light source and thus avoid physical distortion of the hardware which would otherwise reduce the quality of light beams emitted.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: May 5, 2020
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventors: Jing-Wei Li, Sheng-Jie Ding, Jian-Chao Song, Shin-Wen Chen
  • HOLDER FOR CAMERA MODULE AND CAMERA MODULE WITH HOLDER
    Publication number: 20200137272
    Abstract: A holder for a camera module includes first and second surfaces, an optical filter receiving groove is recessed from the first surface to the second surface to form a step portion and a glue receiving portions extend from angled abutments of the step portion. A sensor receiving groove is recessed from the second surface to the first surface, and the sensor receiving groove communicates with the optical filter receiving groove. At least one escape passage is defined in the holder, the at least one escape passage communicates with the optical filter receiving groove and the sensor receiving groove. The at least one escape passage abuts the glue receiving portions and provides an escape path for captured moisture and gases expanding or shrinking because of temperature variations.
    Type: Application
    Filed: February 28, 2019
    Publication date: April 30, 2020
    Inventors: SHENG-JIE DING, SHIN-WEN CHEN, JING-WEI LI, JIAN-CHAO SONG
  • LENS MODULE
    Publication number: 20200135778
    Abstract: A lens module includes a circuit board, a hollow mounting bracket, a photosensitive chip, a lens base, and a lens. The photosensitive chip is mounted within the hollow mounting bracket on a surface of the circuit board. The lens base is mounted on a surface of the mounting bracket opposite to the circuit board. The lens base axially defines a through hole. The lens is mounted within the lens base. The lens base includes a screw thread formed along an inner wall of the through hole. The lens includes mating threads formed along a periphery of the lens contacting the inner wall of the through hole. The mating threads define at least one thread slot which defines a gap with the screw threads of the inner wall of the through hole.
    Type: Application
    Filed: December 17, 2018
    Publication date: April 30, 2020
    Inventors: YU-SHUAI LI, SHIN-WEN CHEN, KUN LI, KE-HUA FAN
  • TEMPERATURE-INDIFFERENT LENS MODULE WITH DEPTH-PERCEPTION FUNCTION AND ELECTRONIC DEVICE USING THE SAME
    Publication number: 20200137273
    Abstract: A depth-perceiving lens module with enhanced heat-dissipating properties comprises a circuit board, an infrared emitter, and an infrared receiver. The circuit board is provided with at least one positioning hole. The infrared emitter is detachably disposed on a side of the circuit board and electrically connected to the circuit board, the infrared emitter comprises a mounting body and an emitting body. The mounting body wraps at least part of the emitting body, at least part of the mounting body is disposed in the positioning hole and fixed to the circuit board. The infrared receiver is detachably disposed on one side of the circuit board and electrically connected to the circuit board, to receive the reflection of the infrared light from the light emitter.
    Type: Application
    Filed: June 28, 2019
    Publication date: April 30, 2020
    Inventors: SHENG-JIE DING, SHIN-WEN CHEN, JING-WEI LI, JIAN-CHAO SONG
  • Optical projection device
    Patent number: 10627097
    Abstract: An optical projection device with metallic components for heat dissipation and for structural reinforcement includes a holder and two opposing metal components opposite to each other. The holder comprises lens receiving groove, electric component receiving groove, and connecting receiving groove leading to the exterior. The two opposing metal components comprise first and second heat dissipation parts, and a connecting part. The first heat dissipation part is formed on an exterior surface of the holder, the connecting part is received in the connecting receiving groove, and the second heat dissipation part is formed on an inner wall of the electric component receiving groove.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: April 21, 2020
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventors: Sheng-Jie Ding, Shin-Wen Chen, Jing-Wei Li, Jian-Chao Song
  • CAMERA MODULE WITH REDUCED LIGHT LEAKAGE AND ELECTRONIC DEVICE USING SAME
    Publication number: 20200120801
    Abstract: A camera module has a reduced light leakage. The camera module includes a printed circuit board and a mounting bracket mounted on the printed circuit board. The printed circuit board includes a first surface and at least one side surface perpendicularly connected to the first surface. Gaps are formed on the printed circuit board. The gaps extend from the first surface to a thickness direction of the first surface. Bumps are formed on the mounting bracket and correspondingly placed according to the gaps. Each of the bumps is received and fixed in a corresponding one of the gaps.
    Type: Application
    Filed: February 28, 2019
    Publication date: April 16, 2020
    Inventors: JING-WEI LI, SHIN-WEN CHEN, YU-SHUAI LI, SHENG-JIE DING
  • CAMERA MODULE WITH REDUCED LIGHT LEAKAGE AND ELECTRONIC DEVICE USING SAME
    Publication number: 20200120802
    Abstract: A camera module with reduced light leakage includes a printed circuit board and a mounting bracket mounted on the printed circuit board. The printed circuit board includes a first surface and at least one side surface perpendicularly connected to the first surface. A step is defined at the printed circuit board. The step passes through the first surface and at least one side surface. A flange is defined on the mounting bracket. The flange is received and fixed in the step and this structure places less reliance on the strength and opacity of the particular adhesive used.
    Type: Application
    Filed: February 28, 2019
    Publication date: April 16, 2020
    Inventors: JING-WEI LI, SHIN-WEN CHEN, YU-SHUAI LI, JIAN-CHAO SONG
  • LENS MODULE AND LENS PROTECTIVE FILM
    Publication number: 20200103561
    Abstract: A lens protective film includes a base layer, a buffer layer, and a protective layer. The buffer layer and the protective layer are laminated on the base layer. The base layer includes a main body and a first handle extending from the main body. An opening is defined in each of the main body and the buffer layer. The openings of the main body and the buffer layer overlap to form the receiving structure. The receiving structure is used to receive a raised part of a lens. The lens protective film can prevent the buffer layer and the protective layer from being broken and generating debris.
    Type: Application
    Filed: August 2, 2019
    Publication date: April 2, 2020
    Inventors: KUN LI, MING LI, SHIN-WEN CHEN, LONG-FEI ZHANG
  • CAMERA MODULE
    Publication number: 20200089084
    Abstract: A camera module with good heat dissipation efficiency and stability includes a base. The base comprises a first receiving groove. At least one escaping hole is defined at the base and the escaping hole forms a connection between the first receiving groove and the ambient environment. At least one heat dissipation block is received in each escaping hole.
    Type: Application
    Filed: November 27, 2018
    Publication date: March 19, 2020
    Inventors: SHIN-WEN CHEN, JIAN-CHAO SONG, JING-WEI LI, SHENG-JIE DING
  • OPTICAL PROJECTION MODULE WITH IMPROVED HEAT DISSIPATION
    Publication number: 20200089090
    Abstract: An optical projection module with improved heat dissipation includes a circuit board having a first surface and a second surface opposite the first surface. A semiconductor substrate is mounted on the first surface. The semiconductor substrate has a third surface facing the first surface and a fourth surface opposite to the third surface. A light source and an optical member are mounted on the fourth surface. The optical member includes a lens holder. The lens holder defines a receiving space for receiving the light source. The lens holder further defines at least one escaping hole. A heat dissipation block is received in each escaping hole.
    Type: Application
    Filed: November 6, 2018
    Publication date: March 19, 2020
    Inventors: SHUAI-PENG LI, JING-WEI LI, SHIN-WEN CHEN, SHENG-JIE DING
  • Camera module
    Patent number: 10585335
    Abstract: A camera module with good heat dissipation efficiency and stability includes a base. The base comprises a first receiving groove. At least one escaping hole is defined at the base and the escaping hole forms a connection between the first receiving groove and the ambient environment. At least one heat dissipation block is received in each escaping hole.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: March 10, 2020
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Shin-Wen Chen, Jian-Chao Song, Jing-Wei Li, Sheng-Jie Ding
  • CAMERA
    Publication number: 20200073211
    Abstract: A camera includes a bracket, a lens base, a lens, a filter, a circuit board, and a photosensitive, chip. The bracket defines a first receiving space, a second receiving space, and a through hole. The through hole is in communication with the first receiving space and the second receiving space. The lens is mounted on the lens base. The filter is received within the first receiving space. The circuit board is mounted on the side of the bracket defining the second receiving space. The photosensitive chip mounted on the circuit board faces the through hole. The bracket includes a heating member and two conductive circuits. The filter is mounted on the heating member such that a periphery of the filter is in contact with the heating member. Each of the two conductive circuit layers is electrically coupled between the heating member and the circuit board to heat the filter.
    Type: Application
    Filed: November 6, 2018
    Publication date: March 5, 2020
    Inventors: KUN LI, SHIN-WEN CHEN, LONG-FEI ZHANG, XIAO-MEI MA
  • CAMERA
    Publication number: 20200077517
    Abstract: A camera includes a circuit board, an image sensing chip, a package base, a lens module, a flexible circuit board, and a first carrier plate. The circuit board includes a first surface and an opposite second surface. The circuit board defines a window through the first surface and the second surface. The image sensing chip is mounted to the second surface and includes a photosensitive area viewable through the window. The package base is mounted to the first surface and defines a light hole. The lens module is mounted to the package base. The first carrier plate is mounted to the second surface and covers the image sensing chip. The circuit board further includes an end portion not covered by the first carrier plate. The flexible circuit board is mounted to the second surface of the end portion and is electrically coupled to the image sensing chip.
    Type: Application
    Filed: November 6, 2018
    Publication date: March 5, 2020
    Inventors: KUN LI, SHIN-WEN CHEN, YU-SHUAI LI, LONG-FEI ZHANG
  • CAMERA MODULE
    Publication number: 20200076995
    Abstract: A camera module with a strong and stable mounting which is geometrically precise includes a printed circuit board, an optical bearing structure, and an image sensor. The printed circuit board includes a mounting surface, the mounting surface defining a conductive circuit area and a surrounding non-conductive peripheral area. The peripheral area comprises a first contact layer, the first contact layer is frame-like and a size of the first contact layer is same as a size of bottom of the optical bearing structure. The optical bearing structure is on the first contact layer and carries a lens module. The image sensor is mounted on the conductive circuit area.
    Type: Application
    Filed: October 25, 2018
    Publication date: March 5, 2020
    Inventors: DING-NAN HUANG, CHIA-WEI CHEN, SHIN-WEN CHEN
  • CAMERA MODULE
    Publication number: 20200076997
    Abstract: A camera module to retain a smooth and easy focusing movement through components connected together by threads includes a lens bracket and a lens barrel. The lens bracket carries an optical lens and includes sidewall with a first internal thread. The optical lens includes sensor end. The sensor end includes a lateral surface with an external thread which corresponds to the first internal thread. The lateral surface defines several notches extending from the end of the lateral surface down through the external threads to reduce any clamping or high turning resistance between the internal and the external threads.
    Type: Application
    Filed: October 16, 2018
    Publication date: March 5, 2020
    Inventors: YU-SHUAI LI, SHIN-WEN CHEN, KUN LI, LONG-FEI ZHANG
  • CAMERA
    Publication number: 20200064583
    Abstract: A camera includes a bracket, a lens, a filter, a circuit board, a lens base, and a photosensitive chip. The bracket defines a through hole. The lens is mounted on the bracket. The is filter mounted on a side of the bracket and covers the through hole. The circuit board is mounted on a side of the bracket opposite to the filter. The lens base is mounted on the side of the bracket mounted to the filter. The photosensitive chip is mounted on the circuit board and faces the through hole. One of the bracket and the lens base includes a number of positioning members. The other one of the bracket and the lens base defines a number of positioning holes. Each positioning member is received in a corresponding one of the positioning holes.
    Type: Application
    Filed: November 6, 2018
    Publication date: February 27, 2020
    Inventors: SHENG-JIE DING, SHIN-WEN CHEN, JING-WEI LI, JIAN-CHAO SONG
  • Camera module
    Patent number: 10574875
    Abstract: A camera module comprises a circuit board and a base. A circuit board comprises a first surface and a second surface opposite to the first surface. At least one receiving groove is defined in the first surface. The receiving groove has not extended through the second surface. Each the at least one receiving groove receives an electronic component, and a height of the electronic component is less than a depth of the receiving groove. A base is fixed on the top surface. The at least one receiving groove is covered by the base to seal electronic components. A side surface of the base is aligned with a wall of the receiving groove.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: February 25, 2020
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventors: Chia-Wei Chen, Shin-Wen Chen, Ding-Nan Huang