Abstract: A coating and developing system includes a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system is capable of coping with either of a case where antireflection films are formed and a case where any antireflection film is not formed and needs simple software. Film forming unit blocks, namely, a TCT layer B3, a COT layer B4 and a BCT layer B5, and developing unit blocks, namely, DEV layers B1 and B2, are stacked up in layers in a processing block S2. The TCT layer B3, the COT layer B4 and the BCT layer B5 are used selectively in the case where antireflection films are formed and the case where any antireflection film is not formed. The coating and developing system is controlled by a simple carrying program and simple software.

Abstract: An external laser light introducing device is constructed to introduce laser light from outside of an optical apparatus into inside so that the laser light is condensed on a target by a condenser lens located inside the optical apparatus. In this case, the external laser light introducing device comprises a pupil projection optical system for projecting the entrance pupil of the condenser lens on an external pupil located outside the optical apparatus and an optical axis aligning mechanism for practically aligning the optical axis of the laser light with that of the external pupil.

Abstract: Provided is a coating and developing apparatus composed of an assembly of plural unit blocks. A first unit-block stack and a second unit-block stack are arranged at different positions with respect to front-and-rear direction. Unit blocks for development, each of which comprises plural processing units including a developing unit that performs developing process after exposure and a transfer device that transfers a substrate among the processing units, are arranged at the lowermost level. Unit blocks for application, or coating, each of which comprises plural processing units including a coating unit that performs application process before exposure and a transfer device that transfers a substrate among the processing units, are arranged above the unit blocks for development. Unit blocks for application are arranged in both the first and second unit-block stacks.

Abstract: A router includes a label-mapping-message receiving unit, a passing-node managing unit, and a passing-node selecting unit. The label-mapping-message receiving unit receives a label-mapping message including label information and PV TLV information from all adjacent nodes. The passing-node managing unit registers received label information and PV TLV information to manage the information. When a line fault occurs in a network, the passing-node selecting unit selects PV TLV information that does not include an identifier of the router itself from among registered PV TLV information. Thus, an optimal path is determined based on selected PV TLV information so that a loop does not occur in the network.

Abstract: A heating apparatus 2 comprises a housing 20; a flat heating chamber 4 which is provided in the housing 2 and adapted to heat a wafer W used as a substrate, with one side of the heating chamber 4 opening for carrying in and carrying out the wafer; and a heating plates 44, 45 provided in the heating chamber 4 such that the wafer W can be heated from both above and below. A cooling plate 3 is provided in the housing 20 located in the vicinity of the opening of the heating chamber 4, for cooling the wafer W after being heated by the heating plates 44, 45. Additionally, a carrying means is provided in the housing 20 for carrying the wafer W between an upper position of the cooling plate 3 and the interior of the heating chamber 4 such that a heat treatment for the wafer W can be performed with the wafer W being held in the heating chamber 4.

Abstract: Capacitive liquid condition sensing apparatus includes a pair of a 1-1 electrode and a 1-2 electrode arranged to form a first capacitance; a pair of a 2-1 electrode and a 2-2 electrode arranged to form a second capacitance; a circuit board formed with a sensing circuit to sense the liquid condition such as a liquid level in accordance with the first and second capacitances; and 1-1, 1-2, 2-1 and 2-2 conductive paths connecting the 1-1, 1-2, 2-1 and 2-2 electrodes, respectively, to the sensing circuit, and including 1-1, 1-2, 2-1 and 2-2 conductive segments, respectively. The 1-1, 1-2, 2-1 and 2-2 conductive segments are arranged in a row, and extend side by side. The 1-1, 1-2, 2-1 and 2-2 conductive segments are arranged so that a first parasitic capacitance formed between the 1-1 conductive segment and the 1-2 conductive segment is equal to a second parasitic capacitance formed between the 2-1 conductive segment and the 2-2 conductive segment.

Abstract: A substrate processing system processes a plurality of substrates in a single-substrate processing mode by a plurality of processes and provided with a plurality of modules respectively for carrying out processes. When a defect is found in a substrate, a defective processing unit that caused the defect can be easily found out. The substrate processing system and a substrate processing method to be carried out by the substrate processing system can suppress the reduction of throughput when a large number of substrates are to be processed. The substrate processing system is provided with a plurality of modules for processing a plurality of substrates (W) in a single-substrate processing mode by a plurality of processes and includes a substrate carrying means (A4) for carrying a substrate (W) from a sending module to a receiving module, and a control means (6) for controlling the substrate carrying means (A4) on the basis of one of at least two carrying modes each assigning receiving modules to sending modules.

Abstract: In a distributed control system, a first electronic control unit sends trigger information to a second electronic control unit. The trigger information includes a timing that triggers the second electronic unit to obtain second sensor information from a second sensor. The second electronic control unit is designed to receive the trigger information, and obtain, at the timing of the trigger information, the second sensor information from the second sensor. The second electronic unit is configured to send, to the first electronic control unit, the obtained second sensor information.

Abstract: Disclosed is a substrate heating apparatus including a hot plate that heats a substrate, and a cooling plate that supports the substrate and moves between a first position (home position) and the second position above the hot plate to transfer wafers between the two positions. A heat-radiating fin structure is connected to the cooling plate to move together with the cooling plate. The fin structure is thermally connected to the cooling plate via heat pipes. A suction port is arranged so as to locate adjacent to the fin structure when the cooling plate is in the home position. The fin structure is cooled by a gas passing therethrough before flown into the suction port, whereby the cooling plate is cooled through heat transfer from the cooling plate to the fin structure through the heat pipes.

Abstract: An engine oil deterioration detection apparatus includes a sensing capacitor CS formed of paired electrodes dipped into engine oil whose deterioration is to be detected, the engine oil deterioration detection apparatus detecting deterioration of the engine oil on the basis of a change in electrostatic capacitance of the sensing capacitor CS. A measurement signal generation circuit generates a measurement signal to be supplied to the sensing capacitor CS. A detection signal output circuit outputs a detection signal on the basis of a response wave signal produced from the sensing capacitor CS in response to supply of the measurement signal thereto, the detection signal reflecting the electrostatic capacitance of the sensing capacitor CS. A temperature compensation mechanism is provided to compensate for a level change of the detection signal stemming from a temperature characteristic and/or a time-course deterioration of the detection signal output circuit.

Abstract: The microscope has a first pulsed laser generating means, a second pulsed laser generating means, an irradiation means to irradiate to a specimen by composing the first pulse light and the second pulse light, a coherent Raman scattering light extraction means for extracting only the coherent Raman scattering light from light emanated from the specimen irradiated, an extraction means for extracting only the multiphoton excitation fluorescence, an extraction means for extracting only the second harmonic wave, a detection means for detecting the extracted coherent Raman scattering light, and a detection means for detecting the extracted fluorescence, and a detection means for detecting the second harmonic wave via the extraction means 7. To single specimen, responding to purposes, observations of the two-photon excitation fluorescence observation, the second harmonic wave observation, and the coherent Raman scattering light observations can be carried out in parallel, or selectively.

Abstract: A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.

Abstract: A block for coating film formation and a block for a development process are stacked. A delivery stage to effect delivery of a substrate with a transportation unit for use in a block is provided for each process block at the carrier block side to constitute a shelf-type delivery stage group. A vertical transportation unit is provided to transport a substrate between the delivery stages in the delivery stage group. A substrate inspection unit is disposed at an upper empty space of the carrier block. A substrate is input to the substrate inspection unit directly by the vertical transportation unit or via a delivery stage in the delivery stage group. The substrate inspection unit may be disposed in the delivery stage group.

Abstract: A coating and developing system is constructed so as to enable the maintenance of an exposure system combined therewith at desired time. The coating and developing system carries a substrate delivered to a carrier handling block to a processing block to form a film on the substrate by a coating block included in the processing block, carries the substrate through an interface block to the exposure system, processes the substrate having the exposed film by a developing process by a developing block included in the processing block and returns the thus processed substrate to the carrier handling block. A direct carrying means is superposed on the coating block and the developing block to carry a substrate having a surface coated with a film from the carrier handling block directly to the interface block. A test substrate can be carried to the exposure system to inspect the condition of the exposure system even in a state where the coating block and the developing block are under maintenance work.

Abstract: A coating/developing device includes a processing block having a plurality of coating unit blocks stacked and a developing unit block stacked on the coating unit blocks. Each of the unit blocks is provided with a liquid processing unit for coating a liquid chemical on a substrate, a heating unit for heating the substrate, a cooling unit for cooling the substrate and a transfer unit for transferring the substrate between the units. The liquid processing unit is provided with a coating unit for coating a resist liquid on the substrate, a first bottom antireflection coating (BARC) forming unit for coating a liquid chemical for a BARC on the substrate before the resist liquid is coated thereon, and a second BARC forming unit for coating a liquid chemical for the BARC on the substrate after the resist liquid is coated thereon.

Abstract: A coating and developing system is constructed so as to enable the maintenance of an exposure system combined therewith at desired time. The coating and developing system carries a substrate delivered to a carrier handling block to a processing block to form a film on the substrate by a coating block included in the processing block, carries the substrate through an interface block to the exposure system, processes the substrate having the exposed film by a developing process by a developing block included in the processing block and returns the thus processed substrate to the carrier handling block. A direct carrying means is superposed on the coating block and the developing block to carry a substrate having a surface coated with a film from the carrier handling block directly to the interface block. A test substrate can be carried to the exposure system to inspect the condition of the exposure system even in a state where the coating block and the developing block are under maintenance work.

Abstract: A semiconductor manufacturing apparatus includes a transfer mechanism including a moving part for holding a substrate to be processed and moving along a longitudinal transferring passage and a plurality of processing units for performing respective processes on the substrate. The processing units are disposed along the transferring passage and the substrate is transferred between the processing units and the transfer mechanism. An exhaust chamber is provided under the processing units, the exhaust chamber having a gas exhaust opening at the side of the transferring passage, the exhaust chamber. Further, a suction exhaust line is connected to the exhaust chamber, and a guide member is provided inside the exhaust chamber or at a position facing the opening, wherein the guide member extends along the transferring passage.

Abstract: In the present invention, a plurality of exhaust paths connected to a plurality of cup bodies surrounding substrate holding portions respectively are joined together for common use, and the openings of exhaust rate adjustment sections provided on the exhaust paths are adjusted with reference to data in which combinations of the numbers of rotations of the substrate holding portions are associated with combinations of set exhaust rates of the exhaust paths when solution treatment is performed by rotating the substrate by the substrate holding portion. According to the present invention, the cup body can be exhausted at an intended exhaust rate at all times independently of the state where the substrate in which cup body is subjected to which process.

Abstract: A coating and developing system includes a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system is capable of coping with either of a case where antireflection films are formed and a case where any antireflection film is not formed and needs simple software. Film forming unit blocks, namely, a TCT layer B3, a COT layer B4 and a BCT layer B5, and developing unit blocks, namely, DEV layers B1 and B2, are stacked up in layers in a processing block S2. The TCT layer B3, the COT layer B4 and the BCT layer B5 are used selectively in the case where antireflection films are formed and the case where any antireflection film is not formed. The coating and developing system is controlled by a simple carrying program and simple software.

Abstract: A coating and developing apparatus comprises a process block which forms a resist film on a wafer, then transfers the wafer to an exposure apparatus, and performs a developing process on the wafer after exposure, and an interface transfer mechanism provided between the process block and the exposure apparatus. The process block includes unit blocks for coating-film formation and unit blocks for development laid out in a stacked manner. When an abnormality occurs in the interface transfer mechanism, an ordinary process in the unit block for coating-film formation is performed on those substrates which are present in that unit block for coating-film formation, after which processed wafers are retreated to a retaining unit and transfer of any wafer into the unit block for coating-film formation is inhibited.