Patents by Inventor Shinichi Yotsuya

Shinichi Yotsuya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6603159
    Abstract: The present invention provides a mask for use in forming a thin-layer pattern of an organic electroluminescence element having high-precision pixels. The mask is manufactured by wet-etching a (100) silicon wafer (single crystal silicon substrate) in a crystal orientation-dependent anisotropic fashion so as to form through-holes having (111)-oriented walls serving as apertures corresponding to a thin-layer pattern to be formed.
    Type: Grant
    Filed: January 24, 2002
    Date of Patent: August 5, 2003
    Assignee: Seiko Epson Corporation
    Inventors: Mitsuro Atobe, Shinichi Kamisuki, Ryuichi Kurosawa, Shinichi Yotsuya
  • Patent number: 6563079
    Abstract: A method for processing a work in which a processed hole with a high aspect ratio is formed by laser machining. Silicon oxide films (2) are formed as protective films on front and rear surfaces, respectively, of a silicon substrate (1). The silicon substrate (1) is irradiated with a laser light through the protective films (2) to thereby perform a perforating process. Alternatively, the silicon substrate (1) is irradiated with a circularly or randomly polarized laser light. Hence, a processed hole with a high aspect ratio can be obtained. Moreover, the processed hole can be shaped straightly, so that processing accuracy is improved.
    Type: Grant
    Filed: October 23, 2000
    Date of Patent: May 13, 2003
    Assignee: Seiko Epson Corporation
    Inventors: Kazushige Umetsu, Jun Amako, Shinichi Yotsuya, Katsuji Arakawa
  • Publication number: 20030059690
    Abstract: A method of manufacturing a mask includes attaching to a first substrate formed with an opening a second substrate formed with a plurality of penetrating holes. The plurality of penetrating holes are disposed inside the opening. The first substrate and the second substrate may be joined together by anode coupling. First and second alignment marks may be used for positioning the second substrate and the first substrate when attaching the second substrate to the first substrate.
    Type: Application
    Filed: September 20, 2002
    Publication date: March 27, 2003
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Shinichi Yotsuya
  • Publication number: 20030061593
    Abstract: A method of manufacturing a mask includes: attaching a second substrate having a plurality of penetrating holes to a first substrate having an opening. The second substrate is attached such that the penetrating holes are positioned within the opening. A groove is formed on a surface of the first substrate facing the second substrate. The groove is utilized to form a flow path between the first and second substrates.
    Type: Application
    Filed: September 20, 2002
    Publication date: March 27, 2003
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Shinichi Yotsuya
  • Publication number: 20030054646
    Abstract: A mask has a monocrystal substrate having opposite surfaces which are planes having Miller indices {110}. A plurality of penetrating holes are formed in the monocrystal substrate. An opening shape of each of the penetrating holes is a polygon and each side of the polygon is parallel with a plane in a group of the {111} planes. The wall surfaces of the penetrating holes are the {111} planes. In the method of manufacturing a mask, openings are formed in the etching resistant film corresponding to the shape of the penetrating holes and the monocrystal substrate is etched.
    Type: Application
    Filed: September 19, 2002
    Publication date: March 20, 2003
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Shinichi Yotsuya
  • Publication number: 20030016435
    Abstract: A spatial light modulator is constructed from a conductive silicon mirror substrate and a glass electrode substrate including sodium, anode-bonded together. The silicon mirror substrate has micromirrors arranged in a matrix, torsion bars coupling these micromirrors in the x-direction, and a frame coupled to both ends of the torsion bars. A glass electrode substrate has a central depression, a rim around the periphery thereof, pillars projecting from within the depression, and electrodes and wiring driving micromirrors formed within the depression in an inclining manner. Both ends of the torsion bars are bonded to the rim of the frame portion, and intermediate portions of the torsion bars are bonded to the pillars. Both ends of the torsion bars are cut away from the frame portion during dicing.
    Type: Application
    Filed: July 11, 2002
    Publication date: January 23, 2003
    Inventors: Mitsuro Atobe, Hiroshi Koeda, Shinichi Yotsuya
  • Patent number: 6469832
    Abstract: A microlens substrate 1 includes a transparent substrate 2 provided with a plurality of concavities 3 having concave surfaces, an outer layer 8 bonded to the transparent substrate 2 at a surface thereof provided with the concavities 3 via a resin layer 9, and spacers 5 for regulating the thickness of the resin layer 9. The resin layer 9 includes microlenses 4 formed with a resin filling the concavities 3. The spacers 5 include globular particles. The standard deviation of particle-size distribution of the spacers 5 is preferably not greater than 20% of an average particle size of the spacers 5. The density of the spacers 5 is preferably in the order of 0.5 to 2.0 g/cm3. A value &rgr;1/&rgr;2 is preferably in the order of 0.6 to 1.4, in which &rgr;1 denotes the density (g/cm3) of the spacers 5, and &rgr;2 denotes the density (g/cm3) of a resin forming the resin layer 9.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: October 22, 2002
    Assignee: Seiko Epson Corporation
    Inventors: Shinichi Yotsuya, Nobuo Shimizu, Hideto Yamashita
  • Publication number: 20020151169
    Abstract: A semiconductor chip having a vertical current conduction structure of a high reliability: a semiconductor device, a circuit substrate, and an electronic apparatus each containing such semiconductor chips; and a method for producing them. A prehole (3) is formed in a silicon substrate (10) surface-oriented to a (100) face by laser beam irradiation. The prehole (3) is enlarged by anisotropic etching to thereby form a through-hole (4). An electrically insulating film is formed on an inner wall of the through-hole (4).
    Type: Application
    Filed: June 12, 2002
    Publication date: October 17, 2002
    Applicant: Seiko Epson Corporation
    Inventors: Kazushige Umetsu, Jun Amako, Shinichi Yotsuya, Katsuji Arakawa
  • Patent number: 6452712
    Abstract: A spatial light modulator is constructed from a conductive silicon mirror substrate and a glass electrode substrate including sodium, anode-bonded together. The silicon mirror substrate has micromirrors arranged in a matrix, torsion bars coupling these micromirrors in the x-direction, and a frame coupled to both ends of the torsion bars. A glass electrode substrate has a central depression, a rim around the periphery thereof, pillars projecting from within the depression, and electrodes and wiring driving micromirrors formed within the depression in an inclining manner. Both ends of the torsion bars are bonded to the rim of the frame portion, and intermediate portions of the torsion bars are bonded to the pillars. Both ends of the torsion bars are cut away from the frame portion during dicing.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: September 17, 2002
    Assignee: Seiko Epson Corporation
    Inventors: Mitsuro Atobe, Hiroshi Koeda, Shinichi Yotsuya
  • Publication number: 20020111035
    Abstract: A mask is disclosed for use in forming a thin-layer pattern of an organic electroluminescence element having high-precision pixels. The mask is manufactured by wet-etching a (100) silicon wafer (single crystal silicon substrate) 1 in a crystal orientation-dependent anisotropic fashion so as to form through-holes 11 having (111)-oriented walls 11a serving as apertures corresponding to a thin-layer pattern to be formed.
    Type: Application
    Filed: January 24, 2002
    Publication date: August 15, 2002
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Mitsuro Atobe, Shinichi Kamisuki, Ryuichi Kurosawa, Shinichi Yotsuya
  • Patent number: 6424048
    Abstract: A semiconductor chip having a vertical current conduction structure of a high aspect ratio and high reliability: a semiconductor device, a circuit substrate, and an electronic apparatus each containing such semiconductor chips; and a method for producing them. A prehole (3) is formed in a silicon substrate (10) surface-oriented to a (100) face by laser beam irradiation. The prehole (3) is enlarged by anisotropic etching to thereby form a through-hole (4). An electrically insulating film is formed on an inner wall of the through-hole (4). An electrically conducting material is provided inside the insulating film to thereby form a metal bump (30).
    Type: Grant
    Filed: August 14, 2000
    Date of Patent: July 23, 2002
    Assignee: Seiko Epson Corporation
    Inventors: Kazushige Umetsu, Jun Amako, Shinichi Yotsuya, Katsuji Arakawa
  • Patent number: 6407866
    Abstract: A microlens substrate 1 includes a glass substrate 2 provided with a number of concavities 3 for microlenses, and a glass layer 8 bonded via a resin layer 9 to the glass substrate 2 at a surface thereof provided with the concavities 3. In the resin layer 9, microlenses 4 are formed with a resin filling the concavities 3. The resin layer 9 is formed by curing a resin having a viscosity before curing of not higher than 500 cP at 25° C., particularly an ultraviolet curable resin. An index of refraction n of the resin layer 9 is preferably not lower than 1.35.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: June 18, 2002
    Assignee: Seiko Epson Corporation
    Inventors: Hideto Yamashita, Nobuo Shimizu, Shinichi Yotsuya
  • Publication number: 20020027715
    Abstract: The present invention provides a micro-lens substrate wherein a higher contrast ratio can be obtained when used in a liquid crystal panel and the like. A micro-lens substrate includes a first substrate with concaves for microlenses having a plurality of first concaves and first alignment marks formed on a first glass substrate, a second substrate with concaves for microlenses having a plurality of second concaves and second alignment marks formed on a second glass substrate, a resin layer, microlenses comprised of double convex lenses formed of a resin filled in between the first and second concaves, and spacers.
    Type: Application
    Filed: April 10, 2001
    Publication date: March 7, 2002
    Applicant: Seiko Epson Corporation
    Inventors: Nobuo Shimizu, Shinichi Yotsuya, Hideto Yamashita, Masami Murata, Koichi Akiyama
  • Publication number: 20020021386
    Abstract: An object is to provide a microlens substrate capable of regulating the thickness of a resin layer with high accuracy.
    Type: Application
    Filed: December 22, 2000
    Publication date: February 21, 2002
    Inventors: Shinichi Yotsuya, Nobuo Shimizu, Hideto Yamashita
  • Publication number: 20010055146
    Abstract: A spatial light modulator is constructed from a conductive silicon mirror substrate and a glass electrode substrate including sodium, anode-bonded together. The silicon mirror substrate has micromirrors arranged in a matrix, torsion bars coupling these micromirrors in the x-direction, and a frame coupled to both ends of the torsion bars. A glass electrode substrate has a central depression, a rim around the periphery thereof, pillars projecting from within the depression, and electrodes and wiring driving micromirrors formed within the depression in an inclining manner. Both ends of the torsion bars are bonded to the rim of the frame portion, and intermediate portions of the torsion bars are bonded to the pillars. Both ends of the torsion bars are cut away from the frame portion during dicing.
    Type: Application
    Filed: June 29, 2001
    Publication date: December 27, 2001
    Inventors: Mitsuro Atobe, Hiroshi Koeda, Shinichi Yotsuya
  • Patent number: 6271955
    Abstract: A spatial light modulator is constructed from a conductive silicon mirror substrate and a glass electrode substrate including sodium, anode-bonded together. The silicon mirror substrate has micromirrors arranged in a matrix, torsion bars coupling these micromirrors in the x-direction, and a frame coupled to both ends of the torsion bars. A glass electrode substrate has a central depression, a rim around the periphery thereof, pillars projecting from within the depression, and electrodes and wiring driving micromirrors formed within the depression in an inclining manner. Both ends of the torsion bars are bonded to the rim of the frame portion, and intermediate portions of the torsion bars are bonded to the pillars. Both ends of the torsion bars are cut away from the frame portion during dicing.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: August 7, 2001
    Assignee: Seiko Epson Corporation
    Inventors: Mitsuro Atobe, Hiroshi Koeda, Shinichi Yotsuya
  • Patent number: 6120124
    Abstract: An ink jet recording apparatus capable of ejecting ink droplets in which the volume is precisely and easily controlled. The gradient of the pixel to be printed, based on a digital gradient input signal, is provided for printing high resolution gradient images using a low drive voltage in this ink jet head. More specifically, the ink jet recording apparatus of the present invention will include a diaphragm formed at one part of a wall of each independent ejection chamber, with electrodes formed opposite each diaphragm and spaced therefrom at a predetermined gap distance. Ink droplets are selectively ejected from nozzle openings in the ejection chamber by applying a voltage to generate an electrostatic force which momentarily deforms the diaphragm. Moreover, plurality of independent electrodes oppose each diaphragm and a pulse voltage is applied to a predetermined number of electrodes according to a gradient signal to eject ink droplets of a volume determined by the gradient signal.
    Type: Grant
    Filed: September 25, 1997
    Date of Patent: September 19, 2000
    Assignee: Seiko Epson Corporation
    Inventors: Mitsuro Atobe, Hiroshi Koeda, Shinichi Yotsuya
  • Patent number: 6117698
    Abstract: A laminated, multi-substrate ink jet head and methods creating the same, wherein the ink jet head includes nozzle holes, emitting chambers respectively led to the nozzle holes, diaphragms formed on a wall of the emitting chambers, a common ink cavity for supplying ink to the emitting chambers through orifices and electrodes placed so as to face to the diaphragms so as to drive the diaphragms by static electricity. The lower substrate which forms the electrodes may include a plurality of indentations for mounting the electrode therein to serve as a gap spacing element for respective diaphragm/electrode pairs when the head is assembled. Alternatively, areas immediately beneath the diaphragm may be etched away to expand the vibrating chamber to a predetermined gap distance, or a membrane of a predetermined thickness may interpose the respective diaphragm and electrode substrates.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: September 12, 2000
    Assignee: Seiko Epson Corporation
    Inventors: Mitsuro Atobe, Shinichi Kamisuki, Shinichi Yotsuya, Hiroshi Koeda, Yoshihiro Ohno, Hitoshi Tanbo
  • Patent number: 6113218
    Abstract: A laminated, multi-substrate ink jet head and methods creating the same, wherein the ink jet head includes nozzle holes, emitting chambers respectively led to the nozzle holes, diaphragms formed on a wall of the emitting chambers, a common ink cavity for supplying ink to the emitting chambers through orifices and electrodes placed so as to face to the diaphragms so as to drive the diaphragms by static electricity. The lower substrate which forms the electrodes may include a plurality of indentations for mounting the electrode therein to serve as a gap spacing element for respective diaphragm/electrode pairs when the head is assembled. Alternatively, areas immediately beneath the diaphragm may be etched away to expand the vibrating chamber to a predetermined gap distance, or a membrane of a predetermined thickness may interpose the respective diaphragm and electrode substrates.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: September 5, 2000
    Assignee: Seiko Epson Corporation
    Inventors: Mitsuro Atobe, Shinichi Kamisuki, Shinichi Yotsuya, Hiroshi Koeda, Yoshihiro Ohno, Hitoshi Tanbo
  • Patent number: 6107115
    Abstract: A spatial light modulator is constructed from a conductive silicon mirror substrate and a glass electrode substrate including sodium, anode-bonded together. The silicon mirror substrate has micromirrors arranged in a matrix, torsion bars coupling these micromirrors in the x-direction, and a frame coupled to both ends of the torsion bars. A glass electrode substrate has a central depression, a rim around the periphery thereof, pillars projecting from within the depression, and electrodes and wiring driving micromirrors formed within the depression in an inclining manner. Both ends of the torsion bars are bonded to the rim of the frame portion, and intermediate portions of the torsion bars are bonded to the pillars. Both ends of the torsion bars are cut away from the frame portion during dicing.
    Type: Grant
    Filed: September 17, 1999
    Date of Patent: August 22, 2000
    Assignee: Seiko Epson Corporation
    Inventors: Mitsuro Atobe, Hiroshi Koeda, Shinichi Yotsuya