Patents by Inventor Shinji Baba
Shinji Baba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9171791Abstract: This invention provides a multi-pin semiconductor device as a low-cost flip-chip BGA. In the flip-chip BGA, a plurality of signal bonding electrodes in a peripheral area of the upper surface of a multilayer wiring substrate are separated into inner and outer ones and a plurality of signal through holes coupled to a plurality of signal wirings drawn inside are located between a plurality of rows of signal bonding electrodes and a central region where a plurality of bonding electrodes for core power supply are located so that the chip pad pitch can be decreased and the cost of the BGA can be reduced without an increase in the number of layers in the multilayer wiring substrate.Type: GrantFiled: April 9, 2014Date of Patent: October 27, 2015Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Shinji Baba, Toshihiro Iwasaki, Masaki Watanabe
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Patent number: 9171814Abstract: To improve coupling reliability in flip chip bonding of a semiconductor device. By using, in the fabrication of a semiconductor device, a wiring substrate in which a wiring that crosses an opening area of a solder resist film on the upper surface of the wiring substrate has, on one side of the wiring, a bump electrode and, on the other side, a plurality of wide-width portions having no bump electrode thereon, a solder on the wiring can be dispersed to each of the wide-width portions during reflow treatment in a solder precoating step. Such a configuration makes it possible to reduce a difference in height between the solder on each of terminals and the solder on each of the wide-width portions and to enhance the coupling reliability in flip chip bonding.Type: GrantFiled: March 11, 2015Date of Patent: October 27, 2015Assignee: Renesas Electronics CorporationInventors: Masaki Watanabe, Shinji Baba, Muneharu Tokunaga, Toshihiro Iwasaki
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Publication number: 20150187720Abstract: To improve coupling reliability in flip chip bonding of a semiconductor device. By using, in the fabrication of a semiconductor device, a wiring substrate in which a wiring that crosses an opening area of a solder resist film on the upper surface of the wiring substrate has, on one side of the wiring, a bump electrode and, on the other side, a plurality of wide-width portions having no bump electrode thereon, a solder on the wiring can be dispersed to each of the wide-width portions during reflow treatment in a solder precoating step. Such a configuration makes it possible to reduce a difference in height between the solder on each of terminals and the solder on each of the wide-width portions and to enhance the coupling reliability in flip chip bonding.Type: ApplicationFiled: March 11, 2015Publication date: July 2, 2015Inventors: Masaki Watanabe, Shinji Baba, Muneharu Tokunaga, Toshihiro Iwasaki
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Publication number: 20150118801Abstract: To provide a semiconductor device characterized in that lands for mounting thereon solder balls placed in an inner area of a chip mounting area have an NSMD structure. This means that lands for mounting thereon solder balls placed in an area of the back surface of a through-hole wiring board overlapping with a chip mounting area in a plan view have an NSMD structure. According to the invention, a semiconductor device to be mounted on a mounting substrate with balls has improved reliability.Type: ApplicationFiled: January 6, 2015Publication date: April 30, 2015Inventors: Kozo HARADA, Shinji BABA, Masaki WATANABE, Satoshi YAMADA
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Publication number: 20150099331Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: ApplicationFiled: December 12, 2014Publication date: April 9, 2015Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
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Patent number: 8994175Abstract: To improve coupling reliability in flip chip bonding of a semiconductor device. By using, in the fabrication of a semiconductor device, a wiring substrate in which a wiring that crosses an opening area of a solder resist film on the upper surface of the wiring substrate has, on one side of the wiring, a bump electrode and, on the other side, a plurality of wide-width portions having no bump electrode thereon, a solder on the wiring can be dispersed to each of the wide-width portions during reflow treatment in a solder precoating step. Such a configuration makes it possible to reduce a difference in height between the solder on each of terminals and the solder on each of the wide-width portions and to enhance the coupling reliability in flip chip bonding.Type: GrantFiled: December 24, 2013Date of Patent: March 31, 2015Assignee: Renesas Electronics CorporationInventors: Masaki Watanabe, Shinji Baba, Muneharu Tokunaga, Toshihiro Iwasaki
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Patent number: 8963327Abstract: A semiconductor device includes lands having an NSMD (non-solder mask defined) structure for mounting thereon solder balls placed in an inner area of a chip mounting area. The lands for mounting thereon solder balls are placed in an area of the back surface of a through-hole wiring board overlapping with a chip mounting area in a plan view. The semiconductor device is mounted on a mounting substrate with the balls.Type: GrantFiled: April 26, 2013Date of Patent: February 24, 2015Assignee: Renesas Electronics CorporationInventors: Kozo Harada, Shinji Baba, Masaki Watanabe, Satoshi Yamada
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Patent number: 8928147Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substract, a semiconductor chip by which the flip chip was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: GrantFiled: July 22, 2014Date of Patent: January 6, 2015Assignee: Renesas Electronics CorporationInventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
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Publication number: 20140333167Abstract: There is provided an alternating current generator for a vehicle, including: a rotor (1), a flywheel (3), and main magnets (4) and auxiliary magnets (5) alternately arranged; and a stator (2). Each of the main magnets (4) is magnetized to an N-pole and an S-pole in a radial direction, whereas the main magnets (4) are arranged so that the main magnets (4) adjacent to each other through corresponding one of the auxiliary magnets (5) therebetween are magnetized to have opposite polarity patterns. Each of the auxiliary magnets (5) is magnetized to the N-pole and the S-pole in the circumferential direction, whereas the auxiliary magnets (5) are arranged so that the auxiliary magnets (5) adjacent to each other through corresponding one of the main magnets (4) therebetween are magnetized to have opposite polarity patterns.Type: ApplicationFiled: October 2, 2013Publication date: November 13, 2014Applicant: Mitsubishi Electric CorporationInventors: Shingo AKAMATSU, Shinji BABA
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Publication number: 20140327137Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.Type: ApplicationFiled: July 22, 2014Publication date: November 6, 2014Inventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
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Publication number: 20140284789Abstract: To improve coupling reliability in flip chip bonding of a semiconductor device. By using, in the fabrication of a semiconductor device, a wiring substrate in which a wiring that crosses an opening area of a solder resist film on the upper surface of the wiring substrate has, on one side of the wiring, a bump electrode and, on the other side, a plurality of wide-width portions having no bump electrode thereon, a solder on the wiring can be dispersed to each of the wide-width portions during reflow treatment in a solder precoating step. Such a configuration makes it possible to reduce a difference in height between the solder on each of terminals and the solder on each of the wide-width portions and to enhance the coupling reliability in flip chip bonding.Type: ApplicationFiled: December 24, 2013Publication date: September 25, 2014Applicant: Renesas Electronics CorporationInventors: Masaki Watanabe, Shinji Baba, Muneharu Tokunaga, Toshihiro Iwasaki
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Patent number: 8822269Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: GrantFiled: October 2, 2013Date of Patent: September 2, 2014Assignee: Renesas Electronics CorporationInventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba
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Publication number: 20140217582Abstract: This invention provides a multi-pin semiconductor device as a low-cost flip-chip BGA. In the flip-chip BGA, a plurality of signal bonding electrodes in a peripheral area of the upper surface of a multilayer wiring substrate are separated into inner and outer ones and a plurality of signal through holes coupled to a plurality of signal wirings drawn inside are located between a plurality of rows of signal bonding electrodes and a central region where a plurality of bonding electrodes for core power supply are located so that the chip pad pitch can be decreased and the cost of the BGA can be reduced without an increase in the number of layers in the multilayer wiring substrate.Type: ApplicationFiled: April 9, 2014Publication date: August 7, 2014Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Shinji BABA, Toshihiro IWASAKI, Masaki WATANABE
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Patent number: 8729709Abstract: This invention provides a multi-pin semiconductor device as a low-cost flip-chip BGA. In the flip-chip BGA, a plurality of signal bonding electrodes in a peripheral area of the upper surface of a multilayer wiring substrate are separated into inner and outer ones and a plurality of signal through holes coupled to a plurality of signal wirings drawn inside are located between a plurality of rows of signal bonding electrodes and a central region where a plurality of bonding electrodes for core power supply are located so that the chip pad pitch can be decreased and the cost of the BGA can be reduced without an increase in the number of layers in the multilayer wiring substrate.Type: GrantFiled: January 12, 2011Date of Patent: May 20, 2014Assignee: Renesas Electronics CorporationInventors: Shinji Baba, Toshihiro Iwasaki, Masaki Watanabe
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Publication number: 20140115875Abstract: A method of manufacturing a stator of an electric rotating machine is provided. The stator includes a plurality of teeth radially extended from a yoke portion formed by stacking steel sheets, a stator core having an insulating film on a surface of the teeth, and a winding portion including a plurality of layers of a power generating coil wound around each of the plurality of teeth. The method includes: a step of forming an insulating coating film by impregnating the power generating coil in a lower layer portion of the winding portion with a varnish using a liquid-type thermosetting resin, thereafter covering the power generating coil in a surface portion of the winding portion with a thermally meltable powder resin, and melt-bonding and thereafter curing the powder resin; and a step of curing the varnish that is performed simultaneously with the step of forming an insulating coating film.Type: ApplicationFiled: April 25, 2013Publication date: May 1, 2014Applicant: MITSUBISHI ELECTRIC CORPORATIONInventor: Shinji BABA
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Publication number: 20140038361Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: ApplicationFiled: October 2, 2013Publication date: February 6, 2014Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Eiji HAYASHI, Kyo GO, Kozo HARADA, Shinji BABA
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Publication number: 20140008798Abstract: A technique capable of improving reliability of a semiconductor device is provided. In the present invention, as a wiring board on which a semiconductor chip is mounted, a build-up wiring board is not used but a through wiring board THWB is used. In this manner, in the present invention, the through wiring board formed of only a core layer is used, so that it is not required to consider a difference in thermal expansion coefficient between a build-up layer and the core layer, and besides, it is not required either to consider the electrical disconnection of a fine via formed in the build-up layer because the build-up layer does not exist. As a result, according to the present invention, the reliability of the semiconductor device can be improved while a cost is reduced.Type: ApplicationFiled: March 22, 2011Publication date: January 9, 2014Inventors: Shinji Baba, Masaki Watanabe, Muneharu Tokunaga, Kazuyuki Nakagawa
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Publication number: 20130299970Abstract: To provide a semiconductor device characterized in that lands for mounting thereon solder balls placed in an inner area of a chip mounting area have an NSMD structure. This means that lands for mounting thereon solder balls placed in an area of the back surface of a through-hole wiring board overlapping with a chip mounting area in a plan view have an NSMD structure. According to the invention, a semiconductor device to be mounted on a mounting substrate with balls has improved reliability.Type: ApplicationFiled: April 26, 2013Publication date: November 14, 2013Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Kozo HARADA, Shinji BABA, Masaki WATANABE, Satoshi YAMADA
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Patent number: 8580620Abstract: To aim at improvement of reliability of a semiconductor device of flip chip connection type. In assembling a BGA of flip chip connection type, when a semiconductor chip is solder-connected by a flip chip connection, because solder precoat is formed on the surface of a land on the side of an undersurface of a wiring substrate, the connection between the land and a solder ball, which is an external terminal, is solder-connection, and therefore, it is possible to increase impact resistance of a connection part between the land and the solder ball and to aim at improvement of reliability of the BGA.Type: GrantFiled: August 10, 2010Date of Patent: November 12, 2013Assignee: Renesas Electronics CorporationInventors: Kazuyuki Nakagawa, Shinji Baba, Satoshi Yamada, Takashi Karashima
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Patent number: 8581410Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.Type: GrantFiled: April 15, 2013Date of Patent: November 12, 2013Assignee: Renesas Electronics CorporationInventors: Eiji Hayashi, Kyo Go, Kozo Harada, Shinji Baba