Abstract: A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconductor chip being electrically connected to the BGA substrate by metal wires; and chip capacitors mounted on the semiconductor chip to reduce power source noise.

Abstract: A three-phase alternating current generator includes a bowl-shaped flywheel, sixteen permanent magnets provided on an inner circumferential surface of the flywheel, and a stator located in the flywheel. Further, The stator is composed of twelve teeth provided opposite to the permanent magnets and of coils each being continuously wound around every three teeth among the teeth for generating electric power by an electromagnetic induction effect with the magnets.

Abstract: A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconductor chip being electrically connected to the BGA substrate by metal wires; and chip capacitors mounted on the semiconductor chip to reduce power source noise.

Abstract: Two end plates of a stator core are made of a metal material to increase their rigidity and thereby hold, in a prescribed shape, generation coils that are wound on teeth of the stator core. To increase the insulation between the generation coils and the teeth, the circumferential width of a first portion, extending in the radial direction, of each of the end plates is made smaller than that of a corresponding first portion of a laminated core. At least a second portion of at least one of the two end plates is made of a non-magnetic metal material, whereby the magnetic loss is reduced and the temperature characteristic and the power generation characteristic are improved.

Abstract: A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconductor chip being electrically connected to the BGA substrate by metal wires; and chip capacitors mounted on the semiconductor chip to reduce power source noise.

Abstract: A magneto-generator, a method of manufacturing the same and a resin molding die for manufacturing the same. In the magneto-generator, a guard ring is omitted with the performance of the magneto-generator being enhanced. The magneto-generator is manufactured by making use of a resin molding die (21) having an outer peripheral surface (21d) to be positioned in opposition to an inner peripheral surface of a flywheel (11) and projections (21a) provided in the outer peripheral surface (21d) for holding a plurality of magnets (12) at predetermined positions, respectively. The magnets (12) are positioned and held stationarily at predetermined positions by the aforementioned projections, respectively, and spaces defined between the resin molding die (21) and the inner peripheral surface of the flywheel (11) are filled with a resin. After hardening of the resin, the resin molding die (21) is detached from the flywheel (11).

Abstract: A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconductor chip being electrically connected to the BGA substrate by metal wires; and chip capacitors mounted on the semiconductor chip to reduce power source noise.

Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.

Abstract: A magneto-generator, a method of manufacturing the same and a resin molding die for manufacturing the same. In the magneto-generator, a guard ring is omitted with the performance of the magneto-generator being enhanced. The magneto-generator is manufactured by making use of a resin molding die (21) having an outer peripheral surface (21d) to be positioned in opposition to an inner peripheral surface of a flywheel (11) and projections (21a) provided in the outer peripheral surface (21d) for holding a plurality of magnets (12) at predetermined positions, respectively. The magnets (12) are positioned and held stationarily at predetermined positions by the aforementioned projections, respectively, and spaces defined between the resin molding die (21) and the inner peripheral surface of the flywheel (11) are filled with a resin. After hardening of the resin, the resin molding die (21) is detached from the flywheel (11).

Abstract: A plurality of chips are mounted on a substrate, coupling portions between the chips and the substrate are sealed, the chips have rear surfaces thereof collectively polished, and the substrate with the chips thereon are separated into independent semiconductor devices.

Abstract: In a semiconductor device comprising a semiconductor chip, electrodes formed on the major surface of the semiconductor chip, and a wiring board for mounting the semiconductor chip, for example, wirings for electrically connecting the wirings of the wiring board to the electrodes are provided. As the wirings, those relaxing stress generated between the semiconductor chip and the wiring board are used.

Abstract: A method of manufacturing a semiconductor module includes the steps of producing semiconductor devices of substantially the same thickness by forming respective resin portions covering respective semiconductor elements, mounting the semiconductor devices on a module substrate, covering inner bumps of the semiconductor devices with an encapsulating resin, providing a heat radiation plate over the semiconductor devices, and providing external electrodes on the rear surface of the module substrate.

Abstract: A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconductor chip being electrically connected to the BGA substrate by metal wires; and chip capacitors mounted on the semiconductor chip to reduce power source noise.

Abstract: A first semiconductor chip is disposed in an opening of a package substrate, and a second semiconductor chip is disposed so as to face the first semiconductor chip and interconnected through a bump. The second semiconductor chip is electrically connected to a plurality of input terminals of the package substrate through the bump. The package substrate comprises a multi-layer wiring connected to the plurality of input terminals and formed in the substrate, and comprises a plurality of output terminals connected to the multi-layer wiring. Solder balls connected to the output terminals are provided on the back of the package substrate.

Abstract: A plurality of chips are mounted on a substrate, coupling portions between the chips and the substrate are sealed, the chips have rear surfaces thereof collectively polished, and the substrate with the chips thereon are separated into independent semiconductor devices.

Abstract: A magneto-generator, a method of manufacturing the same and a resin molding die for manufacturing the same. In the magneto-generator, a guard ring is omitted with the performance of the magneto-generator being enhanced. The magneto-generator is manufactured by making use of a resin molding die (21) having an outer peripheral surface (21d) to be positioned in opposition to an inner peripheral surface of a flywheel (11) and projections (21a) provided in the outer peripheral surface (21d) for holding a plurality of magnets (12) at predetermined positions, respectively. The magnets (12) are positioned and held stationarily at predetermined positions by the aforementioned projections, respectively, and spaces defined between the resin molding die (21) and the inner peripheral surface of the flywheel (11) are filled with a resin. After hardening of the resin, the resin molding die (21) is detached from the flywheel (11).

Abstract: Two end plates of a stator core are made of a metal material to increase their rigidity and thereby hold, in a prescribed shape, generation coils that are wound on teeth of the stator core. To increase the insulation between the generation coils and the teeth, the circumferential width of a first portion, extending in the radial direction, of each of the end plates is made smaller than that of a corresponding first portion of a laminated core. At least a second portion of at least one of the two end plates is made of a non-magnetic metal material, whereby the magnetic loss is reduced and the temperature characteristic and the power generation characteristic are improved.

Abstract: A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconductor chip being electrically connected to the BGA substrate by metal wires; and chip capacitors mounted on the semiconductor chip to reduce power source noise.

Abstract: A three-phase alternating current generator includes a bowl-shaped flywheel, sixteen permanent magnets provided on an inner circumferential surface of the flywheel, and a stator located in the flywheel. Further, The stator is composed of twelve teeth provided opposite to the permanent magnets and of coils each being continuously wound around every three teeth among the teeth for generating electric power by an electromagnetic induction effect with the magnets.

Abstract: A magneto-generator, a method of manufacturing the same and a resin molding die for manufacturing the same. In the magneto-generator, a guard ring is omitted with the performance of the magneto-generator being enhanced. The magneto-generator is manufactured by making use of a resin molding die (21) having an outer peripheral surface (21d) to be positioned in opposition to an inner peripheral surface of a flywheel (11) and projections (21a) provided in the outer peripheral surface (21d) for holding a plurality of magnets (12) at predetermined positions, respectively. The magnets (12) are positioned and held stationarily at predetermined positions by the aforementioned projections, respectively, and spaces defined between the resin molding die (21) and the inner peripheral surface of the flywheel (11) are filled with a resin. After hardening of the resin, the resin molding die (21) is detached from the flywheel (11).