Abstract: A through electrode substrate includes a substrate provided with a through hole; a through electrode having a sidewall portion extending along a sidewall of the through hole, and a first portion positioned on a first surface of the substrate and connected to the sidewall portion; an inorganic film that at least partially covers the first portion of the through electrode from the first side and is provided with an opening positioned on the first portion; and a first wiring structure including at least a first wiring layer having an insulation layer that is positioned to the first side of the inorganic film and includes at least an organic layer provided with an opening communicating with the opening of the inorganic film, and an electroconductive layer connected to the first portion of the through electrode through the opening of the inorganic film and the opening of the insulation layer.

Abstract: A through electrode substrate includes a substrate provided with a through hole; a through electrode having a sidewall portion extending along a sidewall of the through hole, and a first portion positioned on a first surface of the substrate and connected to the sidewall portion; an inorganic film that at least partially covers the first portion of the through electrode from the first side and is provided with an opening positioned on the first portion; and a first wiring structure including at least a first wiring layer having an insulation layer that is positioned to the first side of the inorganic film and includes at least an organic layer provided with an opening communicating with the opening of the inorganic film, and an electroconductive layer connected to the first portion of the through electrode through the opening of the inorganic film and the opening of the insulation layer.

Abstract: An article for use in a plasma processing apparatus includes a gas supply pipe, and a component disposed in the gas supply pipe. The component is configured to cause radicals of gas passing through the gas supply pipe to be deactivated in the component.

Abstract: A method of manufacturing a through electrode substrate, the method includes: preparing a substrate including a first surface positioned on a first side, and a second surface positioned on a second side opposite to the first side, the substrate being provided with a through hole; forming a through electrode having a sidewall portion extending along a sidewall of the through hole, and a first portion positioned on the first surface of the substrate and connected to the sidewall portion; forming an organic film inside the through hole; forming an inorganic film at least partially covering the first portion of the through electrode from the first side; forming an insulation layer positioned to the first side of the inorganic film; and forming an electroconductive layer passing through the inorganic film and the insulation layer so as to be connected to the first portion of the through electrode.

Abstract: A through electrode substrate includes a substrate provided with a through hole, a through electrode positioned in the through hole, and a first wiring structure including at least a first wiring layer positioned on a first surface of the substrate, and a second wiring layer positioned on the first wiring layer. The first wiring layer and the second wiring layer respectively have an insulation layer and an electroconductive layer. A first insulation layer of the first wiring layer includes at least an organic layer. At least one wiring layer of the first wiring structure includes an inorganic layer having insulation properties, the inorganic layer being positioned to a first side of the organic layer of the first insulation layer of the first wiring layer.

Abstract: An image sensor module includes an interposer substrate having a first surface and a second surface opposite to the first surface, the interposer substrate being light-transmissive and having a plurality of through-holes; an image sensor located to face the first surface of the interposer substrate, the image sensor having a light receiving surface on a side of the interposer substrate, a plurality of photoelectric conversion elements being located at the light receiving surface, the image sensor being connected with an external circuit via electrodes provided in the plurality of through-holes; and a lens unit located to face the second surface of the interposer substrate.

Abstract: A method of manufacturing a through electrode substrate, the method includes: preparing a substrate including a first surface positioned on a first side, and a second surface positioned on a second side opposite to the first side, the substrate being provided with a through hole; forming a through electrode having a sidewall portion extending along a sidewall of the through hole, and a first portion positioned on the first surface of the substrate and connected to the sidewall portion; forming an organic film inside the through hole; forming an inorganic film at least partially covering the first portion of the through electrode from the first side; forming an insulation layer positioned to the first side of the inorganic film; and forming an electroconductive layer passing through the inorganic film and the insulation layer so as to be connected to the first portion of the through electrode.

Abstract: A through electrode substrate includes: a substrate including first and second surfaces respectively on a first side and a second side opposite to the first, the substrate having a through hole; and a through electrode. The through electrode has a sidewall portion along the through hole sidewall, and a first portion the first surface and connected to the sidewall portion. The through electrode substrate includes: an organic film inside the through hole; an inorganic film that at least partially covers the through electrode first portion from the first side and has an opening on the first portion; and a first wiring layer having an insulation layer to the inorganic film first side and includes an organic layer with an opening communicating with the inorganic film opening, and an electroconductive layer connected to the through electrode first portion through the inorganic film opening and the insulation layer opening.

Abstract: A through electrode substrate includes: a substrate; a first electrode part provided on a first surface side of the substrate; and a second electrode part provided on a second surface side of the substrate. The plurality of holes includes a plurality of first holes and a plurality of second holes. The hole electrode part of each first hole is electrically connected to the first electrode part on the first surface side of the substrate, and the hole electrode part thereof is electrically connected to the second electrode part on the second surface side of the substrate. The electrode part of each second hole is electrically insulated from the first electrode part on the first surface side of the substrate, or the hole electrode part thereof is electrically insulated from the second electrode part on the second surface side of the substrate.

Abstract: An image sensor module includes an interposer substrate having a first surface and a second surface opposite to the first surface, the interposer substrate being light-transmissive and having a plurality of through-holes; an image sensor located to face the first surface of the interposer substrate, the image sensor having a light receiving surface on a side of the interposer substrate, a plurality of photoelectric conversion elements being located at the light receiving surface, the image sensor being connected with an external circuit via electrodes provided in the plurality of through-holes; and a lens unit located to face the second surface of the interposer substrate.

Abstract: An image sensor module includes an interposer substrate having a first surface and a second surface opposite to the first surface, the interposer substrate being light-transmissive and having a plurality of through-holes; an image sensor located to face the first surface of the interposer substrate, the image sensor having a light receiving surface on a side of the interposer substrate, a plurality of photoelectric conversion elements being located at the light receiving surface, the image sensor being connected with an external circuit via electrodes provided in the plurality of through-holes; and a lens unit located to face the second surface of the interposer substrate.

Abstract: An article for use in a plasma processing apparatus includes a gas supply pipe, and a component disposed in the gas supply pipe. The component is configured to cause radicals of gas passing through the gas supply pipe to be deactivated in the component.

Abstract: A through electrode substrate includes: a substrate including first and second surfaces respectively on a first side and a second side opposite to the first, the substrate having a through hole; and a through electrode. The through electrode has a sidewall portion along the through hole sidewall, and a first portion the first surface and connected to the sidewall portion. The through electrode substrate includes: an organic film inside the through hole; an inorganic film that at least partially covers the through electrode first portion from the first side and has an opening on the first portion; and a first wiring layer having an insulation layer to the inorganic film first side and includes an organic layer with an opening communicating with the inorganic film opening, and an electroconductive layer connected to the through electrode first portion through the inorganic film opening and the insulation layer opening.

Abstract: A through-hole electrode substrate including substrate having a first and second surface on an opposite side of first surface and through-hole passing through from first surface to second surface, inner wall of through-hole divided into first inner wall, second inner wall and third inner wall from first surface side, size of a first open end of through-hole in first surface side is smaller than a size of a second open end of the through-hole in the second surface side, an incline angle with respect to first and second surface of the third inner wall is smaller than an incline angle with respect to the first surface and the second surface of the second inner wall and the third inner wall, and a through-hole electrode arranged on the interior of the through-hole and electrically connecting wiring arranged on the first surface side and wiring arranged on the second surface side.

Abstract: A through electrode substrate includes a substrate provided with a through hole, a through electrode positioned in the through hole, and a first wiring structure including at least a first wiring layer positioned on a first surface of the substrate, and a second wiring layer positioned on the first wiring layer. The first wiring layer and the second wiring layer respectively have an insulation layer and an electroconductive layer. A first insulation layer of the first wiring layer includes at least an organic layer. At least one wiring layer of the first wiring structure includes an inorganic layer having insulation properties, the inorganic layer being positioned to a first side of the organic layer of the first insulation layer of the first wiring layer.

Abstract: A through electrode substrate includes: a substrate; a first electrode part provided on a first surface side of the substrate; and a second electrode part provided on a second surface side of the substrate. The plurality of holes includes a plurality of first holes and a plurality of second holes. The hole electrode part of each first hole is electrically connected to the first electrode part on the first surface side of the substrate, and the hole electrode part thereof is electrically connected to the second electrode part on the second surface side of the substrate. The electrode part of each second hole is electrically insulated from the first electrode part on the first surface side of the substrate, or the hole electrode part thereof is electrically insulated from the second electrode part on the second surface side of the substrate.

Abstract: An image sensor module includes an interposer substrate having a first surface and a second surface opposite to the first surface, the interposer substrate being light-transmissive and having a plurality of through-holes; an image sensor located to face the first surface of the interposer substrate, the image sensor having a light receiving surface on a side of the interposer substrate, a plurality of photoelectric conversion elements being located at the light receiving surface, the image sensor being connected with an external circuit via electrodes provided in the plurality of through-holes; and a lens unit located to face the second surface of the interposer substrate.

Abstract: Provided is a Cylinder Valve capable of switching a fluid sealing state to a fluid releasing state or vice versa with certainty and also capable of preventing a flow noise from being caused when the fluid is released. A Cylinder Valve—includes a Residual pressure Valve mechanism located in a Residual pressure Valve mechanism insertion space formed in a flow path.

Abstract: Provided is a Cylinder Valve capable of switching a fluid sealing state to a fluid releasing state or vice versa with certainty and also capable of preventing a flow noise from being caused when the fluid is released. A Cylinder Valve—includes a Residual pressure Valve mechanism located in a Residual pressure Valve mechanism insertion space formed in a flow path.

Abstract: A multi-gate structure is used and a width (d1) of a high concentration impurity region sandwiched by two channel forming regions in a channel length direction is set to be shorter than a width (d2) of low concentration impurity regions in the channel length direction. Thus, a resistance of the entire semiconductor layer of a TFT which is in an on state is reduced to increase an on current. In addition, a carrier life time due to photoexcitation produced in the high concentration impurity region can be shortened to reduce light sensitivity.