Patents by Inventor Shintaro Hayashi

Shintaro Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9793194
    Abstract: A leadframe includes an individual region to become a semiconductor device, and an outer frame part supporting the individual region through its peripheral edge. The thickness of the outer frame part is greater than the thickness of the individual region.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: October 17, 2017
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Shintaro Hayashi
  • Publication number: 20170293060
    Abstract: A light-emitting device includes: a balloon, a light source disposed outside the balloon; and an optical fiber that connects the balloon and the light source and propagates light emitted by the light source. At least one of the balloon and the optical fiber becomes luminous by the light emitted by the light source.
    Type: Application
    Filed: April 10, 2017
    Publication date: October 12, 2017
    Inventors: Shintaro HAYASHI, Atsushi MOTOYA, Naoya IKENO, Motohide TOSHIKAWA
  • Publication number: 20170294559
    Abstract: The semiconductor device includes: an AlGaN layer; a contact electrode; an insulating film; and a passivation film. The semiconductor device further includes: an extended wire extending over the contact electrode and the insulating film; and a pad electrode electrically connected to the extended wire. The passivation film covers the insulating film and the extended wire and including an opening for exposing the pad electrode. The insulating film accommodates the opening in a plan view. The passivation film accommodates the contact electrode in a plan view. The semiconductor device further includes a heat dissipation layer on a surface of the passivation film.
    Type: Application
    Filed: November 4, 2015
    Publication date: October 12, 2017
    Inventors: Koji GOTO, Shintaro HAYASHI, Akihiko MURAI, Takuya MINO, Saki AOKI, Kenji TSUBAKI
  • Publication number: 20170286000
    Abstract: According to one embodiment, there is provided a storage device including a control chip and a plurality of memory chips. The control chip has an input buffer common to the control chip and the plurality of memory chips and electrically connected to an external terminal. A first transmission path going through the input buffer and a second transmission path not going through the input buffer are provided between the external terminal and the plurality of memory chips. In a first mode, the control chip enables the input buffer so as to activate the first transmission path and, in a second mode, disables the input buffer so as to activate the second transmission path.
    Type: Application
    Filed: September 12, 2014
    Publication date: October 5, 2017
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Mikihiko ITO, Masaru KOYANAGI, Shintaro HAYASHI
  • Patent number: 9776380
    Abstract: Provided is a ceramic member in which the difference in thermal expansion coefficient between an insulating ceramic material and an electrically conductive ceramic material is extremely small and therefore any mismatch caused in association with this difference in thermal expansion coefficient does not occur, and which does not undergo any failure such as breakage, cracking, detachment or destruction. The ceramic member (1) includes an electrically conductive ceramic material (2) which contains yttrium oxide as the main component and additionally contains a fibrous electrically conductive substance such as carbon nanotubes in an amount of 0.1 to 3 vol % inclusive and an insulation ceramic material (3) which contains yttrium oxide as the main component, wherein the electrically conductive ceramic material (2) and the insulation ceramic material (3) are adhered to each other in an integrated manner through an adhesive layer (4) which includes an inorganic adhesive material.
    Type: Grant
    Filed: September 26, 2011
    Date of Patent: October 3, 2017
    Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
    Inventors: Shintaro Hayashi, Masayuki Ishizuka, Kazuto Ando
  • Publication number: 20170261697
    Abstract: A light source device and a method of manufacturing a light source device are provided. The light source device includes a base. A light-emitter is above the base. A cap is joined to the base to cover the light-emitter. The cap includes an opening in a position corresponding to the light-emitter. A first light guide is in communication with the opening for guiding, to outside of the cap, light emitted by the light-emitter. A first ferrule is provided around the first light guide. The first ferrule is joined to an edge of the opening in a state in which the first ferrule is in the opening.
    Type: Application
    Filed: March 9, 2017
    Publication date: September 14, 2017
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroshi KITANO, Shintaro HAYASHI, Yoshiyuki NAKANO, Hideharu KAWACHI
  • Publication number: 20170253089
    Abstract: This pneumatic tire includes, on a tread surface, land portions defined by tread edges and by circumferential main grooves extending continuously in the tread circumferential direction; central sipes, in a central land portion on a tire equatorial plane, extending in the tread width direction and formed at a predetermined pitch length, the central land portion being continuous in the tread circumferential direction between adjacent central sipes; and intermediate sipes, in intermediate land portions adjacent to the central land portion on both sides in the tread width direction with the circumferential main grooves therebetween, extending in the tread width direction and being formed at a predetermined pitch length, each intermediate land portion being continuous in the tread circumferential direction between adjacent intermediate sipes. The pitch length of the intermediate sipes is longer than that of the central sipes, and both ends of the central sipes open into the circumferential main grooves.
    Type: Application
    Filed: August 7, 2015
    Publication date: September 7, 2017
    Applicant: BRIDGESTONE CORPORATION
    Inventor: Shintaro HAYASHI
  • Publication number: 20170225515
    Abstract: This pneumatic tire includes, on the tread surface, land portions defined by circumferential main grooves extending continuously in the tread circumferential direction and by tread edges. An intermediate land portion on one side in the tread width direction, adjacent to the tire equatorial plane side of the outermost circumferential main groove on the one side, is formed into blocks only by sipes extending in the tread width direction, an intermediate land portion on the other side in the tread width direction, adjacent to a tire equatorial plane side of an outermost circumferential main groove on the other side, is formed in a ribbed shape, and intermediate land portion lug grooves are formed in the intermediate land portion on the other side, with one end opening into the outermost circumferential main groove on the other side, and the other end terminating within the intermediate land portion on the other side.
    Type: Application
    Filed: August 7, 2015
    Publication date: August 10, 2017
    Applicant: BRIDGESTONE CORPORATION
    Inventor: Shintaro HAYASHI
  • Publication number: 20170221634
    Abstract: In an embodiment, a multilayer ceramic capacitor 10 is constituted in such a way that four capacitive components C1 to C4 that are connected in series are formed between a first internal electrode layer group 14 and a second internal electrode layer group 15 adjacent to it, wherein, among the four capacitive components C1 to C4, the facing area Sc1 that defines the capacitance value of the capacitive component C1 closest to the first external electrode 12 and the facing area Sc4 that defines the capacitance value of the capacitive component C4 closest to the second external electrode 13 are greater than the facing areas Sc2 and Sc3 that define the capacitance values of the two remaining capacitive components C2 and C3, respectively. The multilayer ceramic capacitor is capable of satisfying the needs for both size reduction and voltage resistance increase.
    Type: Application
    Filed: January 26, 2017
    Publication date: August 3, 2017
    Inventors: Yasuyuki INOMATA, Shintaro HAYASHI
  • Publication number: 20170198874
    Abstract: A luminaire includes an excitation light source which emits excitation light. A first fluorescent plate includes a first principle surface disposed across the optical axis of the excitation light. A first phosphor layer is arranged discretely along the first principle surface. A second fluorescent plate is arranged at the downstream side of the excitation light with respect to the first fluorescent plate. The second fluorescent plate includes a second principle surface disposed across the optical axis. A second phosphor layer is arranged discretely along the second principle surface. The second phosphor layer has a wavelength conversion characteristic different from a wavelength conversion characteristic of the first phosphor layer. A support supports the first fluorescent plate and the second fluorescent plate such that at least one of relative positions and rotations of the first fluorescent plate and the second fluorescent plate are adjustable.
    Type: Application
    Filed: January 3, 2017
    Publication date: July 13, 2017
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LT D.
    Inventors: Hirotaka MATSUNAMI, Shintaro HAYASHI
  • Publication number: 20170184447
    Abstract: A particle sensor is provided. The particle sensor includes a light projector that projects light to a detection area. A light receiver receives scattered light. The scattered light is light from the light projector that has been scattered by particles in the detection area. A first support supports the light receiver. A second support supports the light projector and has a linear expansion coefficient different from a linear expansion coefficient of the first support. The first support includes a first placement region in which the light receiver is disposed and a second placement region in which the second support is disposed. The first placement region and the second placement region are located at different distances from at least one of an optical axis of the light projector and an optical axis of the light receiver.
    Type: Application
    Filed: December 22, 2016
    Publication date: June 29, 2017
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hirotaka MATSUNAMI, Shintaro HAYASHI, Shinichi KITAOKA
  • Publication number: 20170176329
    Abstract: A particle sensor is provided. The particle sensor includes a light projector that projects light to a detection area. A light receiver receives scattered light. The scattered light is light from the light projector that has been scattered by particles in the detection area. A first reflector reflects the scattered light to the light receiver. A light attenuator attenuates stray light that exits the first reflector. The first reflector includes a first aperture that introduces the light from the light projector into an interior of the first reflector and a second aperture that exits the stray light from the first reflector. The light attenuator includes a third aperture through which the stray light that exits the first reflector passes. An aperture area of the third aperture is smaller than an aperture area of the second aperture.
    Type: Application
    Filed: December 19, 2016
    Publication date: June 22, 2017
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shintaro HAYASHI, Shinichi KITAOKA, Hirotaka MATSUNAMI
  • Publication number: 20170133300
    Abstract: A semiconductor device includes a leadframe, a semiconductor chip, and an encapsulation resin encapsulating the leadframe and the semiconductor chip. The leadframe includes a first surface and a second surface facing away from the first surface. The semiconductor chip is mounted on the first surface of the leadframe. A part of the second surface of the leadframe is depressed toward the first surface to foam a step surface. The step surface includes an uneven surface part where depressions are formed, and is covered with the encapsulation resin.
    Type: Application
    Filed: October 11, 2016
    Publication date: May 11, 2017
    Inventor: Shintaro HAYASHI
  • Patent number: D786775
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: May 16, 2017
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Shintaro Hayashi
  • Patent number: D789279
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: June 13, 2017
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Shintaro Hayashi
  • Patent number: D792840
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: July 25, 2017
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Shintaro Hayashi
  • Patent number: D793952
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: August 8, 2017
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Shintaro Hayashi
  • Patent number: D794548
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: August 15, 2017
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Shintaro Hayashi
  • Patent number: D794552
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: August 15, 2017
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Shintaro Hayashi
  • Patent number: D795173
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: August 22, 2017
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Shintaro Hayashi