Abstract: A semiconductor device includes a leadframe, a semiconductor chip mounted on the leadframe, and an encapsulation resin covering the leadframe and the semiconductor chip. The leadframe includes a terminal having a pillar shape. The terminal includes a first end surface, a second end surface facing away from the first end surface, and a side surface extending vertically between the first end surface and the second end surface. The side surface is stepped to form a step surface facing away from the second end surface and having an uneven surface part formed therein. A first portion of the terminal extending from the first end surface toward the second end surface and including the step surface is covered with the encapsulation resin. A second portion of the terminal extending from the first portion to the second end surface projects from the encapsulation resin.

Abstract: A leadframe includes an individual region to become a semiconductor device, and an outer frame part supporting the individual region through its peripheral edge. The thickness of the outer frame part is greater than the thickness of the individual region.

Abstract: A lead frame includes a die pad and a plurality of leads arranged around the die pad. Each of the leads includes an inner lead, a bent portion, and an external connection terminal. The inner lead includes a distal portion, adjacent to the die pad, and a connection end portion, located at an opposite end of the inner lead from the distal portion. The bent portion is connected to the connection end portion of the inner lead. The external connection terminal is connected by the bent portion to the connection end portion of the inner lead and located below the inner lead. The external connection terminal includes an upper surface that faces to and is parallel to a lower surface of the inner lead. The inner lead, the bent portion, and the external connection terminal are formed integrally in each of the leads.

Abstract: A semiconductor device includes a lead frame; a semiconductor chip mounted on the lead frame; and an encapsulation resin, wherein a convexo-concave portion including a plurality of concave portions is provided at a covered portion of the lead frame that is covered by the encapsulation resin, wherein the planer shape of each of the concave portions is a circle, the diameter of which is greater than or equal to 0.020 mm and less than or equal to 0.060 mm, or a polygon, the diameter of whose circumcircle is greater than or equal to 0.020 mm and less than or equal to 0.060 mm, and wherein a ratio S/S0 is greater than or equal to 1.7 where “S” is a surface area of the convexo-concave portion that is formed at a flat surface whose surface area is “S0”.

Abstract: A light emitting device includes a substrate with a circuit incorporated in the substrate, an interposer having a circuit connected to the circuit of the substrate, a light emitting element disposed on the interposer, a transmissive component disposed positioned to the light emitting element, and a frame body having an opening in which the transmissive component is disposed. The light emitting device further includes a ring-shaped body that encompasses the frame body on the substrate, and a sealant making the substrate and the ring-shaped body tightly contact one another. The frame body is disposed so as to encompass the light emitting element on the substrate. This provides the light emitting device with waterproof function.

Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.

Abstract: A tire includes primary inclined grooves and auxiliary inclined grooves. Each primary inclined groove has a first gently inclined portion and a first steeply inclined portion. Each auxiliary inclined groove has a second gentry inclined portion and a second steeply inclined portion. Each primary inclined groove does not communicate with a circumferential groove on the tire equator line side and extends beyond a tread edge outward in a tire width direction. Each auxiliary inclined groove does not communicate with the circumferential groove on the tire equator line side, and does not reach the tread edge but terminates on the tire equator line side.

Abstract: Provided is a tire in which the silent performance is excellent and the wear performance is also excellent.

Abstract: A dolomite-based adsorbent for heavy metal, halogen and metalloid is half-fired dolomite, and a content of a residual CaMg(CO3)2 phase in the half-fired dolomite, which is analyzed using a Rietveld method by means of powder X-ray diffraction, is 0.4?x?35.4 (wt %), and preferably, the dolomite-based absorbent for heavy metal, halogen and metalloid further comprises ferrous sulfate.

Abstract: A dolomite-based material having a high specific surface area of the present invention is half-fired dolomite in which a content of a residual CaMg(CO3)2 phase in the half-fired dolomite, which is analyzed using a Rietveld method by means of powder X-ray diffraction, is 0.4?×?35.4 (wt %), and, when the content of the residual CaMg(CO3)2 phase in the fired-dolomite is maintained at 0.4?×?35.4 (wt %), the dolomite-based material maintains quality of having a high specific surface area.