Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.

Abstract: Provided is a sintered object which has excellent resistance to corrosion by corrosive halogen gases and by the plasmas thereof and has excellent thermal conductivity and excellent electrical conductivity. The sintered object has few limitations on design, is usable in a wide range of applications, and is highly versatile. The sintered object has no frequency dependence when a high-frequency voltage is applied thereto and with which it is possible to actualize the stability of a plasma. Also provided is a method for producing the sintered object. Furthermore provided is a high-frequency transmission material which has direct-current electrical conductivity for reducing fluctuations in plasma potential and has capacitive properties that enable the material to transmit high-frequency power necessary for plasma excitation, and which has no fear of causing contamination of a sample with a metal and has resistance to corrosion by plasmas.

Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.

Abstract: A lead frame includes a die pad and a plurality of leads arranged around the die pad. Each of the leads includes an inner lead, a bent portion, and an external connection terminal. The inner lead includes a distal portion, adjacent to the die pad, and a connection end portion, located at an opposite end of the inner lead from the distal portion. The bent portion is connected to the connection end portion of the inner lead. The external connection terminal is connected by the bent portion to the connection end portion of the inner lead and located below the inner lead. The external connection terminal includes an upper surface that faces to and is parallel to a lower surface of the inner lead. The inner lead, the bent portion, and the external connection terminal are formed integrally in each of the leads.

Abstract: An ultraviolet light emitting device of the present invention includes a light emitting element provided on a substrate, an optical system provided at a position facing the light emitting element, a metal cylinder holding the optical system, and a holding component holding the metal cylinder on a substrate. Light the emitting element is disposed in an area of the substrate, the area surrounded by one end of the metal cylinder closer to the substrate. This provides the ultraviolet light emitting device that prevents the distortion of the optical system as well as the influence of ultraviolet light on the holding component.

Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.

Abstract: A composite substrate includes a moisture-proof substrate, and a resin substrate pasted on a surface of the moisture-proof substrate. The resin substrate is formed to be smaller than the moisture-proof substrate in planar view. An end side of the resin substrate is an inclined face that is inclined inward. In an organic electroluminescence device, an organic light-emitting multilayer provided on a surface of the resin substrate is sealed with a sealing member. A moisture-proof film coats at least part of the surface of the resin substrate in which no lead-out electrode is formed.

Abstract: Provided is a method of preparing an organic electroluminescent element. The method includes: a roughening step of roughening a surface of a moisture-proof substrate; a composite substrate-forming step of placing a resin film on the roughened surface of the moisture-proof substrate to form a composite substrate; an electroluminescent laminate-forming step of forming an organic electroluminescent laminate on a surface of the composite substrate; and a covering step of covering the organic electroluminescent laminate with a covering substrate that is larger than the resin film in a plan view. It gives a highly reliable organic electroluminescent element superior in light-outcoupling efficiency that is effectively resistant to water penetration and to degradation.

Abstract: The organic electroluminescence element in accordance with the present invention, includes: a substrate; a light-emitting stack on a face of the substrate; a covering substrate provided so as to face the face of the substrate; and a sealing bond surrounding the light-emitting stack and bonding the substrate and the covering substrate to enclose the light-emitting stack together with the covering substrate and the substrate. The sealing bond includes a bonding layer and a low moisture permeable layer, and the low moisture permeable layer is lower in moisture permeability and thicker than the bonding layer.

Abstract: The organic electroluminescence element in accordance with the present invention includes: a substrate; a light-outcoupling layer situated on a surface of the substrate; a light-emitting layer situated on a face on an opposite side of the light-outcoupling layer from the substrate; a sealing base situated facing the face of the light-outcoupling layer; and a sealing bond formed to enclose the light-emitting layer and bond the sealing base to the face of the light-outcoupling layer. The light-outcoupling layer includes: a first portion where the light-emitting layer is situated; a second portion where the sealing bond is situated; and a groove spatially separating the first portion from the second portion.

Abstract: A composite substrate includes a moisture-proof substrate, and a resin substrate pasted on a surface of the moisture-proof substrate. The resin substrate is formed to be smaller than the moisture-proof substrate in planar view. An end side of the resin substrate is an inclined face that is inclined inward. In an organic electroluminescence device, an organic light-emitting multilayer provided on a surface of the resin substrate is sealed with a sealing member. A moisture-proof film coats at least part of the surface of the resin substrate in which no lead-out electrode is formed.

Abstract: A light emission device includes: an organic electroluminescent element including and second electrodes; a wiring board including first and second patterned conductors; and first and second connection parts. The first and the second electrodes include first and second extended portions. The first and the second extended portions overlap the first and the second patterned conductors, respectively. The first connection part includes a first through-hole wire and a first protrusion electrode protruding from the first patterned conductor to be inside the first through-hole wire so as to be electrically connected to the first through-hole wire. The second connection part includes a second through-hole wire and a second protrusion electrode protruding from the second patterned conductor to be inside the second through-hole wire so as to be electrically connected to the second through-hole wire.

Abstract: The planar light emitting device according to the present invention includes: an organic electroluminescence element; a formation substrate of a light transmissive resin material being adjacent to a first surface of the organic electroluminescence element; a light outcoupling structure provided to the formation substrate and suppressing reflection of light emitted from the organic electroluminescence element at a surface of the formation substrate; a first moisture preventer with a moisture proof property being over a second surface of the organic electroluminescence element to cover the organic electroluminescence element; and a second moisture preventer with a moisture proof property covering the formation substrate to prevent moisture from passing through the formation substrate and reaching the first surface of the organic electroluminescence element. The second moisture preventer includes an overlap overlapping the first surface in the thickness direction of the organic electroluminescence element.

Abstract: A light emission device includes an organic electroluminescent element including a first electrode and a second electrode, a wiring board including a second substrate, a first patterned conductor and a second patterned conductor, a first bond which is an electrical conductor containing electrically conductive powder and an organic binder, and electrically interconnects the first electrode and the first patterned conductor, and a second bond which is an electrical conductor containing electrically conductive powder and an organic binder, and electrically interconnects the second electrode and the second patterned conductor. The first patterned conductor is provided with a spread restrainer defining a spread range of the first bond, and the second patterned conductor is provided with a spread restrainer defining a spread range of the second bond.