Abstract: A biomimetic waterfowl includes a housing, two waterfowl legs, and a driving module. The waterfowl legs are spaced apart from each other in a left-right direction and are mounted to a bottom portion of the housing. Each waterfowl leg includes a first segment mounted to the housing and rotatable about a first axis parallel to the left-right direction, and a second segment rotatable about a second axis parallel to the first axis. The driving module is mounted to the housing and is configured to drive the waterfowl legs. Each of the waterfowl legs is movable between a retracted state, where the first segment extends forwardly from the housing and the second segment extends rearwardly from the first segment, and a propelling state, where the first segment extends rearwardly from the housing and the second segment extends rearwardly from the first segment.

Abstract: A method and apparatus for video coding system that uses intra prediction based on cross-colour linear model are disclosed. According to the method, model parameters for a first-colour predictor model are determined and the first-colour predictor model provides a predicted first-colour pixel value according to a combination of at least two corresponding reconstructed second-colour pixel values. According to another method, the first-colour predictor model provides a predicted first-colour pixel value based on a second degree model or higher of one or more corresponding reconstructed second-colour pixel values. First-colour predictors for the current first-colour block are determined according to the first-colour prediction model. The input data are then encoded at the encoder side or decoded at the decoder side using the first-colour predictors.

Abstract: A grinding and polishing simulation method, a grinding and polishing simulation system and a grinding and polishing process transferring method. The grinding and polishing simulation method includes the following steps. A sensing information of a grinding and polishing apparatus when grinding or polishing a workpiece is obtained. A plurality of model parameters is identified according to the sensing information. At least one quality parameter is calculated according to a machining path, a plurality of process parameters and the plurality of model parameters.

Abstract: An LED arc display includes at least one LED matrix array module. Each LED matrix array module is composed of a plurality of LED matrix units arranged regularly. Each LED matrix unit includes a display surface, and the display surface has an outer contour. The outer contour is a non-quadrilateral. Therefore, a non-smooth visual experience caused by assembly tolerances of the plurality of LED matrix units can be improved by using non-quadrilateral outer contours of each LED matrix unit.

Abstract: A chainsaw includes a housing, a cutter, a motor, a tensioning assembly and an air guiding cover. The housing is provided with at least one air inlet and one air outlet. The cutter mounted on the housing includes a saw chain and a guiding bar to support the saw chain. The motor is arranged in the housing and used to drive the cutter to work. The tensioning assembly is mounted on the housing and connected with the guiding bar to adjust a tightness of the saw chain. The air guiding cover is arranged in the housing, and the motor is arranged in the air guiding cover. The housing includes a mounting groove for mounting the tensioning assembly. Heat dissipation passages are arranged between the air inlet, air guiding cover, and the air outlet to dissipate hot airflow generated by the motor to an outside.

Abstract: In some embodiments, the present disclosure relates to an image sensor, including a semiconductor substrate, a plurality of photodiodes disposed within the semiconductor substrate, and a deep trench isolation structure separating the plurality of photodiodes from one another and defining a plurality of pixel regions corresponding to the plurality of photodiodes. The plurality of pixel regions includes a first pixel region sensitive to a first region of a light spectrum, a second pixel region sensitive to a second region of the light spectrum, and a third pixel region sensitive to a third region of the light spectrum. The first pixel region is smaller than the second pixel region or the third pixel region.

Abstract: A semiconductor structure and forming method thereof are provided. A substrate includes a first region, a second region, and a boundary region defined between the first region and the second region. An isolation structure is disposed in the boundary region. An upper surface of the isolation structure has a stepped profile. A first boundary dielectric layer and a second boundary dielectric layer are disposed over the isolation structure. The first boundary dielectric layer is substantially conformal with respect to the stepped profile of the isolation structure.

Abstract: In some embodiments, the present disclosure relates to an image sensor, including a semiconductor substrate, a plurality of photodiodes disposed within the semiconductor substrate, and a deep trench isolation structure separating the plurality of photodiodes from one another and defining a plurality of pixel regions corresponding to the plurality of photodiodes. The plurality of pixel regions includes a first pixel region sensitive to a first region of a light spectrum, a second pixel region sensitive to a second region of the light spectrum, and a third pixel region sensitive to a third region of the light spectrum. The first pixel region is smaller than the second pixel region or the third pixel region.

Abstract: A semiconductor structure includes a first, second and third isolations. The first isolation and a second isolation are disposed in a substrate and substantially parallel to each other, wherein a portion of the substrate is disposed between the first isolation and the second isolations. The third isolation is disposed over the portion of the substrate between the first and second isolations. A top surface of the third isolation is substantially aligned with top surfaces of the first and second isolations. A first step is between a bottom surface of the third isolation and a bottom surface of the first isolation. A second step between the bottom surface of the third isolation and a bottom surface of the second isolation. A method for manufacturing a semiconductor structure is also provided.

Abstract: A method includes depositing a first dielectric layer covering an electrical connector, depositing a second dielectric layer over the first dielectric layer, and performing a first etching process to etch-through the second dielectric layer and the first dielectric layer. An opening is formed in the first dielectric layer and the second dielectric layer to reveal the electrical connector. A second etching process is performed to laterally etch the first dielectric layer and the second dielectric layer. An isolation layer is deposited to extend into the opening. The isolation layer has a vertical portion and a first horizontal portion in the opening, and a second horizontal portion overlapping the second dielectric layer. An anisotropic etching process is performed on the isolation layer, with the vertical portion of the isolation layer being left in the opening.

Abstract: The present disclosure provides a method for preparing a superhydrophobic surface of an aluminum alloy through laser peening, including the following steps: coating a surface of the aluminum alloy as an absorption layer with an organic component-containing confinement layer to obtain a coated aluminum alloy, where the organic component-containing confinement layer is a mixed organic solution including 5 mL to 10 mL of perfluorooctyltriethoxysilane (FOTS), 100 mL to 200 mL of absolute ethanol, and 30 mL to 50 mL of distilled water; and subjecting a surface of the coated aluminum alloy to the laser peening to form the superhydrophobic surface.

Abstract: A method includes depositing a first dielectric layer covering an electrical connector, depositing a second dielectric layer over the first dielectric layer, and performing a first etching process to etch-through the second dielectric layer and the first dielectric layer. An opening is formed in the first dielectric layer and the second dielectric layer to reveal the electrical connector. A second etching process is performed to laterally etch the first dielectric layer and the second dielectric layer. An isolation layer is deposited to extend into the opening. The isolation layer has a vertical portion and a first horizontal portion in the opening, and a second horizontal portion overlapping the second dielectric layer. An anisotropic etching process is performed on the isolation layer, with the vertical portion of the isolation layer being left in the opening.

Abstract: A mouse device includes a casing and a roller module. The roller module is disposed within the casing. The roller module includes a scroll wheel, a magnetic ratchet, a supporting element and a permanent magnet. The scroll wheel includes a concave structure. The magnetic ratchet is disposed within the concave structure of the scroll wheel. While the scroll wheel is rotated, the magnetic ratchet is correspondingly rotated. The magnetic ratchet includes a ratchet frame and plural tooth structures. The plural tooth structures are discretely arranged on an inner surface of the ratchet frame. While the magnetic ratchet is rotated with the scroll wheel, the plural tooth structures of the magnetic ratchet are sequentially transferred through a region over the permanent magnet, and a magnetic attractive force between the corresponding tooth structure and the permanent magnet is generated.

Abstract: The present disclosure relates to a method of forming a flash memory structure. The method includes forming a sacrificial material over a substrate, and forming a plurality of trenches extending through the sacrificial material to within the substrate. A dielectric material is formed within the plurality of trenches. The dielectric material is selectively etched, according to a mask that is directly over the dielectric material, to form depressions along edges of the plurality of trenches. The sacrificial material between neighboring ones of the depressions is removed to form a floating gate recess. A floating gate material is formed within the floating gate recess and the neighboring ones of the depressions.

Abstract: A stress and texture morphology controlling method for preparing a super-hydrophobic surface of an aluminum alloy by laser etching includes the following steps: pretreating a surface of an aluminum alloy; fixing a pretreated aluminum alloy to an ultrasonic vibration platform, continuously charging flowing liquid nitrogen to a to-be-machined surface of the aluminum alloy, and controlling a flow of the liquid nitrogen to cool the to-be-machined surface of the aluminum alloy and keep the to-be-machined surface of the aluminum alloy at a low temperature; keeping stable flowing of the liquid nitrogen on the to-be-machined surface of the aluminum alloy after the to-be-machined surface of the aluminum alloy is cooled, using the ultrasonic vibration platform to generate a high-frequency ultrasonic vibration field, and etching the to-be-machined surface of the aluminum alloy to form a super-hydrophobic textured micro-nano structure surface; and reducing a surface energy of the super-hydrophobic textured micro-nano str

Abstract: The present disclosure provides a method for preparing a superhydrophobic surface of an aluminum alloy through laser peening, including the following steps: coating a surface of the aluminum alloy as an absorption layer with an organic component-containing confinement layer to obtain a coated aluminum alloy, where the organic component-containing confinement layer is a mixed organic solution including 5 mL to 10 mL of perfluorooctyltriethoxysilane (FOTS), 100 mL to 200 mL of absolute ethanol, and 30 mL to 50 mL of distilled water; and subjecting a surface of the coated aluminum alloy to the laser peening to form the superhydrophobic surface.

Abstract: The present disclosure provides a method for photo-curing 4D printing of a multi-layer structure with an adjustable shape recovery speed, and a multi-layer structure printed thereby. The multi-layer structure printed by the method for photo-curing 4D printing of the multi-layer structure with the adjustable shape recovery speed includes a plurality of deformation units sequentially connected in series, and each of the plurality of the deformation units includes two slow layers, a fast layer, and a transition layer; and the fast layer is arranged between the two slow layers, and the transition layer is arranged between at least one of the two slow layers and the fast layer. In the present disclosure, a low cross-linking layer is doped with a nanocarbon light-absorbing material to solve the problem that the low cross-linking layer is prone to over-curing when a high cross-linking layer is printed on the low cross-linking layer.

Abstract: The present disclosure relates to a method of forming a flash memory structure. The method includes forming a sacrificial material over a substrate, and forming a plurality of trenches extending through the sacrificial material to within the substrate. A dielectric material is formed within the plurality of trenches. The dielectric material is selectively etched, according to a mask that is directly over the dielectric material, to form depressions along edges of the plurality of trenches. The sacrificial material between neighboring ones of the depressions is removed to form a floating gate recess. A floating gate material is formed within the floating gate recess and the neighboring ones of the depressions.

Abstract: The present disclosure provides a method for photo-curing 4D printing of a multi-layer structure with an adjustable shape recovery speed, and a multi-layer structure printed thereby. The multi-layer structure printed by the method for photo-curing 4D printing of the multi-layer structure with the adjustable shape recovery speed includes a plurality of deformation units sequentially connected in series, and each of the plurality of the deformation units includes two slow layers, a fast layer, and a transition layer; and the fast layer is arranged between the two slow layers, and the transition layer is arranged between at least one of the two slow layers and the fast layer. In the present disclosure, a low cross-linking layer is doped with a nanocarbon light-absorbing material to solve the problem that the low cross-linking layer is prone to over-curing when a high cross-linking layer is printed on the low cross-linking layer.

Abstract: An automatic bio-specimen inspection system includes an inspection device, an image processing module, a spatial learning module, a path generation module and a motion device. The inspection device is used to approach an inspection site for performing a bio-specimens collection and/or inspection. The image processing module is used to capture and process a plurality of 2D images of the inspection site. The spatial learning module is used to generate a 3D spatial information of the inspection site according to the 2D images. The path generation module is used to generate an inspection path information based on the 3D spatial information. The motion device is used to move the inspection device to the inspection site according to the inspection path information for performing the inspection operation.