Abstract: A polylactic acid resin composition of the present invention is constructed by dynamically cross-linking a resin mixture containing a polylactic acid-based resin, trans-polyisoprene, and a cross-linking agent. The resin composition can be used for a wide variety of applications such as automobile molded articles, molded articles for electric products, molded articles for agricultural materials, molded articles for business use, and molded articles for daily use.

Abstract: The composition contains an alkali-soluble resin and a crosslinking agent that is represented by the following General Formula (I). In the formula, each of R1 and R6 independently represents a hydrogen atom or a hydrocarbon group having 5 or less carbon atoms; each of R2 and R5 independently represents an alkyl group, a cycloalkyl group, an aryl group, or an acyl group; and each of R3 and R4 independently represents a hydrogen atom or an organic group having 2 or more carbon atoms, and R3 and R4 may be bonded to each other to form a ring.

Abstract: There is provided an active light sensitive or radiation sensitive resin composition which contains (A) an alkali soluble resin and (C) a cross-linking agent represented by the following General Formula (1-0).

Abstract: A pattern forming, method, includes: (i) forming a film from an actinic ray-sensitive or radiation-sensitive resin composition that contains (A) a compound capable of generating an acid upon irradiation with an actinic ray or radiation and decomposing by an action of an acid to decrease a solubility of the compound (A) for an organic solvent; (ii) exposing the film; and (iii) performing development by using a developer containing an organic solvent.

Abstract: A long film containing a cellulose acylate and a compound A having a molecular weight of less than 1,000 which satisfies conditions 1-4. Condition 1: containing two or more aromatic rings each directly connected to a hydroxyl group in a molecule. Condition 2: containing one or more carbon atoms directly connected to an aromatic ring directly connected to a hydroxyl group and do not constitute the aromatic ring in a molecule, the carbon atoms being directly connected to 1 to 3 aromatic rings. Condition 3: Each carbon atom directly connected to an aromatic ring directly connected to a hydroxyl group and not constituting the aromatic ring has no bond with a hydrogen atom. Condition 4: Each carbon atom directly connected to an aromatic ring directly connected to a hydroxyl group and not constituting the aromatic ring is bonded by a single bond to atoms other than hydrogen atoms.

Abstract: A double side welding method used for producing a differential gear for welding a weld part to join a ring gear fitted on a gear case from both sides. The method uses welding distortion caused by welding to improve product accuracy. The method includes welding from both sides of a weld part where a first member and a second member, which are the objects being joined, face each other. The method is performed by first welding, which is performed from one side, and second welding, which is performed from the other opposite side from that first welding. Heat quantity adjustment, that adjusts the quantity of heat input to the weld part for the second welding, is performed after the first welding, and is carried out such that an amount of welding distortion that is the objective arises.

Abstract: A polylactic acid resin composition of the present invention is constructed by dynamically cross-linking a resin mixture containing a polylactic acid-based resin, trans-polyisoprene, and a cross-linking agent. The resin composition can be used for a wide variety of applications such as automobile molded articles, molded articles for electric products, molded articles for agricultural materials, molded articles for business use, and molded articles for daily use.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes an alkali-soluble resin (A) having a phenolic hydroxyl group, and a crosslinking agent (C) having two or more hydroxymethyl groups or alkoxymethyl groups in total within the molecule, wherein the composition contains a crosslinking agent (C1) having a molecular weight of 420 or more and also having two to four hydroxymethyl groups or alkoxymethyl groups in total within the molecule in a proportion of 60 mol % to 100 mol % based on the total amount of the crosslinking agent (C) including the crosslinking agent (C1), and in which the total concentration of the hydroxymethyl groups or the alkoxymethyl groups of the crosslinking agent (C) relative to 1 g of the solid content in the actinic ray-sensitive or radiation-sensitive resin composition is 0.30 mmol/g or more.

Abstract: A semiconductor chip has an evaluation pattern that is included in a monitor pattern. This evaluation pattern is constituted by a first pattern and a second pattern opposite to each other in an X direction. Further, the first pattern is constituted by a convex shape protruding in a direction away from the second pattern in the X direction.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes an alkali-soluble resin (A) and a compound (B) exemplified below, the compound (B) has a specific structure within a molecule.

Abstract: A friction stir welding method of welding first and second members to each other by rotating and pressing a friction stir tool into butt surfaces of the first and second members and moving the friction stir tool while rotating the friction stir tool, includes: a butt process of abutting the first and second members on each other, and abutting a side surface of a third member on side surfaces of the first and second members; an offset process of making a rotation center of the friction stir tool coincide with a position offset from the butt surfaces, and moving the friction stir tool to reach an inside of the third member; and a welding process of making the rotation center coincide with the butt surfaces, and moving the friction stir tool to reach the inside of the third member.

Abstract: The actinic ray-sensitive or radiation-sensitive resin composition includes a crosslinking agent having a polarity converting group and an alkali-soluble resin, in which the polarity converting group is a group capable of decomposing by the action of an alkaline aqueous solution to generate a carboxylic acid or sulfonic acid on the side having a crosslinking group.

Abstract: A connector is mountable on an object in an up-down direction and mateable with a mating connector along the up-down direction. The mating connector comprises four locked portions. The connector comprises two additional members. Each of the additional members comprises two regulation mechanisms. Each of the regulation mechanisms comprises a spring portion, an operation portion, a first regulating portion, and a second regulating portion. The spring portion has a lock portion. The operation portion has a first regulated portion. One of the spring portion and the operation portion is provided with a second regulated portion. An upward movement of the lock portion is regulated when the first regulated portion is moved upward in the up-down direction to abut against the first regulating portion.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin (A) containing a repeating unit represented by General Formula (4) and a crosslinking agent (C) containing a polar group, in which the crosslinking agent (C) is a compound represented by General Formula (1) or a compound in which two to five structures represented by General Formula (1) are connected via a linking group or a single bond represented by L1 in General Formula (3).

Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition including a compound (A) whose dissolution rate in an alkali developer decreases by the action of an acid, a resin (B) having a group that decomposes by the action of an alkali developer to increase the solubility in the alkali developer and having at least one of a fluorine atom or a silicon atom, and a resin (C) having a phenolic hydroxyl group, different from the resin (B), an actinic ray-sensitive or radiation-sensitive film and a mask blank, each formed using the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method using the actinic ray-sensitive or radiation-sensitive resin composition, and a method for manufacturing an electronic device.

Abstract: An actinic ray sensitive or radiation sensitive resin composition contains a polymer compound (A) having a phenolic hydroxyl group and satisfying the following (a) and (b), a compound (B) capable of generating an acid upon irradiation with actinic rays or radiation, and a crosslinking agent (C) for crosslinking the polymer compound (A) by the action of an acid and having a glass transition temperature (Tg) of 200° C. or higher: (a) the weight-average molecular weight is 3,000 or more and 6,500 or less, and (b) the glass transition temperature (Tg) is 140° C. or higher.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes an alkali-soluble resin (A) and a compound (B) exemplified below, the compound (B) has a specific structure within a molecule.

Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition containing: a resin (A) containing a repeating unit represented by a specific formula (1), and an ionic compound (B) represented by a specific formula (2), a resist film formed by using the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method including: (a) a step of forming the resist film, (b) a step of exposing the film, and (c) a step of developing the exposed film using a developer to form a pattern.

Abstract: According to one embodiment, An actinic-ray- or radiation-sensitive resin composition comprises a basic compound (C) having n basic groups and m groups that when exposed to actinic rays or radiation, generate an acid, provided that n and m satisfy the relationships n?1, m?2 and n<m.