Abstract: The present disclosure provides an apparatus for substrate inspection, including a chamber, a movable holder in the chamber and configured to hold a substrate and transfer the substrate between a first position and a second position, a first inspector under the first position and the second position in the chamber, and configured to inspect a backside of the substrate, a lifter under the second position in the chamber, and configured to support the substrate and move the substrate from the second position to a third position, and a second inspector near the third position in the chamber and configured to inspect an edge of the substrate at the third position.

Abstract: Some embodiments relate to a system. The system includes a radio frequency (RF) generator configured to output a RF signal. A transmission line is coupled to the RF generator. A plasma chamber is coupled to RF generator via the transmission line, wherein the plasma chamber is configured to generate a plasma based on the RF signal. A micro-arc detecting element is configured to determine whether a micro-arc has occurred in the plasma chamber based on the RF signal.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: A terminal includes a first baseband processor, a second baseband processor, a first radio frequency chip, a second radio frequency chip, a first antenna, a second antenna, a third antenna, and a fourth antenna. The first baseband processor is coupled to the first antenna and the second antenna using the first radio frequency chip. The first radio frequency chip is coupled to the first antenna to form a first channel, and is coupled to the second antenna to form a second channel. The second baseband processor is coupled to the third antenna and the fourth antenna using the second radio frequency chip. The second radio frequency chip is coupled to the third antenna to form a third channel, and is coupled to the fourth antenna to form a fourth channel.

Abstract: A double-joint sickle knife for an endoscopy therapy includes a knife head, a knife base, a knife body, an outer sheath, a guide wire, a handle and a sliding rod. The knife head is connected with one end of the knife base by a transverse joint, and the other end of the knife base is connected with a head end of the knife body by a longitudinal joint. The outer sheath is sleeved on the outside of the knife body and capable of sliding along the knife body. The tail end of the knife body is connected with one end of the handle, and a sliding rod for adjusting the transverse joint is arranged on the handle. The guide wire is electric conductive. One end of the guide wire is connected with the knife head, and passes through the knife base, the knife body, the handle and the sliding rod successively. The other end of the guide wire is connected with the power port.

Abstract: A loading apparatus for processing a wafer cassette containing a plurality of wafers and an operating method thereof are provided. The operating method includes the following steps. The wafer cassette is loaded on a stage of the loading apparatus. The stage is configured to carry the wafer cassette and movably coupled to a main body of the loading apparatus to move within and out of a space of the main body. The stage is vertically moved among a standby position, a lifting position and an intermediate position; horizontally moved from the intermediate position to a door engaging position inside the space; positioned at the door engaging position, and a cassette door of the wafer cassette is opened. The stage is horizontally moved from the door engaging position to the intermediate position, and horizontally moved between the lifting position and an unloading position outside the space after opening the cassette door.

Abstract: A system and method for cleaning and inspecting ring frames is disclosed here. In one embodiment, a ring frame processing system includes: a cleaning station configured to remove a first tape on a first surface of a ring frame using a first blade, clean first adhesive residues from the first tape on the first surface of the ring frame using a first wheel brush, and remove second adhesive residues from a second tape on a second surface of the ring frame using a second blade; and an inspection station, wherein the inspection station comprises an automated optical inspection system configured to determine the cleanness of the first and second surfaces of the ring frame after cleaning.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: A method for scanning and analyzing a surface, the method comprising: receiving a piece of equipment with a target surface for inspection; receiving an input from a user; determining at least one scan parameter based on the user input; scanning the target surface using an optical detector in accordance with the at least one scan parameter; generating an image of the target surface; correcting the image of the target surface to remove at least one undesired feature to generate a corrected image based on the at least one scan parameter; and analyzing the corrected image to determine at least one geometric parameter of the target surface.

Abstract: A semiconductor equipment management method applicable to an electronic device for managing multiple pieces of semiconductor equipment is provided. The pieces of semiconductor equipment are respectively controlled through multiple control hosts, and the control hosts and the electronic device are connected to a switch device. The method includes: receiving real-time image information of each control host through the switch device; determining whether the real-time image information of each control host includes a triggering event by performing an image recognition on the real-time image information; executing a macro corresponding to the triggering event, where the macro includes at least one self-defined operation; generating at least one input command according to the self-defined operation of the executed macro; and controlling the control hosts to execute the self-defined operation of the executed macro by transmitting the input command to the control hosts through the switch device.

Abstract: In an embodiment, a system includes a profiler configured to detect variations along a surface of a semiconductor stage; and a jig configured to move the profiler along an axis over the semiconductor stage.

Abstract: A detaping machine is adapted for removing a tape from a frame, the tape includes a wafer mounting area and a periphery area surrounding the wafer mounting area. The detaping machine includes a carrier and a detaping module. The carrier is for supporting the tape and the frame. The detaping module includes an elastic pressing device and a detaping head, wherein the periphery area of the tape is adapted to be pressed by the elastic pressing device, and the wafer mounting area of the tape is adapted to be pressed by the detaping head. A detaping method is further provided.

Abstract: Embodiments of this disclosure disclose a voice interaction based method and apparatus for generating a multimedia playlist. An embodiment of the method comprises: acquiring first voice request information for playing multimedia resources; identifying a key tag for indicating a characteristic attribute of the multimedia resources in the first voice request information; finding the multimedia resources having the key tag in a multimedia resource library; and generating a multimedia playlist based on the found multimedia resources. The embodiment realizes automatic generation of multimedia playlists and improves the efficiency of voice service.

Abstract: A loading apparatus for processing a wafer cassette containing a plurality of wafers and an operating method thereof are provided. The operating method includes the following steps. The wafer cassette is loaded on a stage of the loading apparatus. The stage is configured to carry the wafer cassette and movably coupled to a main body of the loading apparatus to move within and out of a space of the main body. The stage is vertically moved among a standby position, a lifting position and an intermediate position; horizontally moved from the intermediate position to a door engaging position inside the space; positioned at the door engaging position, and a cassette door of the wafer cassette is opened. The stage is horizontally moved from the door engaging position to the intermediate position, and horizontally moved between the lifting position and an unloading position outside the space after opening the cassette door.

Abstract: The embodiments of the disclosure disclose an intelligent playing method and apparatus based on preference feedback. An embodiment of the method comprises: receiving voice feedback on currently played multimedia from a user; analyzing a user intention based on the voice feedback; calculating, in response to the user intention indicating updating a currently played multimedia list, a similarity between multimedia in a multimedia database and the current multimedia; and updating the currently played multimedia list based on the voice feedback and the similarity. The embodiment improves the quality and pertinence in playing multimedia.

Abstract: A fabrication system for fabricating an IC is provided which includes a processing tool, a computation device and a FDC system. The processing tool includes an electrode and an RF sensor to execute a semiconductor manufacturing process to fabricate the IC. The RF sensor wirelessly detects the intensity of the RF signal. The computation device extracts statistical characteristics based on the detection of the intensity of the RF signal. The FDC system determines whether or not the intensity of the RF signal meets a threshold value or a threshold range according to the extracted statistical characteristics. When the detected intensity of the RF signal exceeds the threshold value or the threshold range, the FDC system notifies the processing tool to adjust the RF signal or stop tool to check parts damage.

Abstract: A detaping machine is adapted for removing a tape from a frame, the tape includes a wafer mounting area and a periphery area surrounding the wafer mounting area. The detaping machine includes a carrier and a detaping module. The carrier is for supporting the tape and the frame. The detaping module includes an elastic pressing device and a detaping head, wherein the periphery area of the tape is adapted to be pressed by the elastic pressing device, and the wafer mounting area of the tape is adapted to be pressed by the detaping head. A detaping method is further provided.

Abstract: Some embodiments relate to a system. The system includes a radio frequency (RF) generator configured to output a RF signal. A transmission line is coupled to the RF generator. A plasma chamber is coupled to RF generator via the transmission line, wherein the plasma chamber is configured to generate a plasma based on the RF signal. A micro-arc detecting element is configured to determine whether a micro-arc has occurred in the plasma chamber based on the RF signal.

Abstract: Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.

Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing having an opening on a wall of the housing; a load port outside the housing; a robot arm inside the housing; and a processor. The load port is coupled to the wall and configured to load a wafer carrier for inspection. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.