Abstract: A probe apparatus includes a load port for mounting therein a carrier having therein a plurality of substrates; a plurality of probe apparatus main bodies, each having a probe card having probes on its bottom surface; a substrate transfer mechanism for transferring the substrates between the load port and the probe apparatus main bodies, the substrate transfer mechanism being rotatable about a vertical axis and movable up and down. The substrate transfer mechanism has at least three substrates capable of moving back and forth independently. Further, at least two wafers are received from the carrier by the substrate transfer mechanism, and then are sequentially loaded into the probe apparatus main bodies. The prove apparatus a high throughput increasing a wafer transfer efficiency.

Abstract: There is provided a probing apparatus capable of modifying an existing probing apparatus having a single loading port to one having dual loading ports while saving the space without increasing a foot print thereof and also capable of increasing an inspection efficiency by cooperating with an automatic transfer line for the apparatus having a single loading port. The probing apparatus includes a prober chamber in which a wafer is inspected and a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon a cassette accommodating therein a plurality of waters; and a wafer transfer unit for transferring the wafers between the loading ports and the prober chamber. The loading ports are arranged along a route where the cassette is transferred by an automatic transfer device.

Abstract: There is provided a processing apparatus capable of modifying an existing processing apparatus having a single loading port to one having dual loading ports by providing an additional loading port without increasing a foot print thereof and also capable of realizing a complete automation of a wafer transfer by utilizing an existing automatic transfer line. The processing apparatus includes a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon waters; a sub-chuck, disposed under the second loading port, for positioning the wafers; and a wafer transfer unit having a transfer arm for transferring the wafers between the sub-chuck and the prober chamber, the transfer arm being rotatable and movable vertically.

Abstract: A compact turning device for a heavy object, comprising a turning arm joined to the heavy object and a drive device drivingly turning the turning arm. The drive device further comprises a motor incorporating a rotor shaft connected to the rotating input part of a planetary gear type speed reducer on a same axis (A). Also, the turning arm is installed by joining its first plane to the plane of the planetary gear type speed reducer forming the rotating output part and its second plane orthogonal to the first plane to the heavy object. The turning arm and the drive device are disposed within the width (D) of the heavy object in the axis (A) direction of the turning pivot of the turning arm. The planetary gear type speed reducer of the drive device may be disposed in two front and rear stages.

Abstract: There is a jump in the number of devices formed on a single wafer, and it takes a lot of time to inspect a single wafer. In addition, if wafers are inspected every lot, detected wafers remain in staying in a prober until the inspection of all of the wafers is completed. Therefore, the time required to transfer the wafers of each lot to the subsequent step is delayed. As a result, it is difficult to shorten TAT (Turn-Around-Time), and it is difficult to flexibly operate the prober. A transfer system E according to the present invention includes: a host computer 1; a plurality of probers 2 under the control of the host computer 1; a plurality of RGVs 4 for delivering a wafer W to each of the probers 2, one by one, at its request; and a transfer operating unit 5, associated with the host computer, for operating the RGVs 4.

Abstract: In a method for handling a wafer case having attachable and detachable grips, the wafer case is handled in an automatic transfer line while the grips are detached from the wafer case and holding parts are attached to portions of the wafer case from which the grips have been detached. The holding parts allow an automatic transfer unit to hold the wafer case.

Abstract: The present invention relates to conveyance method for transporting a plurality of unprocessed/processed objects between an automatic transporting device (AGV) and a semiconductor manufacturing device (prober). The prober has a load port to/from which the objects are delivered from/to the AGV. The method comprises the steps of: making a communication between the AGV and the prober to decide respective timings of deliveries of the objects to/from the load port; and transporting the objects between the AGV and the prober via the load port, with the timings of the deliveries of the objects to/from the load port shifted from each other by using a holding site for provisionally holding the object. The holding site is at least one of components of the AGV and the prober other than the load port.

Abstract: In an automated guided vehicle including a transfer equipment which transfers a wafer, a buffer cassette which temporarily stores the wafer, and a pressing member which is provided at an opening of the buffer cassette, when traveling the automated guided vehicle, if the pressing member is slid to a center position from an end position of the opening of the buffer cassette to contact and press against the edge of the wafer, the pressing member was easily damaged by being rubbed against a periphery of the wafer, and there was a problem in durability of the pressing member. The pressing member 55 can transfer between a “pressing” position which contacts against the edge of the wafer 10 to press the wafer 10, and a “receding” position which is located away from the edge of the wafer 10.

Abstract: A centering unit comprises a plate, centering mechanism, link mechanism, and cylinder mechanism. The plate vertically divides the interior of a frame. The support table is located substantially on the center of the plate. The centering mechanism can center each wafer on the support table. Centering plates of the centering mechanism are located on either side of the support table and have engaging surfaces and that extend along the outer peripheral surface of the wafer. The link mechanism and the cylinder mechanism serve to extend and contract the space between the centering plates.

Abstract: Improvement of the workability in an automatic guided vehicle which carries and transfers a semiconductor wafer between stations in a semiconductor manufacturing plant etc. An automatic guided vehicle 1 is moved to an objective station after storing a wafer 10 in a buffer cassette with a transfer equipment 3, the wafer 10 in a cassette 5 is transferred to a positioning device 4 by taking it up with the transfer equipment 3, an ID information of the wafer 10 is read by a OCR 43 after truing up the position and direction of the wafer 10 by the positioning device 4, the wafer 10 whose ID information is read is retained with a transfer hand 31, another wafer 10 placed on the station then is removed by the other transfer hand 31, the wafer 10 whose ID information is read is transferred to the station in the predetermined position and direction and the ID information is controlled to transmit to the station.

Abstract: A conveyance system E for wafers W includes a host computer 1 for carrying out the management of the production of semiconductor devices, a plurality of probers 2 for inspecting the electric characteristics of the wafers W under the administration of the host computer 1, an AGV 3 for automatically transporting the wafers W in block of a carrier in order to deliver the wafers W one by one to these probers 2 according to respective demands and an AGV controller 4 for controlling the operation of the AGV 3 under the administration of the host computer 1.

Abstract: A wafer cassette comprises a case body and an adapter that supports substrates. There are adapters of various types corresponding to the size of the substrates to be supported. The case body and the adapter of any type are united in a manner such that fitting portions of the case body are fitted individually in fitting holes of the adapter.

Abstract: A stage (13) of the invention includes a stage substrate (13A) on which places at least one object (S1) to be inspected thereon, a light source (18) including a plurality of point light sources (18C) to illuminate the lower surface of the object to be inspected on the stage, and a diffusion mechanism (19) which diffuses light from the light source to irradiate the lower surface of the object. This stage can be suitably employed by an LCD panel inspection apparatus or image sensing element inspection apparatus.

Abstract: There is a jump in the number of devices formed on a single wafer, and it takes a lot of time to inspect a single wafer. In addition, if wafers are inspected every lot, detected wafers remain in staying in a prober until the inspection of all of the wafers is completed. Therefore, the time required to transfer the wafers of each lot to the subsequent step is delayed. As a result, it is difficult to shorten TAT (Turn-Around-Time), and it is difficult to flexibly operate the prober.

Abstract: A central position of a wafer 10 set on a place table 41 is calculated, a turn angle of the place table 41 when the wafer 10 is in the predetermined orientation is calculated based on the calculation result of the central position and positional information of an ID mark 11 received in advance and the quantity of expanding and contracting a transfer arm 30 and the turn angle of a turntable 39 are calculated for setting the wafer 10 such that the ID mark 11 is in the predetermined position and orientation to an OCR 43, and the turn angle of the place table 41 calculated based on the turn angle of the turntable 39 is corrected, the place table 41 is turned only by the corrected turn angle and the wafer 10 is turned and transferred to the OCR 43 by the transfer unit 3.

Abstract: In an automated guided vehicle including a transfer equipment which transfers a wafer, a buffer cassette which temporarily stores the wafer, and a pressing member which is provided at an opening of the buffer cassette, when traveling the automated guided vehicle, if the pressing member is slid to a center position from an end position of the opening of the buffer cassette to contact and press against the edge of the wafer, the pressing member was easily damaged by being rubbed against a periphery of the wafer, and there was a problem in durability of the pressing member.

Abstract: A conveyance system E for wafers W includes a host computer 1 for carrying out the management of the production of semiconductor devices, a plurality of probers 2 for inspecting the electric characteristics of the wafers W under the administration of the host computer 1, an AGV 3 for automatically transporting the wafers W in block of a carrier in order to deliver the wafers W one by one to these probers 2 according to respective demands and an AGV controller 4 for controlling the operation of the AGV 3 under the administration of the host computer 1.

Abstract: A centering unit comprises a plate, centering mechanism, link mechanism, and cylinder mechanism. The plate vertically divides the interior of a frame. The support table is located substantially on the center of the plate. The centering mechanism can center each wafer on the support table. Centering plates of the centering mechanism are located on either side of the support table and have engaging surfaces and that extend along the outer peripheral surface of the wafer. The link mechanism and the cylinder mechanism serve to extend and contract the space between the centering plates.

Abstract: A wafer cassette comprises a case body and an adapter that supports substrates. There are adapters of various types corresponding to the size of the substrates to be supported. The case body and the adapter of any type are united in a manner such that fitting portions of the case body are fitted individually in fitting holes of the adapter.

Abstract: A wafer transfer system which reduces time for orienting a wafer in transferring the wafer and improving the efficiency of transferring the wafer.