Abstract: An embodiment of the present invention provides an uplink access method based on an orthogonal frequency-division multiple access mechanism, comprising: determining the number of subchannels available for a current transmission and the number of time slot blocks required for the current access; transmitting uplink access trigger frames on the available subchannels; randomly selecting among the available subchannels and the time slot blocks; and transmitting an uplink access response frame to an access point by the randomly selected available subchannel and time slot block, to perform random access. The embodiment of the present invention can reduce an average time taken by users to access channels, thereby reducing transmission delay of data packet, reducing waste of time and subchannel resources, and improving the throughput of the entire network.

Abstract: A non-hierarchical and iteratively updated tracking system includes a first module for creating an initial trajectory model for multiple targets from a set of received image detections. A second module is connected to the first module to provide identification of multiple targets using a target model, and a third module is connected to the second module to solve a joint object function and maximal condition probability for the target module. A tracklet module can update the first module trajectory module, and after convergence, output a trajectory model for multiple targets.

Abstract: A display substrate, a manufacturing method and a display device are provided. The display substrate includes a functional region and a peripheral region surrounding the functional region. A barrier structure is arranged at the peripheral region of the display substrate, and includes a plurality of barrier members spaced from each other in a direction away from the functional region. At least a part of the barrier member are made of metal.

Abstract: The present disclosure relates to an array substrate, manufacturing method thereof, and a display panel. The array substrate includes a substrate, at least a first top gate TFT and at least a first bottom gate TFT disposed on the substrate and located in each sub-pixel region; a gate of the first top gate TFT and a gate of the first bottom gate TFT are formed in a same layer with same material, an active layer pattern of the first top gate TFT and an active layer pattern of the first bottom gate TFT are respectively arranged on two sides of the gate, and orthographic projections of the active layer pattern of the first top gate TFT and the active layer pattern of the first bottom gate TFT on the substrate are spaced from each other in a first direction.

Abstract: A flexible printed circuit board is disclosed, which includes a pad portion, wherein the pad portion includes a pair of first signal pads formed in a first conductor layer and respectively connected with a pair of signal wires, a pair of second signal pads formed in a second conductor layer and electrically separated from a grounding layer; a pair of first grounding pads formed in the first conductor layer and electrically separated from the pair of signal wires, wherein: the pair of first signal pads is sandwiched between the pair of first grounding pads, and a pair of second grounding pads formed in the second conductor layer and connected with the grounding layer, wherein the pair of second signal pads are sandwiched between the pair of second grounding pads. A width of the first and the second signal pads is larger than that of the signal wires.

Abstract: A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.

Abstract: A flexible printed circuit board is disclosed, which includes a pad portion, wherein the pad portion includes a pair of first signal pads formed in a first conductor layer and respectively connected with a pair of signal wires, a pair of second signal pads formed in a second conductor layer and electrically separated from a grounding layer; a pair of first grounding pads formed in the first conductor layer and electrically separated from the pair of signal wires, wherein: the pair of first signal pads is sandwiched between the pair of first grounding pads, and a pair of second grounding pads formed in the second conductor layer and connected with the grounding layer, wherein the pair of second signal pads are sandwiched between the pair of second grounding pads. A width of the first and the second signal pads is larger than that of the signal wires.

Abstract: An embodiment of the present invention provides an uplink access method based on an orthogonal frequency-division multiple access mechanism, comprising: determining the number of subchannels available for a current transmission and the number of time slot blocks required for the current access; transmitting uplink access trigger frames on the available subchannels; randomly selecting among the available subchannels and the time slot blocks; and transmitting an uplink access response frame to an access point by the randomly selected available subchannel and time slot block, to perform random access. The embodiment of the present invention can reduce an average time taken by users to access channels, thereby reducing transmission delay of data packet, reducing waste of time and subchannel resources, and improving the throughput of the entire network.

Abstract: A data visual analysis method, system and terminal, and a computer readable storage medium are provided. The method includes: obtaining to-be-analyzed parameters and generating a data analysis model, the data analysis model including a plurality of execution units; the data sources collecting data information related to the to-be-analyzed parameters; the execution units performing analysis on the data information collected by the data sources, to obtain execution results of the execution units; and visually outputting the execution results of the execution units.

Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

Abstract: A system and method to screen for malignant gliomas, other brain tumors, and brain injuries use disturbance coefficient, differential impedances, and artificial neural networks. The system uses prescribed excitation signals with several system configurations to measure the differential impedances, calculate harmonic responses and nonlinearity of brain tissue, and estimate the disturbance coefficient that indicates the likelihood of malignant gliomas, other brain tumors, and brain injuries. The disturbance coefficient is a weighted sum of many parameters such as receiving differential impedances, transmission differential impedances, harmonic responses, frequency dispersion, and nonlinear responses using different system configurations and different excitation signals. The method includes arranging the transmitters, receivers, and transmission lines to maximize the sensitivity of detecting brain tissue condition.

Abstract: A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.

Abstract: A facial recognition method using online sparse learning includes initializing target position and scale, extracting positive and negative samples, and extracting high-dimensional Haar-like features. A sparse coding function can be used to determine sparse Haar-like features and form a sparse feature matrix, and the sparse feature matrix in turn is used to classify targets.

Abstract: A non-hierarchical and iteratively updated tracking system includes a first module for creating an initial trajectory model for multiple targets from a set of received image detections. A second module is connected to the first module to provide identification of multiple targets using a target model, and a third module is connected to the second module to solve a joint object function and maximal condition probability for the target module. A tracklet module can update the first module trajectory module, and after convergence, output a trajectory model for multiple targets.

Abstract: A supporting frame includes at least one supporting element, a base and a light-permeable pillar. The supporting element has a first through-hole. A cam is disposed in the supporting element and has a second through-hole and a turning portion. The second through-hole is disposed corresponding to the first through-hole. The base extends to form a sleeve. The light-permeable pillar passes through the first through-hole and the second through-hole and is inserted into the sleeve. The supporting element is capable of sliding along the light-permeable pillar. The turning portion is configured for pushing against an inner wall of the supporting element for fixing the supporting element on the light-permeable pillar.

Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

Abstract: A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.

Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

Abstract: An adjustable support for multi-axis is adapted for a host device where at least one element is installed. The adjustable support for multi-axis comprises a base, at least one installation element and a support element. The base comprises an installation portion and a slide-guiding portion. The installation portion is located at one end of the base, and the slide-guiding portion is located at the center of the base. The installation element is disposed on the installation portion for being detachably attached to the host device. The support element is adjustably disposed on the slide-guiding portion. When the support element is fixed, one end of the support element is capable of supporting the at least one element. When adjusting the position of the support element, the support element is capable of moving on the slide-guiding portion and rotating about the slide-guiding portion.