Patents by Inventor Sing Chan
Sing Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11911716Abstract: A sand separation system includes a separator configured to separate a multi-phase process fluid into a solids and a fluid. The system also includes a blowdown vessel coupled to the separator. The blowdown vessel is configured to receive the solids and a portion of the fluid from the separator. The system also includes a fluid removal assembly coupled to the blowdown vessel. The fluid removal assembly is configured to drain at least some of the fluid in the blowdown vessel therefrom, substantially without removing the solids from the blowdown vessel.Type: GrantFiled: June 11, 2019Date of Patent: February 27, 2024Assignee: ENERCORP ENGINEERED SOLUTIONS INC.Inventors: Rory Nagge, Nikolay Spiridonov, Ryan Thomas Bowley, Jeffrey Gar Sing Chan
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Publication number: 20240037370Abstract: A system and method are disclosed herein. The system includes one or more processors and a memory having programming instructions stored thereon, which, when executed by the one or more processors, performs operations. The operations include retrieving historical account activity. The operations further include constructing a training data set that includes the historical inflow data, the historical outflow data, and known forecast information from the historical account activity. The operations further include generating a combined prediction model configured to forecast future inflow activity and future outflow activity. The operations further include receiving current inflow activity, current outflow activity, and current balance information for a user.Type: ApplicationFiled: October 11, 2023Publication date: February 1, 2024Inventors: Jason Chun Sing Chan, Richard Saunders, Ryan Murray, Yuchen Hua, Adrian Yu Hin Lam, Sri Chaitanya Somanchi, Noam Katz
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Patent number: 11485448Abstract: The present invention relates to an energy transfer system, in particular in the form of an energy efficient wheel for use with a vehicle such as a bicycle, which energy transfer system is operable to convert potential energy in the form of the load applied by the weight of the person on the vehicle into kinetic energy in the form of driving torque applied to the wheel, the system including an inner hub and an outer hub eccentrically coupled to the inner hub, in addition to a rim connected to the outer hub via an array of spokes, wherein an actuator comprising a pair of flanges extends radially outwardly from the inner hub and an array of lever arms are hingedly mounted to the outer hub and engaged by the actuator such as to be hingedly displaceable by the actuator in response to relative movement between the inner and outer hubs, and a spring captured between each lever arm and one of the spokes.Type: GrantFiled: October 25, 2018Date of Patent: November 1, 2022Assignee: Super Wheel System Ltd.Inventor: Kam Sing Chan
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Publication number: 20220284372Abstract: Embodiments provide organization monitoring. An embodiment scores behavioral indicators for members of an organization by processing received time allocation data and attention minutes data to determine a value for each of a plurality of objective measures for the members. Metric scores for the members are assigned for each of the plurality of objective measures by comparing the determined value for each of the plurality of objective measures to respective benchmark values for each of the plurality of objective measures. Scores are determined for the members for each of a plurality of behavioral indicators by aggregating one or more assigned metric scores. In turn, scores for the plurality of behavioral indicators are aggregated to determine a respective score for each of a plurality of organization characteristics for the given organization. The scores for the organization characteristics are used to create a health score for the organization indicative of company culture.Type: ApplicationFiled: March 2, 2021Publication date: September 8, 2022Inventors: Taemie Jung Kim, Rowana Ahmed, Kwok Sing Chan, Douglas Othon Issichopolous, Aruembora Kang, Kee Seon Nam, Talha Oz
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Patent number: 11183509Abstract: An approach to use silicided bit line contacts that do not short to the underlying substrate in memory devices. The approach provides for silicide formation in the bit line contact area, using a process that benefits from being self-aligned to the oxide-nitride-oxide (ONO) nitride edges. A further benefit of the approach is that the bit line contact implant and rapid temperature anneal process can be eliminated. This approach is applicable to embedded flash, integrating high density devices and advanced logic processes.Type: GrantFiled: June 18, 2020Date of Patent: November 23, 2021Assignee: Cypress Semiconductor CorporationInventors: Ching-Huang Lu, Simon Siu-Sing Chan, Hidehiko Shiraiwa, Lei Xue
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Publication number: 20210221466Abstract: The present invention relates to an energy transfer system, in particular in the form of an energy efficient wheel for use with a vehicle such as a bicycle, which energy transfer system is operable to convert potential energy in the form of the load applied by the weight of the person on the vehicle into kinetic energy in the form of driving torque applied to the wheel, the system including an inner hub and an outer hub eccentrically coupled to the inner hub, in addition to a rim connected to the outer hub via an array of spokes, wherein an actuator comprising a pair of flanges extends radially outwardly from the inner hub and an array of lever arms are hingedly mounted to the outer hub and engaged by the actuator such as to be hingedly displaceable by the actuator in response to relative movement between the inner and outer hubs, and a spring captured between each lever arm and one of the spokes.Type: ApplicationFiled: October 25, 2018Publication date: July 22, 2021Inventor: Kam Sing Chan
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Publication number: 20200411537Abstract: An approach to use silicided bit line contacts that do not short to the underlying substrate in memory devices. The approach provides for silicide formation in the bit line contact area, using a process that benefits from being self-aligned to the oxide-nitride-oxide (ONO) nitride edges. A further benefit of the approach is that the bit line contact implant and rapid temperature anneal process can be eliminated. This approach is applicable to embedded flash, integrating high density devices and advanced logic processes.Type: ApplicationFiled: June 18, 2020Publication date: December 31, 2020Applicant: Infineon Technologies LLCInventors: Ching-Huang LU, Simon Siu-Sing Chan, Hidehiko Shiraiwa, Lei Xue
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Publication number: 20190374879Abstract: A sand separation system and method, of which the sand separation system includes a separator configured to separate a multi-phase process fluid into a solids and a fluid, a blowdown vessel coupled to the separator, wherein the blowdown vessel is configured to receive the solids and a portion of the fluid from the separator, and a fluid removal assembly coupled to the blowdown vessel. The fluid removal assembly is configured to drain at least some of the fluid in the blowdown vessel therefrom, substantially without removing the solids from the blowdown vessel.Type: ApplicationFiled: June 11, 2019Publication date: December 12, 2019Inventors: Rory Nagge, Nikolay Spiridonov, Ryan Thomas Bowley, Jeffrey Gar Sing Chan
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Patent number: 10384918Abstract: An assembly for adjusting a position of a vessel includes a frame for carrying the vessel, and a lifting device configured to move the frame from a horizontal position to a first vertical position by pivoting the frame, and to move the frame from the first vertical position to a second vertical position by raising the frame.Type: GrantFiled: October 27, 2017Date of Patent: August 20, 2019Assignee: ENERCORP SAND SOLUTIONS INC.Inventors: Rory Nagge, Jeffrey Gar Sing Chan
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Patent number: 10256137Abstract: An A method for fabricating an integrated circuit (IC) comprising a substrate, a first device, a second device, and a trench in the substrate is described herein. The trench is self-aligned between the first and second devices and comprises a first portion filled with a dielectric material and a second portion filled with a conductive material. The self-aligned placement of the trench provides electrical isolation between the first and second devices and allows for higher packing density without negatively affecting the operation of closely spaced devices in a high density IC.Type: GrantFiled: November 3, 2017Date of Patent: April 9, 2019Assignee: Cypress Semiconductor CorporationInventors: Ching-Huang Lu, Lei Xue, Kenichi Ohtsuka, Simon Siu-Sing Chan, Rinji Sugino
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Publication number: 20180166323Abstract: A method for fabricating an integrated circuit (IC) comprising a substrate, a first device, a second device, and a trench in the substrate is described herein. The trench is self-aligned between the first and second devices and comprises a first portion filled with a dielectric material and a second portion filled with a conductive material. The self-aligned placement of the buried trench provides electrical isolation between the first and second devices and allows for higher packing density without negatively affecting the operation of closely spaced devices in a high density IC.Type: ApplicationFiled: November 3, 2017Publication date: June 14, 2018Applicant: Cypress Semiconductor CorporationInventors: Ching-Huang LU, Lei Xue, Kenichi Ohtsuka, Simon Siu-Sing Chan, Rinji Sugino
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Publication number: 20180118536Abstract: An assembly for adjusting a position of a vessel includes a frame for carrying the vessel, and a lifting device configured to move the frame from a horizontal position to a first vertical position by pivoting the frame, and to move the frame from the first vertical position to a second vertical position by raising the frame.Type: ApplicationFiled: October 27, 2017Publication date: May 3, 2018Inventors: Rory Nagge, Jeffrey Gar Sing Chan
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Patent number: 9841399Abstract: A package for a chemical sensor including an encapsulation and a pressure balancing structure is disclosed. The encapsulation encapsulates a chemical sensor and has a hole for exposing a chemical sensitive part of the chemical sensor. The pressure balancing structure balances pressure applied to the chemical sensor at the chemical sensitive part.Type: GrantFiled: July 26, 2016Date of Patent: December 12, 2017Assignee: Agency for Science, Technology and ResearchInventors: Daniel Rhee Min Woo, How Yuan Hwang, Vivek Chidambaram, Yuen Sing Chan, Eva Leong Ching Wai, Jong Bum Lee
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Patent number: 9831114Abstract: A system and method for providing electrical isolation between closely spaced devices in a high density integrated circuit (IC) are disclosed herein. An integrated circuit (IC) comprising a substrate, a first device, a second device, and a trench in the substrate and a method of fabricating the same are also discussed. The trench is self-aligned between the first and second devices and comprises a first filled portion and a second filled portion. The first fined portion of the trench comprises a dielectric material that forms a buried trench isolation for providing electrical isolation between the first and second devices. The self-aligned placement of the buried trench isolation allows for higher packing density without negatively affecting the operation of closely spaced devices in a high density IC.Type: GrantFiled: June 24, 2016Date of Patent: November 28, 2017Assignee: Cypress Semiconductor CorporationInventors: Ching-Huang Lu, Lei Xue, Kenichi Ohtsuka, Rinji Sugino, Simon Siu-Sing Chan
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Patent number: 9666591Abstract: An approach to use silicided bit line contacts that do not short to the underlying substrate in memory devices. The approach provides for silicide formation in the bit line contact area, using a process that benefits from being self-aligned to the oxide-nitride-oxide (ONO) nitride edges. A further benefit of the approach is that the bit line contact implant and rapid temperature anneal process can be eliminated. This approach is applicable to embedded flash, integrating high density devices and advanced logic processes.Type: GrantFiled: January 26, 2016Date of Patent: May 30, 2017Assignee: CYPRESS SEMICONDUCTOR CORPORATIONInventors: Ching-Huang Lu, Simon Siu-Sing Chan, Hidehiko Shiraiwa, Lei Xue
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Publication number: 20170003247Abstract: A package for a chemical sensor including an encapsulation and a pressure balancing structure is disclosed. The encapsulation encapsulates a chemical sensor and has a hole for exposing a chemical sensitive part of the chemical sensor. The pressure balancing structure balances pressure applied to the chemical sensor at the chemical sensitive part.Type: ApplicationFiled: July 26, 2016Publication date: January 5, 2017Inventors: Daniel Rhee Min Woo, How Yuan Hwang, Vivek Chidambaram, Yuen Sing Chan, Eva Leong Ching Wai, Jong Bum Lee
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Patent number: 9437470Abstract: A system and method for providing electrical isolation between closely spaced devices in a high density integrated circuit (IC) are disclosed herein. An integrated circuit (IC) comprising a substrate, a first device, a second device, and a trench in the substrate and a method of fabricating the same are also discussed. The trench is self-aligned between the first and second devices and comprises a first filled portion and a second filled portion. The first fined portion of the trench comprises a dielectric material that forms a buried trench isolation for providing electrical isolation between the first and second devices. The self-aligned placement of the buried trench isolation allows for higher packing density without negatively affecting the operation of closely spaced devices in a high density IC.Type: GrantFiled: October 8, 2013Date of Patent: September 6, 2016Assignee: Cypress Semiconductor CorporationInventors: Ching-Huang Lu, Lei Xue, Kenichi Ohtsuka, Simon Siu-Sing Chan, Rinji Sugino
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Patent number: 9431315Abstract: A package for a chemical sensor including an encapsulation and a pressure balancing structure is disclosed. The encapsulation encapsulates a chemical sensor and has a hole for exposing a chemical sensitive part of the chemical sensor. The pressure balancing structure balances pressure applied to the chemical sensor at the chemical sensitive part.Type: GrantFiled: December 26, 2014Date of Patent: August 30, 2016Assignee: Agency for Science, Technology and ResearchInventors: Daniel Rhee Min Woo, How Yuan Hwang, Vivek Chidambaram, Yuen Sing Chan, Eva Leong Ching Wai, Jong Bum Lee
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Publication number: 20160211321Abstract: A system for providing electrical isolation between closely spaced devices in a high density integrated circuit (IC) is disclosed herein. An integrated circuit (IC) comprises a substrate, a first device, a second device, and an isolator. The isolator is positioned between first and second device. The isolator comprises one or more cavities. The isolator may be filled with dielectric material.Type: ApplicationFiled: February 1, 2016Publication date: July 21, 2016Inventors: Rinji Sugino, Lei Xue, Ching-Huang LU, Simon Siu-Sing CHAN
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Publication number: 20160211271Abstract: An approach to use silicided bit line contacts that do not short to the underlying substrate in memory devices. The approach provides for silicide formation in the bit line contact area, using a process that benefits from being self-aligned to the oxide-nitride-oxide (ONO) nitride edges. A further benefit of the approach is that the bit line contact implant and rapid temperature anneal process can be eliminated. This approach is applicable to embedded flash, integrating high density devices and advanced logic processes.Type: ApplicationFiled: January 26, 2016Publication date: July 21, 2016Inventors: Ching-Huang LU, Simon Siu-Sing CHAN, Hidehiko Shiraiwa, Lei Xue