Abstract: An aqueous ink jet composition includes a dye component composed of at least one of sublimation dyes and disperse dyes, polyester, 1-(hydroxyalkyl)-2-pyrrolidone, and water, wherein the content (mass %) of the polyester is 4.0 times or more and 300.0 times or less the content (mass %) of the dye component.

Abstract: A white pigment composition contains titanium oxide having an average particle diameter D1 of less than 100 nm; and hollow particles having an average particle diameter D2 of 100 nm or more.

Abstract: A method for manufacturing a semiconductor device includes: forming a first film on a substrate; forming a second film containing at least carbon on the first film; forming a hole in the second film; and forming a recess, which communicates with the hole, in the first film by etching using the second film as a mask. In this method, the second film includes a first layer formed on the first film, and a second layer formed on the first layer. The first layer having a higher oxygen concentration than the second layer.

Abstract: An ink jet ink contains: an inorganic oxide colloid; an amino acid; a first glycol monoether represented by the following formula (1): R11O—(R12O)n1—H (1); a second glycol monoether represented by the following formula (2): R21O—(R22O)n2—H(2); and water. In the ink jet ink described above, in the formula (1), R11 represents an alkyl group having 2 to 10 carbon atoms, R12 represents an alkylene group having 2 to 4 carbon atoms, and n1 represents a repetition number of 1 to 10, and in the formula (2), R21 represents an alkyl group having 1 to 8 carbon atoms, R22 represents an alkylene group having 2 to 4 carbon atoms, the number of carbon atoms of R21 is smaller than the number of carbon atoms of R11, and n2 represents a repetition number of 1 to 10.

Abstract: An ink for ink jet recording according to an embodiment is an ink for ink jet recording containing pigment, colloidal silica, amine, and amino acid.

Abstract: An ink jet ink contains an inorganic oxide colloid; a betaine; 1-(2-hydroxyethyl)-2-pyrrolidone; and water, and in the ink jet ink described above, a content of the betaine is equivalent to or larger than a content of a solid component of the inorganic oxide colloid on a mass basis.

Abstract: An ink jet ink contains a pigment; an inorganic oxide colloid; a betaine; and water, and in the ink jet ink described above, a total concentration (mg/L) of potassium ions and sodium ions in the ink is 500 ppm or less.

Abstract: An ink for ink jet recording according to an embodiment is an ink for ink jet recording containing pigment, colloidal silica, and amino acid.

Abstract: According to one embodiment, a method of manufacturing a semiconductor device includes forming a first film on a substrate. The method further includes forming a second film on the first film. The method further includes forming a recess in the first film using the second film as a mask. The second film includes a first layer having carbon and a second layer having carbon formed on the first layer. The second layer has a second carbon density lower than a first carbon density of the first layer.

Abstract: A semiconductor device of an embodiment includes a control circuit arranged on a substrate, a first conductive layer arranged on the control circuit and containing a first element as a main component, a multilayer structure arranged on the first conductive layer and configured such that multiple second conductive layers and multiple insulating layers are alternately stacked on each other, a memory layer penetrating the multilayer structure and reaching the first conductive layer at a bottom portion, a first layer arranged between the control circuit and the first conductive layer and containing the first element as a main component, and a second layer arranged between the control circuit and the first layer and containing, as a main component, a second element different from the first element.

Abstract: According to one embodiment, a method of manufacturing a semiconductor device includes forming a first film on a substrate. The method further includes forming a second film on the first film. The second film includes fluoride of a first metal element having a first boiling point of 800° C. or higher and fluoride of a second metal element having a second boiling point of 800° C. or higher. The second metal element is different from the first metal element. The method further includes etching the first film using the second film as an etching mask and etching gas that includes fluorine.

Abstract: An ink jet printing ink composition contains a pigment, colloidal silica, trimethylglycine, and water, and in which a content of the colloidal silica is lower than or equal to a content of the trimethylglycine.

Abstract: An aqueous ink jet ink composition contains pigment particles, inorganic oxide particles, and resin particles. The content of the inorganic oxide particles is 1.0% to 10.0% relative to the total mass of the ink composition. The ink composition satisfies the following relationship: D50 of the resin particles ?D50 of the inorganic oxide particles ?D50 of the pigment particles, wherein D50 represents the volume median diameter of the corresponding particles.

Abstract: An ink composition contains pigment particles, inorganic oxide particles, and a lactam solvent. The content of the inorganic oxide particles is 5.0% to 10.0% relative to the total mass of the ink composition. The ink composition satisfies the following relationship: D50 of the pigment particles×0.1?D50 of the inorganic oxide particles?D50 of the pigment particles×1.5, wherein D50 represents the volume median diameter of the corresponding particles.

Abstract: An ink jet recording apparatus includes a line head including a region of nozzles that are formed in an intersecting direction intersecting a transport direction of a recording medium and eject an ink, the region covering a printing region of the recording medium in the intersecting direction, a drying unit that dries the recording medium, a transport unit that transports the recording medium, and a control unit. The ink contains colloidal silica, and the control unit controls the drying unit and the transport unit such that drying of the ink is started within 0.4 second after the ink is attached to the recording medium.

Abstract: An aqueous ink jet composition contains water and particles of a material containing polyester and a dye composed of at least one of sublimation dyes or at least one of disperse dyes. Preferably, the dye is dispersed in the particles.

Abstract: An aqueous ink jet composition contains a dye composed of at least one of sublimation fluorescent dyes or at least one of disperse fluorescent dyes, polyester, and water. The amount of the polyester is 8 times or more and 300 times or less greater than the amount of the dye. Preferably, the amount of the polyester is 5% by mass or more and 35% by mass or less. Preferably, the amount of the dye is 0.05% by mass or more and 1% by mass or less.

Abstract: An aqueous ink jet composition contains water, a dye composed of at least one of sublimation dyes or at least one of disperse dyes, and polyester particles, which are particles made of at least one material including polyester. At least a subset of the polyester particles is stained with the dye.

Abstract: An aqueous ink jet composition contains water, a dye composed of at least one of sublimation dyes or at least one of disperse dyes, polyester, and a urethane resin. Preferably, 4.0?XE/XD?300, where XD is the amount of the dye in the aqueous ink jet composition (% by mass), and XE is the amount of the polyester in the aqueous ink jet composition (% by mass).

Abstract: A method of manufacturing a semiconductor device includes forming a mask layer including aluminum or an aluminum compound on a layer to be etched comprising at least one first metal selected from tungsten, tantalum, zirconium, hafnium, molybdenum, niobium, ruthenium, osmium, rhenium, and iridium. The method of manufacturing a semiconductor device further includes patterning the mask layer, and etching the layer to be etched by using the patterned mask layer to form a hole or a groove in the layer to be etched.