Abstract: A multilayer electronic component includes: a laminate having a plurality of multilayer capacitors are disposed to be adjacent to each other, each of the multilayer capacitors including a body including dielectric layers and first and second internal electrodes alternately exposed through two end surfaces of the body facing each other in a length direction with each of the dielectric layers interposed therebetween, and first and second external electrodes disposed on the two end surfaces of the body in the length direction, respectively; and first and second terminals disposed on the laminate to cover a plurality of first and second external electrodes, respectively.

Abstract: A multilayer capacitor includes: a capacitor body including an active region including a plurality of first and second internal electrodes alternately exposed, respectively, through opposite end surfaces of the capacitor body in a length direction, and upper and lower cover regions disposed on upper and lower surfaces of the active region, respectively; and first and second external electrodes formed on the opposite end surfaces of the capacitor body in the length direction, respectively. The lower cover region of the capacitor body may have a space portion.

Abstract: A composite electronic component includes: a body part including a dielectric portion; first and second external electrodes disposed on outer surfaces of the body part; a plurality of first and second electrodes disposed inside of the dielectric portion, and electrically connected to the first and second external electrodes, respectively; third and fourth electrodes disposed on an upper portion of the dielectric portion, and electrically connected to the first and second external electrodes, respectively; a gap provided between the third and fourth electrodes; a groove disposed below the gap; and an electrostatic discharge (ESD) layer disposed in the gap.

Abstract: A composite electronic component includes a multilayer capacitor including a capacitor body, which includes first and second internal electrodes facing each other and a plurality of dielectric layers each interposed therebetween and first and second external electrodes disposed on opposing ends of the capacitor body, a high-rigidity chip including a substrate disposed on a lower side of the multilayer capacitor and first and second discharge electrodes disposed on the substrate and spaced apart from each other, the first and second discharge electrodes being connected to the first and second external electrodes, respectively, and extending to an upper or lower surface of the substrate, and an sealing part covering the first and second discharge electrodes and including a space portion, which is provided between the first and second discharge portions.

Abstract: A composite electronic component includes a multilayer capacitor including external electrodes, a tantalum capacitor disposed adjacently to the multilayer capacitor, first electrode parts connected to the external electrodes, a second electrode part connected to a second body, and an encapsulant encapsulating the multilayer capacitor and the tantalum capacitor and formed such that portions of the first and second electrode parts are exposed.

Abstract: A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.

Abstract: A hybrid inductor includes an inductor body having a core part in which a coil part is disposed, and first and second cover parts having the core part interposed therebetween. The core part includes magnetic metal layers, and the first and second cover parts include ferrite layers.

Abstract: A composite electronic component includes a composite body including: a multilayer ceramic capacitor including a first ceramic body including a plurality of dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween and stacked to be perpendicular to a lower surface of the first ceramic body, and a ceramic chip being coupled to the multilayer ceramic capacitor and disposed on a lower portion of the multilayer ceramic capacitor, the ceramic chip including a second ceramic body, first and second terminal electrodes disposed on upper and lower portions of the second ceramic body and connected to the first and second external electrodes, respectively.

Abstract: A multilayer ceramic capacitor includes a ceramic body in which a plurality of dielectric layers are layered in a width direction, an active part including a plurality of first and second internal electrodes alternately exposed to opposing end surfaces of the ceramic body with the dielectric layer interposed therebetween to form capacitance, an upper cover part provided on an upper surface of the active part, a lower cover part provided on a lower surface of the active part and having a thickness greater than that of the upper cover part, and first and second external electrodes formed to cover opposing end surfaces of the ceramic body, wherein a ratio of the cube root of the volume of the active part to the thickness of the lower cover part is between 1.4 and 8.8.

Abstract: An inductor is provided including a multilayer body in which a plurality of magnetic layers containing a ferrite are laminated. A coil part including a plurality of conductive patterns is disposed in the multilayer body. External electrodes are electrically connected to the coil part. The ferrite may contain iron (Fe), manganese (Mn), nickel (Ni), zinc (Zn), and vanadium (V), and the ferrite may contain 40 to 55 mol % of iron (Fe) calculated as iron oxide (Fe2O3), 5 to 20 mol % of nickel (Ni) calculated as nickel oxide (NiO), 15 to 25 mol % of zinc (Zn) calculated as zinc oxide (ZnO), 15 to 30 mol % of manganese (Mn) calculated as manganese oxide (MnO), and 1 to 4 mol % of vanadium (V) calculated as vanadium oxide (V2O5).

Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a body having internal electrodes stacked to face each other and a plurality of dielectric layers interposed therebetween, and first and second external electrodes disposed on both end portions of the body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor, wherein the ceramic chip has a double-step shape and includes two ceramic chips having different lengths to each other and coupled in a thickness direction of the ceramic chip.

Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes and having first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes including first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extending from the first and second connected portions to portions of the first surface of the capacitor body, respectively; a first connection terminal disposed on the first band portion; and a second connection terminal disposed on the second band portion, wherein 0.05?A1/A1?0.504, where A1 is an area of the first or second connection terminal in a thickness-width direction, and A2 is an area of the first or second band portion in a width-length direction.

Abstract: A composite electronic component includes a composite body that includes a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes are disposed on both end portions of the first ceramic body. The ceramic chip is disposed on a lower portion of the multilayer ceramic capacitor and includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. A plurality of electrodes are disposed in the second ceramic body.

Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.

Abstract: A multilayer ceramic electronic component includes a multilayer ceramic capacitor including a ceramic body, and external electrodes disposed on first and second end surfaces of the ceramic body. First and second metal frames are each disposed along a respective one of two end surfaces of the multilayer ceramic capacitor, the first and second metal frames each disposed along upper and lower surfaces of the multilayer ceramic capacitor. An insulating cover encloses the multilayer ceramic capacitor and upper portions of the first and second metal frames. Lateral portions of the first and second metal frames disposed along end surfaces of the multilayer ceramic capacitor are in contact with the insulating cover, and lower portions of the first and second metal frames disposed along lower surfaces of the multilayer ceramic capacitor are spaced apart from the insulating cover by an interval.

Abstract: A multilayer ceramic electronic component includes a multilayer ceramic capacitor including a ceramic body, and external electrodes disposed on first and second end surfaces of the ceramic body. First and second metal frames are each disposed along a respective one of two end surfaces of the multilayer ceramic capacitor, the first and second metal frames each disposed along upper and lower surfaces of the multilayer ceramic capacitor. An insulating cover encloses the multilayer ceramic capacitor and upper portions of the first and second metal frames. Lateral portions of the first and second metal frames disposed along end surfaces of the multilayer ceramic capacitor are in contact with the insulating cover, and lower portions of the first and second metal frames disposed along lower surfaces of the multilayer ceramic capacitor are spaced apart from the insulating cover by an interval.

Abstract: A composite electronic component includes a multilayer ceramic capacitor including a ceramic body in which dielectric layers and internal electrodes are alternately disposed, and first and second external electrodes disposed on a lower surface of the ceramic body; a tantalum capacitor including a body portion containing a sintered material of a tantalum powder and a tantalum wire having a portion embedded in the body portion, and disposed on the multilayer ceramic capacitor; and an encapsulant part enclosing the tantalum capacitor and the multilayer ceramic capacitor, wherein the internal electrodes are led to the lower surface of the ceramic body.

Abstract: The composite electronic component includes: the capacitor including a body in which a plurality of dielectric layers and internal electrodes facing each other, with the dielectric layer interposed therebetween, are stacked, and the ESD protection device including first and second lead electrodes disposed on the body of the cpacitor, a discharge part disposed between the first and second lead electrodes, and a protection layer disposed on the first and second lead electrodes and the discharge part; an input terminal connected to the internal electrode of the capacitor and the first lead electrode of the ESD protection device; and a ground terminal connected to the internal electrode of the capacitor and the second lead electrode of the ESD protection device. G2/G1<4.0 is satified, in which G1 is a distance between the internal electrodes adjacent to each other and G2 is a distance between the first and second lead electrodes.

Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part. An input terminal is disposed on a first side surface of the composite body and is connected to the coil part. An output terminal includes a first output terminal disposed on the first side surface of the composite body and connected to the coil part and a second output terminal disposed on a first end surface of the composite body and connected to the first internal electrodes. A ground terminal is disposed on a second end surface of the composite body and is connected to the second internal electrodes. The capacitor is coupled to a side surface of the inductor.