Abstract: There are provided an inductor array chip and a board having the same. The inductor array chip includes: a body in which a plurality of magnetic layers are stacked; first and second coil parts having a plurality of conductive patterns and a plurality of conductive vias formed in the plurality of magnetic layers; and first to fourth external electrodes disposed on outer surfaces of the body to be connected to both ends of the first and second coil parts, wherein the first and second coil parts are disposed in a thickness direction of the body and are separated from each other by a gap layer disposed therebetween.

Abstract: A composite electronic component includes: a composite body having a capacitor and an inductor coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes disposed to oppose each other with each of the dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part; an input terminal disposed on a first side surface of the composite body; an output terminal including a first output terminal disposed on a second side surface of the composite body and a second output terminal disposed on the second side surface of the composite body; and a ground terminal disposed on the first side surface of the composite body.

Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part. An input terminal is disposed on a first side surface of the composite body and is connected to the coil part. An output terminal includes a first output terminal disposed on the first side surface of the composite body and connected to the coil part and a second output terminal disposed on a first end surface of the composite body and connected to the first internal electrodes. A ground terminal is disposed on a second end surface of the composite body and is connected to the second internal electrodes. The capacitor is coupled to a side surface of the inductor.

Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part. An input terminal is disposed on a first side surface of the composite body and is connected to the coil part. An output terminal includes a first output terminal disposed on the first side surface of the composite body and connected to the coil part and a second output terminal disposed on a first end surface of the composite body and connected to the first internal electrodes. A ground terminal is disposed on a second end surface of the composite body and is connected to the second internal electrodes. The capacitor is coupled to a side surface of the inductor.

Abstract: A composite electronic component may include a composite body including a capacitor and an inductor coupled to each other; an input terminal formed on a first end surface of the composite body and connected to the coil part of the inductor; an output terminal including a first output terminal formed on a second end surface of the composite body and connected to the coil part of the inductor and a second output terminal formed on the second end surface of the composite body and connected to the first internal electrode of the capacitor; and a ground terminal formed on a first end surface of the capacitor in the composite body. The capacitor may be coupled to a side surface of the inductor, and the sum of ratio of lengths of a short axis to a long axis of the coil part is 0.7 to 1.0.

Abstract: A multilayer electronic component may include a multilayer body including a plurality of magnetic material layers, and an internal electrode disposed in the multilayer body. The internal electrode may contain a conductive metal and glass, and the glass contains a vanadium (V) oxide. Also, a conductive paste composition for an internal electrode includes a conductive metal and glass, wherein the glass contains a vanadium (V) oxide.

Abstract: Disclosed herein is a multilayer coil component, in which a copper-nickel mixture is used for an internal electrode, to form a nickel and ferrite mixed region at an interface between the internal electrode layer and a ceramic layer, thereby interrupting contact between the ceramic layer and the internal electrode, so that insulation resistance, which may be generated between the two materials can be increased and thus the deterioration in the characteristics of the multilayer coil component can be prevented.

Abstract: Disclosed herein are a ferrite composition for a high frequency bead in that a part of Fe in M-type hexagonal ferrite represented by BaFe12O19 is substituted with at least one metal selected from a group consisting of 2-valence, 3-valence and 4-valence metals, as well as a chip bead material using the same. According to embodiments of the present invention, the dielectric composition is characterized in that a part of Fe as a constituent of M-type hexagonal barium ferrite is substituted by other metals, to thus decrease a sintering temperature to 920° C. or less without using any additive for low temperature sintering. Moreover, because of high SRF properties, the inventive composition is applicable to a multilayer type chip bead used at a high frequency of more than several hundreds MHz and a magnetic antenna.

Abstract: A composite electronic component may include: a composite body having a capacitor and an inductor coupled to each other therein; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on a lower surface of the capacitor of the composite body; and a ground terminal disposed on the lower surface of the capacitor of the composite body. The capacitor may be coupled to a side surface of the inductor.

Abstract: A multilayer electronic component, a manufacturing method thereof, and a board having the same. The multilayer electronic component includes a plurality of magnetic metal layers, an internal conductive layer formed on the magnetic metal layer, an upper and lower cover layers formed on and below an active part including the plurality of magnetic metal layers and internal conductive layer. The multilayer electronic component may have excellent DC bias characteristics by using a magnetic metal material, implement low direction resistance (Rdc) by increasing a cross-sectional area of an internal coil, and secure high magnetic permeability while decreasing a core loss of the magnetic metal material to thereby improve efficiency characteristic.

Abstract: Disclosed herein are a multilayer power inductor and a method of manufacturing the same. The multilayer power inductor includes a multilayer body formed by multi-layering a plurality of body sheets; a coil portion including internal electrode patterns that are respectively formed on the plurality of body sheets; and external electrodes that are disposed on lateral surfaces of the multilayer body and are electrically connected to both ends of the coil portion, wherein a space portion is formed in the internal electrode pattern to correspond to contraction of the plurality of body sheet. The multilayer power inductor relieves internal stress generated in a product through the space portion so as to prevent the body sheet from being magnetized due to the internal stress, thereby preventing a reduction in inductance. The multilayer inductor may also be manufactured by using conventional manufacturing processes themselves without any influence on the productivity of a product.

Abstract: A composite electronic component may include: a composite body including a capacitor formed of a ceramic body in which a plurality of dielectric layers and first and second internal electrodes are laminated, and an inductor formed of a magnetic body including a coil; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on the second end surface of the composite body; and a ground terminal disposed on one or more of upper and lower surfaces and the first end surface of the capacitor of the composite body. The capacitor is adjacent to the inductor.

Abstract: An inductor is provided including a multilayer body in which a plurality of magnetic layers containing a ferrite are laminated. A coil part including a plurality of conductive patterns is disposed in the multilayer body. External electrodes are electrically connected to the coil part. The ferrite may contain iron (Fe), manganese (Mn), nickel (Ni), zinc (Zn), and vanadium (V), and the ferrite may contain 40 to 55 mol % of iron (Fe) calculated as iron oxide (Fe2O3), 5 to 20 mol % of nickel (Ni) calculated as nickel oxide (NiO), 15 to 25 mol % of zinc (Zn) calculated as zinc oxide (ZnO), 15 to 30 mol % of manganese (Mn) calculated as manganese oxide (MnO), and 1 to 4 mol % of vanadium (V) calculated as vanadium oxide (V2O5).

Abstract: Disclosed herein are a multilayer type inductor including a magnetic layer composition including NiZn ferrite, a multilayer type coil component including a magnetic layer prepared therefrom, and a method for manufacturing the same. According to the present invention, a copper electrode can be used as an internal electrode of a multilayer type coil product, by including NiZn ferrite in the magnetic layer. As copper is used for the internal electrode, material costs can be significantly reduced. Furthermore, the present invention can improve the maximum saturation magnetization value against the NiCuZn ferrite by about 10%, due to exclusion of Cu having weak magnetism, and can be more desirably used in a product employing high current.

Abstract: The present invention relates to a coil element including a ceramic body and an internal electrode coil pattern formed on the ceramic body, wherein the ceramic body includes NiZnMn ferrite and the internal electrode coil pattern uses copper, and a method for manufacturing the same. The NiZnMn ferrite in accordance with the present invention can greatly increase a sintering process window and implement characteristics of a material through a single sintering process by suppressing conductivity due to generation of deposits inside the NiZn ferrite material in a thin oxygen atmosphere through addition of Mn to the conventional NiZn ferrite composition to increase a resistivity of the material.

Abstract: Disclosed herein is a multilayer coil component including a copper-nickel mixture for an internal electrode, in which a nickel content in the internal electrode is adjusted to thereby optimize the area ratio of nickel to copper while the copper-nickel mixture is used for a material for the internal electrode of the multilayer coil component, thereby preventing deterioration in characteristics of the multilayer coil component, so that ferrite characteristics of the multilayer coil component, such as, impedance (Z), inductance (L), and the like, can be improved.

Abstract: Disclosed herein is a multilayer coil component, in which a copper-nickel mixture is used for an internal electrode, to form a nickel and ferrite mixed region at an interface between the internal electrode layer and a ceramic layer, thereby interrupting contact between the ceramic layer and the internal electrode, so that insulation resistance, which may be generated between the two materials can be increased and thus the deterioration in the characteristics of the multilayer coil component can be prevented.

Abstract: There is provided a multi-layered chip electronic component, including: a multi-layered body including a plurality of first magnetic layers on which conductive patterns are formed; and second magnetic layers interposed between the first magnetic layers within the multi-layered body, wherein the conductive patterns are electrically connected to form coil patterns in a stacking direction, and when a thickness of the second magnetic layer is defined as Ts and a thickness of the conductive pattern is defined as Te, 0.1?Ts:Te?0.3 is satisfied.

Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body formed by stacking a plurality of magnetic layers; and conductive patterns disposed between the plurality of magnetic layers and electrically connected in a lamination direction to form coil patterns, wherein in a case in which a single coil pattern in the coil pattern is projected in the length and width directions of the multi-layered body, when an area of the magnetic layer inside of the coil pattern is defined as Ai and an area of the magnetic layer outside of the coil pattern is defined as Ao, 0.40?Ai:Ao?1.03 is satisfied.

Abstract: There is provided a multi-layered chip electronic component, including: a multi-layered body including a plurality of first magnetic layers on which conductive patterns are formed; and second magnetic layers interposed between the first magnetic layers within the multi-layered body, wherein the conductive patterns are electrically connected to form coil patterns in a stacking direction, and when a thickness of the second magnetic layer is defined as Ts and a thickness of the conductive pattern is defined as Te, 0.1?Ts:Te?0.3 is satisfied.