Patents by Inventor Soon-In Cho

Soon-In Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120168871
    Abstract: In a semiconductor device and a method of making the same, the semiconductor device comprises a substrate including a first region and a second region. At least one first gate structure is on the substrate in the first region, the at least one first gate structure including a first gate insulating layer and a first gate electrode layer on the first gate insulating layer. At least one isolating structure is in the substrate in the second region, a top surface of the isolating structure being lower in height than a top surface of the substrate. At least one resistor pattern is on the at least one isolating structure.
    Type: Application
    Filed: March 6, 2012
    Publication date: July 5, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jinhyun Shin, Minchul Kim, Seong Soon Cho, Seungwook Choi
  • Patent number: 8154104
    Abstract: In a semiconductor device and a method of making the same, the semiconductor device comprises a substrate including a first region and a second region. At least one first gate structure is on the substrate in the first region, the at least one first gate structure including a first gate insulating layer and a first gate electrode layer on the first gate insulating layer. At least one isolating structure is in the substrate in the second region, a top surface of the isolating structure being lower in height than a top surface of the substrate. At least one resistor pattern is on the at least one isolating structure.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: April 10, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jinhyun Shin, Minchul Kim, Seong Soon Cho, Seungwook Choi
  • Publication number: 20120074540
    Abstract: A structure of a semiconductor chip package is provided. The semiconductor chip package includes: a substrate; a semiconductor chip mounted on a first surface of the substrate; a plurality of electrode pads on a second surface, different from the first surface, of the substrate; and an electrostatic discharge protection pad overlapping a portion of a first electrode pad and a portion of a second electrode pad among the plurality of electrode pads.
    Type: Application
    Filed: July 13, 2011
    Publication date: March 29, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyong-Soon CHO, Chang-Su KIM, Kwan-Jai LEE, Kyoung-Sei CHOI, Jae-Hyok KO, Keung-Beum Kim
  • Publication number: 20120069915
    Abstract: Provided is a rate matching apparatus. The rate matching apparatus includes interleavers, dummy bit removers, a bit collector, a memory and a selector. The interleavers interleave code blocks, respectively. The dummy bit removers remove dummy bits of the interleaved code blocks, respectively. The bit collector collects code blocks with the dummy bits removed by bit units, and divides a collected data bit stream into systematic data and parity data. The memory stores the systematic data and the parity data in parallel. The selector outputs in parallel a plurality of data bits which are selected from the systematic data and parity data of the memory.
    Type: Application
    Filed: February 3, 2011
    Publication date: March 22, 2012
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Dae Soon CHO, EunTae KIM, Hee Sang CHUNG, JungSook BAE, Daeho KIM
  • Publication number: 20120066283
    Abstract: Provided are a divider having a small area and an improved operation speed and a method of operating the same. The divider includes a memory, a controller, and a multiplier. The memory is configured to store table values included in a predetermined range. The controller is configured to receive a divisor, generate an address expressed in a plurality of bits according to the bits except the most significant bit of the divisor, and receive the table value corresponding to the address from the memory. The multiplier is configured to receive a dividend and calculate an initial value by multiplying the dividend and the table value corresponding to the address. Herein, the controller determines an exponent of the divisor and right-shifts the initial value by the exponent of the divisor.
    Type: Application
    Filed: August 31, 2011
    Publication date: March 15, 2012
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Dae Soon CHO, Daeho KIM
  • Patent number: 8135133
    Abstract: According to an embodiment, the invention provides a method for decrypting content, the comprising: receiving the content without a source encryption key from a source device connected to the electric reproducing device, the content having been encrypted with the source encryption key in the source device; performing a first addition operation by using a first device internal key and an ID, the first device internal key being associated with the electric reproducing device; generating a device encryption key based on an output of the first addition operation and a second device internal key by using a predetermined encryption algorithm, wherein the second device internal key is associated with the electric reproducing device; decrypting the content using the device encryption key; decoding the decrypted content; and outputting the decoded content.
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: March 13, 2012
    Assignee: LG Electronics Inc.
    Inventors: Young-Soon Cho, Myeong-Joon Kang, Jae-Young Kim, Han Jung
  • Publication number: 20120045901
    Abstract: In a method of forming a pattern structure, a cut-off portion of the node-separated line of a semiconductor device is formed by a double patterning process by using a connection portion of the sacrificial mask pattern and the mask pattern to thereby improve alignment margin. The alignment margin between the mask pattern and the sacrificial mask pattern is increased to an amount of the length of the connection portion of the sacrificial mask pattern. The lines adjacent to the node-separated line include a protrusion portion protruding toward the cut-off portion of the separated line.
    Type: Application
    Filed: August 18, 2011
    Publication date: February 23, 2012
    Inventors: JONG-HYUK KIM, Keon-Soo Kim, Kwang-Shik Shin, Hyun-Chul Back, Seong-Soon Cho, Young-Bae Yoon, Jung-Hwan Park
  • Patent number: 8100215
    Abstract: Embodiments of the present invention may provide a module for detecting a vehicle crash. The module includes a housing mounted to a vehicular frame member at one end portion thereof. The module includes first and second rods housed in the housing. The first rod is contacted to the frame member at one end thereof through the one end portion of the housing. The second rod is contacted to the opposite end of the first rod and being disposed between the first rod and the opposite end portion of the housing. The module includes first and second sensors mounted to the first and second rods respectively for detecting a crash by sequentially measuring stress wave caused by the crash. The first sensor detects a stress wave propagating through the first rod and outputting a signal. The second sensor detects a stress wave propagating through the second rod and outputting a signal.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: January 24, 2012
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Hoon Huh, Sang Soon Cho
  • Patent number: 8042593
    Abstract: A semiconductor chip bonding apparatus maintains a semiconductor chip in a parallel state with respect to a lead frame when applying a bonding load.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: October 25, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheal-Sang Yoon, Yong-Dae Ha, Jae-Ryoung Lee, Jeong-Soon Cho, Bum-Woo Lee, Pil-June Kim
  • Publication number: 20110210433
    Abstract: A semiconductor chip for a tape automated bonding (TAB) package is disclosed. The semiconductor chip comprises a connection surface including a set of input pads connected to internal circuitry of the chip and for conveying external signals to the internal circuitry, the set of input pads comprising all of the input pads on the chip. The connection surface includes a set of output pads connected to internal circuitry of the chip and for conveying internal chip signals to outside the chip, the set of output pads comprising all of the output pads on the chip. The connection surface includes a first edge and a second edge that are substantially parallel to each other and are opposite each other on a respective first side and second side of the chip, and a third edge and fourth edge that are substantially perpendicular to the first and second edges, and are opposite each other on a respective third side and fourth side of the chip.
    Type: Application
    Filed: February 25, 2011
    Publication date: September 1, 2011
    Inventors: Young-Sang Cho, Chang-Sig Kang, Dae-Woo Son, Yun-Seok Choi, Kyong-Soon Cho, Sang-Heul Lee
  • Patent number: 7978077
    Abstract: A radio frequency identification reader and a radio frequency identification tag that use an ultrahigh frequency band, and action methods of the radio frequency identification reader and the radio frequency identification tag. The radio frequency identification reader includes: a data generator generating data to be transmitted to a radio frequency identification tag; if a command to control the radio frequency identification tag has to be authenticated, a reader controller controlling the data generator to generate the data including an authentication code; and a reader transmitter transmitting the data to the radio frequency identification tag. As a result, securing of communications of a specific command between the radio frequency identification reader and the radio frequency identification tag can be reinforced.
    Type: Grant
    Filed: February 23, 2006
    Date of Patent: July 12, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-hyun Lee, Ja-nam Ku, Young-hoon Min, Il-jong Song, Sung-oh Kim, Kyeong-soon Cho
  • Patent number: 7970021
    Abstract: Provided are a method and apparatus for derate matching a rate-matched data. The received data is deinterleaved and derate matched at a time, without using input buffers or constructing input buffers in parallel. Thus, a total process time necessary for the deinterleaving process and the derate matching process is reduced, and the use of memories such as the input buffers is minimized.
    Type: Grant
    Filed: August 20, 2009
    Date of Patent: June 28, 2011
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Eun Tae Kim, Dae Soon Cho, Hee Sang Chung, Hyeong Jun Park
  • Publication number: 20110143625
    Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.
    Type: Application
    Filed: February 23, 2011
    Publication date: June 16, 2011
    Inventors: Kyoung-sei Choi, Byung-seo Kim, Young-jae Joo, Ye-chung Chung, Kyong-soon Cho, Sang-heui Lee, Si-hoon Lee, Sa-yoon Kang, Dae-woo Son, Sang-gui Jo, Jeong-kyu Ha, Young-sang Cho
  • Patent number: 7915727
    Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.
    Type: Grant
    Filed: April 17, 2009
    Date of Patent: March 29, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyoung-sei Choi, Byung-seo Kim, Young-jae Joo, Ye-chung Chung, Kyong-soon Cho, Sang-heui Lee, Si-hoon Lee, Sa-yoon Kang, Dae-woo Son, Sang-gui Jo, Jeong-kyu Ha, Young-sang Cho
  • Publication number: 20100278277
    Abstract: Provided is a decoding apparatus and method using orthogonal space-time block codes (OSTBCs) robust against timing errors. The decoding apparatus may include: a cyclic prefix removal unit to receive a signal, and to remove a cyclic prefix in the signal; an inverse discrete Fourier transform (IDFT) unit to apply an IDFT to the signal with the removed cyclic prefix; a guard band removal unit to remove a guard band in the inverse discrete Fourier transformed signal, and to generate a complex matrix; a channel estimation unit to transmit a carrier corresponding to the complex matrix and channel status information associated with transmit and receive antennas; and a decoder to calculate a channel status vector with respect to a complex symbol included in the complex matrix, using the channel status information, and to calculate an inner product between the channel status vector and the complex matrix, to restore the complex symbol.
    Type: Application
    Filed: August 25, 2009
    Publication date: November 4, 2010
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Gi Yoon PARK, Ok-Sun PARK, Dae Soon CHO, Hyeong Jun PARK
  • Publication number: 20100262838
    Abstract: According to an embodiment, the invention provides a method for decrypting content, the comprising: receiving the content without a source encryption key from a source device connected to the electric reproducing device, the content having been encrypted with the source encryption key in the source device; performing a first addition operation by using a first device internal key and an ID, the first device internal key being associated with the electric reproducing device; generating a device encryption key based on an output of the first addition operation and a second device internal key by using a predetermined encryption algorithm, wherein the second device internal key is associated with the electric reproducing device; decrypting the content using the device encryption key; decoding the decrypted content; and outputting the decoded content.
    Type: Application
    Filed: June 24, 2010
    Publication date: October 14, 2010
    Inventors: Young-Soon CHO, Myeong-Joon Kang, Jae-Young Kim, Han Jung
  • Patent number: 7792022
    Abstract: A de-rate matching device in a communication system divides received data into a plurality of blocks, and simultaneously de-rate-matches data in the respective blocks.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: September 7, 2010
    Assignees: Electronics and Telecommunications Research Institute, Samsung Electronics and Co., Ltd.
    Inventors: Dae-Soon Cho, Tae-Joong Kim, Young-Sup Kim, Hyeong-Jun Park
  • Patent number: 7769174
    Abstract: The invention is directed to a digital data delivery system including a digital data server configured to deliver first key encrypted digital data to a source device, and the first key encrypted digital data is encrypted using a first key. The source device is configured to generate decrypted digital data by decrypting the first key encrypted digital data using the first key, generate second key encrypted digital data by encrypting the decrypted digital data using a second key, and deliver the second key encrypted digital data to a digital data playing device. The first key is thereby based on one or more registration attributes of a user of the digital data server, and the second key is based on one or more attributes of the digital data playing device.
    Type: Grant
    Filed: November 7, 2007
    Date of Patent: August 3, 2010
    Assignee: LG Electronics Inc.
    Inventors: Young-Soon Cho, Myeong-Joon Kang, Jae-Young Kim, Han Jung
  • Publication number: 20100169045
    Abstract: Disclosed herein is a measurement apparatus for improving performances of standard cells in a standard cell library when verifying performance of the standard cell library through a ring oscillator among various test element groups (TEGs). The measurement apparatus includes a ring oscillator block activated in response to an enable signal externally inputted thereto for outputting measurement result values, a decoder for selectively outputting one or more of the measurement result values from the ring oscillator block, and a statistics assistor for receiving output values from the decoder for a predetermined period and outputting a maximum value, a minimum value and an average value of the received values.
    Type: Application
    Filed: December 21, 2009
    Publication date: July 1, 2010
    Inventors: Woo-Chol Shin, Seong-Heon Kim, Kyeong-Soon Cho
  • Patent number: 7746183
    Abstract: Disclosed herein is a measurement apparatus for improving performances of standard cells in a standard cell library when verifying performance of the standard cell library through a ring oscillator among various test element groups (TEGs). A built-in circuit is used to measure and verify performance of the standard cell library through a TEG. Therefore, it is possible to effectively improve performances of the standard cells in the standard cell library. Particularly, it is possible to not only remove human errors or internal errors of equipment, but also perform the measurement more readily, rapidly and accurately. Further, it is possible to curtail the use of high-performance equipment or manpower and time required in a measurement process.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: June 29, 2010
    Assignee: Dongbu HiTek Co., Ltd.
    Inventors: Seong-Heon Kim, Woo Chol Shin, Kyeong Soon Cho