Abstract: A semiconductor structure and a method for forming a semiconductor structure are provided. The method includes receiving a semiconductor substrate having a first region and a second region; forming a dielectric layer over the semiconductor substrate; removing portions of the dielectric layer to form a dielectric structure in the first region, wherein the dielectric structure includes a base structure and a plurality of first isolation structures over the base structure; forming a semiconductor layer covering the first region and the second region; removing a portion of the semiconductor layer to expose a top surface of the plurality of first isolation structures; and forming a plurality of second isolation structures in the second region.

Abstract: An optical connector plug for outdoor waterproof onsite assembly. A frame having slits sheathes and is fixed to an optical cable when the optical cable is constructed on a site. The optical connector plug is waterproofed by a protective tube and an O-ring. The optical cable has a tip at one side which is attached to an assembly in a sealing or mechanical manner, and the frame sheathing an outer side of the optical cable has one side end to which an outer peripheral edge of the assembly is coupled, has the one or more slits which are cut from a middle to the other side end and are formed to be widened and narrowed in compliance with an outer diameter of the optical cable, and has a step on an outer peripheral edge at one side end to be held by an inner peripheral edge of a housing.

Abstract: A method of manufacturing a semiconductor device having metal gates and the semiconductor device are disclosed. The method comprises providing a first sacrificial gate associated with a first conductive type transistor and a second sacrificial gate associated with a second conductive type transistor disposed over the substrate, wherein the first conductive type and the second conductive type are complementary; replacing the first sacrificial gate with a first metal gate structure; forming a patterned dielectric layer and/or a patterned photoresist layer to cover the first metal gate structure; and replacing the second sacrificial gate with a second metal gate structure. The method can improve gate height uniformity during twice metal gate chemical mechanical polish processes.

Abstract: A method of using a polishing system includes securing a wafer to a support, wherein the wafer has a first diameter. The method further includes polishing the wafer using a first polishing pad rotating about a first axis, wherein the first polishing pad has a second diameter greater than the first diameter. The method further includes rotating the support about a second axis perpendicular to the first axis after polishing the wafer using the first polishing pad. The method further includes polishing the wafer using a second polishing pad after rotating the support, wherein the second polishing pad has a third diameter less than the first diameter. The method further includes releasing the wafer from the support following polishing the wafer using the second polishing pad.

Abstract: Disclosed are oxadiazole compounds and pharmaceutically acceptable salts thereof. The compounds and pharmaceutically acceptable salts thereof are specifically suitable for the treatment of neurological diseases such as epilepsy.

Abstract: According to an embodiment, there is provided a polymer electrolyte membrane, comprising a polymer film including a styrene-based resin, a polyolefin-based resin, and an olefin-based elastomer resin. The polymer film is bonded with a sulfonic acid group (—SO3H) capable of cation exchange through a sulfonation reaction.

Abstract: According to an embodiment, a method for preparing an amorphous polypropylene copolymer comprises injecting a volume of hexane into a nitrogen-purged reactor, the volume of the hexane corresponding to 20% to 80% of a volume of the reactor, injecting, into the reactor, and mixing an amount of alkyl cocatalyst, the amount of the alkyl cocatalyst corresponding to 1 to 50 times a weight of a primary catalyst, injecting the primary catalyst into the reactor, stirring, and then injecting a molecular weight regulator; and injecting propylene and a monomer for copolymerization into the reactor at a temperature ranging from 40° C. to 90° C.

Abstract: Disclosed are oxadiazole compounds and pharmaceutically acceptable salts thereof. The compounds and pharmaceutically acceptable salts thereof are specifically suitable for the treatment of neurological diseases such as epilepsy.

Abstract: Disclosed are oxadiazole compounds and pharmaceutically acceptable salts thereof. The compounds and pharmaceutically acceptable salts thereof are specifically suitable for the treatment of neurological diseases such as epilepsy.

Abstract: The present disclosure provides a compound represented by Formula (I) and a pharmaceutically acceptable salt which are effective as a dopamine reuptake inhibitor and a method of using the compound: wherein X is independently halo, alkyl, alkoxy or nitro; m is 0, 1, 2, 3 or 4; n is 1 or 2; R1 and R2 are independently H— or alkyl; R3 is H—, alkyl or aralkyl; and R4 is H— or aryl.

Abstract: The present disclosure provides a compound represented by Formula (I) and a pharmaceutically acceptable salt which are effective as a dopamine reuptake inhibitor and a method of using the compound: wherein X is independently halo, alkyl, alkoxy or nitro; m is 0, 1, 2, 3 or 4; n is 1 or 2; R1 and R2 are independently H— or alkyl; R3 is H—, alkyl or aralkyl; and R4 is H— or aryl.

Abstract: The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a polishing head that is operable to perform a polishing process to a wafer. The apparatus includes a retaining ring that is rotatably coupled to the polishing head. The retaining ring is operable to secure the wafer to be polished. The apparatus includes a soft material component located within the retaining ring. The soft material component is softer than silicon. The soft material component is operable to grind a bevel region of the wafer during the polishing process. The apparatus includes a spray nozzle that is rotatably coupled to the polishing head. The spray nozzle is operable to dispense a cleaning solution to the bevel region of the wafer during the polishing process.

Abstract: A method of planarizing a wafer includes pressing the wafer against a planarization pad. The method further includes moving the planarization pad relative to the wafer. The method further includes conditioning the planarization pad using a pad conditioner. Conditioning the planarization pad includes moving the planarization pad relative to the pad conditioner. The pad conditioner includes abrasive particles having aligned tips a substantially constant distance from a surface of substrate of the pad conditioner.

Abstract: According to the present invention, there is provided a method for preparing low molecular weight amorphous polypropylene. In contrast to the prior art in which amorphous polypropylene is prepared by injecting an internal donor and an external donor upon preparing a primary catalyst, the present invention enables easier preparation of low molecular weight amorphous polypropylene and a copolymer thereof by simply mixing a primary catalyst with an alkylaluminum-based co-catalyst without injecting an internal donor, upon preparing a primary catalyst, and an external donor, upon polymerization. According to the present invention, the primary catalyst has superior reactivity with hydrogen, as chain transfer agent, allowing for preparation of low molecular weight amorphous polypropylene even under low hydrogen pressures and low-pressure driving conditions.

Abstract: The present disclosure relates to a bicycle locking apparatus having an abnormal locking prevention function. The bicycle locking apparatus includes a sensor unit which measures a driving condition of a bicycle to be locked by using a plurality of sensors and outputs sensing data about the driving condition, a locking operation unit which performs a locking operation or an unlocking operation on the bicycle to be locked in response to input of a lock signal or an unlock signal, and a control unit which controls the overall operation of the bicycle locking apparatus. The control unit includes a first driving state determination unit which determines a first state of the bicycle to be locked by using sensing data of a first sensor group, a second driving state determination unit which determines a second state of the bicycle to be locked by using sensing data of a second sensor group.

Abstract: The present disclosure provides a compound represented by Formula (I) and a pharmaceutically acceptable salt which are effective as a dopamine reuptake inhibitor and a method of using the compound: wherein X is independently halo, alkyl, alkoxy or nitro; m is 0, 1, 2, 3 or 4; n is 1 or 2; R1 and R2 are independently H— or alkyl; R3 is H—, alkyl or aralkyl; and R4 is H— or aryl.

Abstract: The present disclosure relates to a bicycle locking device and method, and includes a fastening part including an inner fastening member positioned on an inner surface of a bicycle hub, and an outer fastening member positioned on an outer surface of the hub and coupled to the inner fastening member; a driving part coupled to one side surface of the outer fastening part and including a motor and an outer case; and a locking part including a pin case, a pin positioned in the pin case, a pin case cover coupled to the upper end of the pin case, and a first spring coupled to the pin case cover and the pin to support the pin so that the pin is pitchable with respect to the pin case.

Abstract: A chemical-mechanical polishing system has a first polishing apparatus configured to perform a first chemical-mechanical polish on a workpiece and a second polishing apparatus configured to perform a second chemical-mechanical polish on the workpiece. A rework polishing apparatus comprising a rework platen and a rework CMP head is configured to perform an auxiliary chemical-mechanical polish on the workpiece when the workpiece is positioned on the rework platen. A measurement apparatus measures one or more parameters of the workpiece, and a transport apparatus transports the workpiece between the first polishing apparatus, second polishing apparatus, rework polishing apparatus, and measurement apparatus. A controller determines a selective transport of the workpiece to the rework polishing apparatus by the transport apparatus only when the one or more parameters are unsatisfactory.