Abstract: In one example embodiment, an end device includes a memory configured to store function information regarding at least one predefined function and tag information regarding at least one electronic tag that is associated with the at least one predefined function; a reader configured to read tag identification information received from a detected electronic tag located within a predetermined range of the end device; and a processor configured to select a predefined function from among the at least one predefined function based on the stored tag information and the read tag identification information and perform the selected predefined function.

Abstract: A semiconductor chip including a substrate, a first data pad arranged on the substrate, and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate.

Abstract: A manufacture includes a substrate, a reinforcement layer over the substrate, and abrasive particles over the substrate. The abrasive particles are partially buried in the reinforcement layer. Upper tips of the abrasive particles are substantially coplanar.

Abstract: A semiconductor package is provided. The semiconductor package includes a package substrate, a semiconductor chip, bonding wires, and a molding film. The package substrate includes a first surface having a recessed portion, a second surface opposed to the first surface, an opening extending from the recessed portion of the first surface to the second surface, and bonding pads provided on the first surface. The semiconductor chip is disposed on the second surface of the package substrate to cover the opening, and includes center pads exposed through the opening. Bonding wires electrically connect the center pads and the bonding pads through the opening. The molding film covers the bonding pads, the center pads, and the bonding wires. A depth of the recessed portion is greater than a distance between the recessed portion of the first surface and a lowermost surface of the molding film.

Abstract: In one example embodiment, an end device includes a sensor configured to sense a motion of the end device; a location detector configured to detect a location of the end device; a translator configured to translate parameters of the sensed motion into a service request stored in a memory of the end device; a transmitter configured to transmit, to a service provider, the service request and the location of the end device; and a receiver configured to receive, from the service provider, an expression of a service that is associated with an object located within a predetermined range of the end device.

Abstract: An apparatus and method for providing target thickness and surface profile uniformity control of a multi-head chemical mechanical polishing (CMP) process is disclosed. An exemplary method includes providing at least two wafers; determining a surface profile of each of the at least two wafers; determining an operation mode for a chemical mechanical polishing (CMP) process based on the surface profiles of the at least two wafers; determining a CMP polishing recipe for each of the at least two wafers based on the operation mode; and performing the CMP process on the at least two wafers based on the determined CMP polishing recipes.

Abstract: In a radio communication system of hierarchical cell structure in which macrocells provided by a macro base station and femto cells provided by a femto base station are overlapped on each other, a method and a system for handing over a terminal are provided. To be specific, if load of a serving base station increase or decreases more than a predetermined extent, a method and a system adaptively adjust the handover between macro base stations, between femto base station, or between femto base station and macro base station.

Abstract: A compound for an organic photoelectric device, an organic photoelectric device, and a display device including the same, the compound being represented by the following Chemical Formula 1:

Abstract: A printed circuit board (PCB) includes a base substrate including upper and lower surfaces, a plurality of solder ball pads separately formed on the lower surface of the base substrate in a radial direction and forming one or more radial pad groups, a plurality of first traces respectively connected to the plurality of solder ball pads and extending to an inside of the radial pad group, and a plurality of second traces respectively connected to the plurality of first traces and extending to an outside of the radial pad group.

Abstract: A method for applying a pressure-sensitive gel material during assembly of an array of pre-singulated packaged semiconductor devices. In the method, pressure-sensitive gel material is dispensed onto a first semiconductor device of the array, where the first semiconductor device is disposed within a first cavity. A first curing process is performed to partially cure the pressure-sensitive gel material in the first cavity. Pressure-sensitive gel material is then dispensed onto another semiconductor device of the array, where the other semiconductor device is disposed within another cavity. The first curing process is initiated before the dispensing of the pressure-sensitive gel material inside of the other cavity is completed and initially cures pressure-sensitive gel material for fewer than all of the pre-singulated packaged semiconductor devices of the array.

Abstract: An integrated circuit (IC) die has an active side and an inactive side, opposite the active side. A recess is formed within the interior of the inactive side and extends partially through the integrated circuit towards the active side. The IC die is part of a packaged IC device, where the die is attached to a package component such as a lead frame, substrate, or another die, using die attach adhesive that fills the recess, thereby providing a more reliable bond between the IC die and the package component.

Abstract: The present disclosure relates to a two-phase cleaning element that enhances polishing pad cleaning so as to prevent wafer scratches and contamination in chemical mechanical polishing (CMP) processes. In some embodiments, the two-phase pad cleaning element comprises a first cleaning element and a second cleaning element configured to successively operate upon a section of a CMP polishing pad. The first cleaning element comprises a megasonic cleaning jet configured to utilize cavitation energy to dislodge particles embedded in the CMP polishing pad without damaging the surface of the polishing pad. The second cleaning element is configured to apply a high pressure mist, comprising two fluids, to remove by-products from the CMP polishing pad. By using megasonic cleaning to dislodge embedded particles a two-fluid mist to flush away by-products (e.g., including the dislodged embedded particles), the two-phase pad cleaning element enhances polishing pad cleaning.

Abstract: A semiconductor device package is assembled using a jig that alters the shape of gel material disposed in a cavity in the package. In one embodiment, a jig having a concave bottom surface is inserted onto uncured gel material disposed within a cavity in a housing of the package to change a top surface of the gel from having a concave shape to a convex shape. The gel is then cured with the jig in place. When the jig is subsequently removed, the cured gel retains the convex shape, which helps to avoid any bond wires from being exposed. The re-shaped gel material reduces internal stresses during thermal cycling and can therefore reduce permanent damage to the package otherwise resulting from such thermal cycling.

Abstract: A compound for an organic photoelectric device, an organic photoelectric device including the same, and a display device including the organic photoelectric device, the compound being represented by the following Chemical Formula 1:

Abstract: The present disclosure provides a compound represented by Formula (I) and a pharmaceutically acceptable salt which are effective as a dopamine reuptake inhibitor and a method of using the compound: wherein X is independently halo, alkyl, alkoxy or nitro; m is 0, 1, 2, 3 or 4; n is 1 or 2; R1 and R2 are independently H— or alkyl; R3 is H—, alkyl or aralkyl; and R4 is H— or aryl.

Abstract: A package-on-package device includes memory chips side-by-side on a package substrate. Accordingly, it is possible to reduce a thickness of a semiconductor package. Further, data and command pads of a logic chip may be located to be adjacent to data and command pads of the memory chips. Accordingly, a routing distance between pads can be contracted and thus signal delivery speed can be improved. This makes it possible to improve an operation speed of the device.

Abstract: An apparatus and method for providing target thickness and surface profile uniformity control of a multi-head chemical mechanical polishing (CMP) process is disclosed. An exemplary method includes providing at least two wafers; determining a surface profile of each of the at least two wafers; determining an operation mode for a chemical mechanical polishing (CMP) process based on the surface profiles of the at least two wafers; determining a CMP polishing recipe for each of the at least two wafers based on the operation mode; and performing the CMP process on the at least two wafers based on the determined CMP polishing recipes.

Abstract: A method for applying a pressure-sensitive gel material during assembly of an array of pre-singulated packaged semiconductor devices. In the method, pressure-sensitive gel material is dispensed onto a first semiconductor device of the array, where the first semiconductor device is disposed within a first cavity. A first curing process is performed to partially cure the pressure-sensitive gel material in the first cavity. Pressure-sensitive gel material is then dispensed onto another semiconductor device of the array, where the other semiconductor device is disposed within another cavity. The first curing process is initiated before the dispensing of the pressure-sensitive gel material inside of the other cavity is completed and initially cures pressure-sensitive gel material for fewer than all of the pre-singulated packaged semiconductor devices of the array.

Abstract: A color interpolation apparatus includes a threshold value determining unit that calculates a luminance value of each area set based on each pixel of a Bayer pattern image and determines edge determining threshold values, an edge information calculating unit that calculates pixel value variations in multiple directions of the set areas by using pixel values of pixels included in each area and edge information regarding each area by using the multiple directional pixel value variations, an area determining unit that determines an edge type by using the edge determining threshold values and the edge information, and a color interpolation unit that applies a color interpolation filter previously set according to the edge type to a corresponding area according to the edge type. The area determining unit uses green information or interpolated green information of a central pixel depending on whether or not a color of the central pixel is green.

Abstract: A compound for an organic photoelectric device, the compound being represented by Chemical Formula 1 or 2: