Abstract: A polishing system for polishing a semiconductor wafer includes a wafer support for holding the semiconductor wafer, and a first polishing pad for polishing a region of the semiconductor wafer. The semiconductor wafer has a first diameter, and the first polishing pad has a second diameter shorter than the first diameter.

Abstract: The present invention relates to a power saving safety helmet capable of wireless communication, and a wireless transmission and reception method therefor, and the power saving safety helmet capable of wireless communication comprises: a voice input unit for receiving a voice input from a user; a sensor unit sensing whether an accident involving the user has occurred so as to generate an accident sensing signal; a wireless communication unit for intermittently transmitting and receiving, by using frequency channels different from each other, a voice signal and an emergency signal generated by the voice and the accident sensing signal or transmitted from the outside; a sound output unit for outputting a voice and a beep sound corresponding to the voice signal and the emergency signal transmitted from the outside; and a control unit for controlling the beep sound so as to be outputted at output time intervals which are set to be different according to the reception strength of the received emergency signal.

Abstract: In one example embodiment, a display apparatus includes a memory, implemented as part of the display apparatus and configured to store a plurality of reference motion information associated with a plurality of services and service information regarding the plurality of services; a reader, implemented as part of the display apparatus and configured to read motion information, received from a mobile end device, regarding a motion that was enacted upon the mobile end device; a service selector, implemented as part of the display apparatus and configured to compare the read motion information with the stored plurality of reference motion information to select a service from among the stored plurality of services; and a stationary display, implemented as part of the display apparatus that is physically separated from the mobile end device, configured to display an expression of the selected service.

Abstract: In one example embodiment, an apparatus includes a reader configured to read motion information, received from an end device, regarding a motion that was enacted by a user relative to the end device; a request generator configured to generate a service request that includes an identifier of the apparatus and the read motion information; a transmitter configured to transmit, to a service provider, the service request; and a receiver configured to receive, from the service provider, an expression of a service that is associated with the identifier of the apparatus and the read motion information.

Abstract: A compound for an organic optoelectronic device is represented by Chemical Formula 1: and, in Chemical Formula 1, one of Ar1 or Ar2 is a substituted or unsubstituted C6 to C30 aryl group, or a substituted or unsubstituted C3 to C30 heteroaryl group, and the other of Ar1 or Ar2 is a substituent represented by the Chemical Formula 2:

Abstract: A method and a system for providing a service are provided. In the method for providing the service, a user terminal receives customized information among individuals or group members. The method includes: obtaining tag information by reading a tag attached to an object, the tag information containing a tag code and service data; obtaining service access information from an Object Directory Service (ODS) server when the tag is tagged in a situation, the service access information corresponding to at least one of the obtained tag information and identification information; and receiving a customized information service corresponding to the user terminal by accessing a service providing server in accordance with the service access information.

Abstract: An apparatus, a method and a non-transitory computer-readable recording medium for detecting a moving object using a depth map is provided. The apparatus includes a segment image generator unit that generates a segment image to distinguish each object using a depth image of a current input frame; a background image generator unit that generates a current background image by applying a moving average method to the depth image and a background image of a previous input frame; and a moving mask generator unit that generates a moving mask by comparing the depth image with the current background image to thereby find moving parts in the depth image.

Abstract: The present disclosure provides a compound represented by Formula (I) and a pharmaceutically acceptable salt which are effective as a dopamine reuptake inhibitor and a method of using the compound: wherein X is independently halo, alkyl, alkoxy or nitro; m is 0, 1, 2, 3 or 4; n is 1 or 2; R1 and R2 are independently H— or alkyl; R3 is H—, alkyl or aralkyl; and R4 is H— or aryl.

Abstract: A semiconductor chip including a substrate, a first data pad arranged on the substrate, and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate.

Abstract: A stack semiconductor package includes a first semiconductor package having a first package substrate and a first semiconductor chip mounted on the first package substrate. The first semiconductor chip includes first chip pads arranged along a side portion thereof. The stack semiconductor package includes a second semiconductor package disposed on the first semiconductor package, and includes a second package substrate. A first sub-chip and a second sub-chip is mounted on the second semiconductor package and arranged side by side extending along a direction of a first side portion of the second package substrate. Each of the first and second sub-chips includes second chip pads arranged along a side portion thereof. Connection wiring paths between interface portions and connection pads may be reduced and simplified, thereby preventing connection wires from being tangled. Moreover, connection wiring paths between a logic chip and a memory chip may be minimized, thereby providing high speed performance.

Abstract: A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.

Abstract: A system, a mobile communication terminal, and a method for providing information. The system for providing information includes: a tag configured to store tag information; a mobile communication terminal configured to obtain the tag information using short-range communication and to calculate position information of the mobile communication terminal when the tag information is obtained; and an information providing server configured to receive the tag information and the position information from the mobile communication terminal, extract service address information which provides information for connecting to a service identified by the tag information and based on the position information, and provide the extracted service address information to the mobile communication terminal. The mobile communication terminal is connected to the service based on the service address information.

Abstract: The present disclosure provides a compound represented by Formula (I) and a pharmaceutically acceptable salt which are effective as a dopamine reuptake inhibitor and a method of using the compound: wherein X is independently halo, alkyl, alkoxy or nitro; m is 0, 1, 2, 3 or 4; n is 1 or 2; R1 and R2 are independently H— or alkyl; R3 is H—, alkyl or aralkyl; and R4 is H— or aryl.

Abstract: A system, a mobile communication terminal, and a method for transferring information. The system for transferring information includes a first terminal configured to extract and transmit transfer information and a second terminal configured to receive the transfer information. Here, the transfer information corresponds to an intersection state between the first terminal and the second terminal when the first terminal performs first short-range communication with the second terminal, and the first terminal and the second terminal compute their respective position information when the first short-range communication is performed, exchange the position information with each other, and calculate the intersection state information based on the respective position information of the first and second terminals.

Abstract: A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.

Abstract: A stack semiconductor package includes a first semiconductor package having a first package substrate and a first semiconductor chip mounted on the first package substrate. The first semiconductor chip includes first chip pads arranged along a side portion thereof. The stack semiconductor package includes a second semiconductor package disposed on the first semiconductor package, and includes a second package substrate. A first sub-chip and a second sub-chip is mounted on the second semiconductor package and arranged side by side extending along a direction of a first side portion of the second package substrate. Each of the first and second sub-chips includes second chip pads arranged along a side portion thereof. Connection wiring paths between interface portions and connection pads may be reduced and simplified, thereby preventing connection wires from being tangled. Moreover, connection wiring paths between a logic chip and a memory chip may be minimized, thereby providing high speed performance.

Abstract: The present disclosure provides a method of fabricating a semiconductor device, a semiconductor device fabricated by such a method, and a chemical mechanical polishing (CMP) tool for performing such a method. In one embodiment, a method of fabricating a semiconductor device includes providing an integrated circuit (IC) wafer including a metal conductor in a trench of a dielectric layer over a substrate, and performing a chemical mechanical polishing (CMP) process to planarize the metal conductor and the dielectric layer. The method further includes cleaning the planarized metal conductor and dielectric layer to remove residue from the CMP process, rinsing the cleaned metal conductor and dielectric layer with an alcohol, and drying the rinsed metal conductor and dielectric layer in an inert gas environment.

Abstract: A printed circuit board (PCB) includes a base substrate including upper and lower surfaces, a plurality of solder ball pads separately formed on the lower surface of the base substrate in a radial direction and forming one or more radial pad groups, a plurality of first traces respectively connected to the plurality of solder ball pads and extending to an inside of the radial pad group, and a plurality of second traces respectively connected to the plurality of first traces and extending to an outside of the radial pad group.

Abstract: Provided are semiconductor memory chips and semiconductor packages with the same. The semiconductor package may include a memory chip including first data pads and first command/address pads arranged adjacent to a first side region thereof and second data pads and second command/address pads arranged adjacent to a second side region thereof arranged opposite to the first side region, and a package substrate including first CA connection pads and second CA connection pads. The memory chip may be mounted on a top surface of the package substrate, the first CA connection pads may be connected to the first command/address pads, and the second CA connection pads may be provide to be opposite to the first CA connection pads and be connected to the second command/address pads.

Abstract: A method of planarizing a wafer includes pressing the wafer against a planarization pad. The method further includes moving the planarization pad relative to the wafer. The method further includes conditioning the planarization pad using a pad conditioner. Conditioning the planarization pad includes moving the planarization pad relative to the pad conditioner. The pad conditioner includes abrasive particles having aligned tips a substantially constant distance from a surface of substrate of the pad conditioner.