Abstract: A phase change memory using an ovonic threshold switch selection device may be programmed from one state to another by first turning on the ovonic threshold switch. After the voltage across the cell has fallen, the cell may then be biased to program the cell to the desired state.

Abstract: Embodiments disclosed herein may relate to controlling a discharge of a capacitive element coupled to a phase change memory cell to produce a specified state in the phase change memory cell.

Abstract: Embodiments disclosed herein may relate to controlling a discharge of a capacitive element coupled to a phase change memory cell to produce a specified state in the phase change memory cell.

Abstract: A memory cell exhibiting threshold switch behavior, such as a phase change memory, can be programmed in a way that eliminates the need for a separate post-programming verification cycle. In particular, a circuit can be used to apply the programming pulse to a cell in a way that determines whether the cell has reached the desired threshold voltage. If the cell has not reached the desired threshold voltage, it receives another programming pulse. If it has, it does not receive another programming pulse. Thus, by applying a voltage across the cell that never exceeds the threshold voltage of the cell, the need for a separate verification cycle can be eliminated in some embodiments.

Abstract: An apparatus and a method for refreshing or toggling a phase-change memory cell are described. The apparatus includes a voltage ramp element coupled to the phase-change memory cell and provided for controlling voltage across the phase-change memory cell. A current control element is coupled to the phase-change memory cell and provided for controlling current through the phase-change memory cell. A current sensor element is coupled to the phase-change memory cell. A write-back timer and control element is coupled to the current sensor element and to the current control element.

Abstract: A phase change memory using an ovonic threshold switch selection device may be programmed from one state to another by first turning on the ovonic threshold switch. After the voltage across the cell has fallen, the cell may then be biased to program the cell to the desired state.

Abstract: Using the voltage across a threshold switching cell to sense the state of the cell, rather than sensing current through the cell, may result in a faster read. In some embodiments, current consumption during reading of conductive states may be reduced by using a capacitor coupled across the cell.

Abstract: A memory cell exhibiting threshold switch behavior, such as a phase change memory, can be programmed in a way that eliminates the need for a separate post-programming verification cycle. In particular, a circuit can be used to apply the programming pulse to a cell in a way that determines whether the cell has reached the desired threshold voltage. If the cell has not reached the desired threshold voltage, it receives another programming pulse. If it has, it does not receive another programming pulse. Thus, by applying a voltage across the cell that never exceeds the threshold voltage of the cell, the need for a separate verification cycle can be eliminated in some embodiments.

Abstract: Using the voltage across a threshold switching cell to sense the state of the cell, rather than sensing current through the cell, may result in a faster read. In some embodiments, current consumption during reading of conductive states may be reduced by using a capacitor coupled across the cell.

Abstract: A system may include acquisition of a supply voltage information representing past supply voltages supplied to an electrical component, acquisition of a temperature information representing past temperatures of the electrical component, and control of a performance characteristic of the electrical component based on the supply voltage information and the temperature information. Some embodiments may further include determination of a reliability margin based on the supply voltage information, the temperature information, and on a reliability specification of the electrical component, and change of the performance characteristic based on the reliability margin.

Abstract: According to embodiments of the present invention, a one-time programmable (OTP) cell includes an access transistor coupled to an antifuse transistor. In on embodiment, access transistor has a gate oxide thickness that is greater than the gate oxide thickness of the antifuse transistor so that if the antifuse transistor is programmed, the voltage felt across the gate/drain junction of the access transistor is insufficient to cause the gate oxide of the access transistor to break down. The dual gate oxide OTP cell may be used in an array in which only one OTP cell is programmed at a time. The dual gate oxide OTP cell also may be used in an array in which several OTP cells are programmed simultaneously.

Abstract: A level shifting device comprises an input stage, a cascode stage, a cross-coupled stage, and an output stage. The input stage may receive a data signal or binary logic input in a first data range, a complement of the data signal, and a first voltage. The cascode stage may receive a first voltage and may be connected to the input stage. The cross-coupled stage may be adapted to isolate the first voltage and may be connected to the cascode stage. The output stage may receive a second voltage, provide an output, and be connected to the cross-coupled stage. The cascode stage may be adapted to provide the first voltage as the output when the logic input is a first value and provide the second voltage as the output when the logic input is a second value. Other embodiments are also claimed and described.

Abstract: A manufacturing process modification is disclosed for producing a metal-insulator-metal (MIM) capacitor. The MIM capacitor may be used in memory cells, such as DRAMs, and may also be integrated into logic processing, such as for microprocessors. The processing used to generate the MIM capacitor is adaptable to current logic processing techniques. Other embodiments are described and claimed.

Abstract: A method of programming a memory array is provided, including accessing a plurality of word lines of the memory array by providing a plurality of voltage steps sequentially after one another to the respective word lines, and accessing a plurality of bit lines of the memory array each time that a respective word line is accessed, to program a plurality of devices corresponding to individual word and bit lines that are simultaneously accessed, each device being programmed by breaking a dielectric layer of the device, accessing of the bit lines being sequenced such that only a single one of the devices is programmed at a time.

Abstract: In general, in one aspect, the disclosure describes a memory array including a plurality of memory cells arranged in rows and columns. Each memory cell includes a transistor having a floating body capable of storing a charge. A plurality of word lines and purge lines are interconnected to rows of memory cells. A plurality of bit lines are interconnected to columns of memory cells. Driving signals provided via the word lines, the purge lines, and the bit lines can cooperate to alter the charge of the floating body region in one or more of the memory cells.

Abstract: A floating-body dynamic random access memory device may include a semiconductor body having a top surface and laterally opposite sidewalls formed on a substrate. A gate dielectric layer may be formed on the top surface of the semiconductor body and on the laterally opposite sidewalls of the semiconductor body. A gate electrode may be formed on the gate dielectric on the top surface of the semiconductor body and adjacent to the gate dielectric on the laterally opposite sidewalls of the semiconductor body. The gate electrode may only partially deplete a region of the semiconductor body, and the partially depleted region may be used as a storage node for logic states.

Abstract: A method and apparatus for reducing power consumption in integrated memory devices is provided. Banks of memory cells may be individually put into “sleep” mode via respective “sleep” transistors.

Abstract: A dynamic random access memory includes a cell having a circuit between a floating-body transistor and a bit line. Activation of the circuit is controlled to provide isolation between the floating body and bit-line voltage both during write operations and during times when the cell is unselected. The added isolation improves performance, for example, by reducing the need for gate-to-body coupling and the magnitude of voltage swings between the bit lines.

Abstract: A bias generator is provided that includes a central bias generator to provide a first bias voltage and a local bias generator to receive the first bias voltage and to provide a second bias voltage. The central bias generator may include a replica bias generator circuit substantially corresponding to the local bias generator.

Abstract: A bias generator unit is provided that includes a central bias generator to provide a bias voltage, a local bias generator to receive the bias voltage and a reference voltage and to provide a forward body bias signal or a reverse body bias signal. The bias generator may include a charge pump to output (or provide) a reference voltage to a reference generator, which in turn provides reference signals to the central bias generator. As a result, the local bias generator may control the body bias signal provided by the local bias generator.