Abstract: A one time programmable memory includes isolated gate transistors that may be programmed by subjecting the isolated gate transistors to voltage conditions that degrade characteristics of the isolated gate transistors. The degraded characteristics may be sensed to read the memory.

Abstract: An apparatus and method are provided for limiting a drop of a supply voltage in an SRAM device to retain the state of the memory during an IDLE state. The apparatus may include a memory array, a sleep device, and a clamping circuit. The clamping circuit may be configured to activate the sleep device when a voltage drop across the memory array falls below a preset voltage and the memory array is in an IDLE state.

Abstract: Embodiments relate to a Floating Body Dynamic Random Access Memory (FBDRAM). The FBDRAM utilizes a purge line to reset a FBDRAM cell, prior to writing data to the FBDRAM cell.

Abstract: Apparatuses and methods for delaying thermal throttling of processor devices by decreasing threshold voltages are disclosed.

Abstract: Different embodiments of a one-time-programmable antifuse cell are provided in this disclosure. In one embodiment, a circuit is provided that includes an antifuse element, a high voltage device, and a sense circuit. The antifuse element has a voltage supply terminal to be at a sense voltage during sensing/reading and a higher programming voltage during programming. The sense circuit is configured to enable programming the antifuse element during programming and to sense the state of the antifuse element during sensing. The high voltage device is coupled between the antifuse element and the sense circuit to couple the antifuse element to the sense circuit during programming and sensing and to protectively shield the sense circuit from the higher programming voltage during programming.

Abstract: A DRAM memory cell uses a single transistor to perform the data storage and switching functions of a conventional cell. The transistor has a floating channel body which stores a potential that corresponds to one of two digital data values. The transistor further includes a gate connected to a first word line, a drain connected to a second word line, and a source connected to a bit line. By setting the word and bit lines to specific voltage states, the channel body stores a digital one potential as a result of impact ionization and a digital zero value as a result of forward bias of body-to-source junction.

Abstract: A method is described that induced dielectric breakdown within a capacitor's dielectric material while driving a current through the capacitor. The current is specific to data that is being written into the capacitor. The method also involves reading the data by interpreting behavior of the capacitor that is determined by the capacitor's resistance, where, the capacitor's resistance is a consequence of the inducing and the driving.

Abstract: A system to write to a plurality of memory cells coupled to a word line, each of the plurality of memory cells comprising a transistor having a source, a drain, a body and a gate coupled to the word line. Some embodiments provide biasing of one or more of the plurality of memory cells in saturation to inject charge carriers into the body of the one or more of the plurality of memory cells, and biasing of each of the plurality of memory cells in accumulation to tunnel charge carriers from the body of each of the plurality of memory cells to the gate of each of the plurality of memory cells.

Abstract: A controller for providing within-die body bias includes a signal generator for generating different bias signals and a selector to route the bias signals to one or more specific types of transistors within the sections of the die. The controller may further include a plurality of secondary body bias generators, each disposed in a respective one of the die sections for translating the signals from the generator into local bias values. Through this controller, adaptive body bias techniques may be implemented which improve the bin split and overall performance of fabricated processors or other types of circuits formed on the die.

Abstract: Crosspoint memory arrays utilizing one time programmable antifuse cells are disclosed.

Abstract: A method and apparatus for a one-phase write to a one-transistor memory cell array. In one embodiment, the method includes a one-phase write to a selected wordline of a memory cell array. Once the wordline is selected, a logical zero value is stored within at least one memory cell of the selected wordline of the memory cell array. Simultaneously, a logical 0 value is stored within at least one memory cell of the selected wordline of the selected memory cell array. Other embodiments are described and claimed.

Abstract: A method is described that comprises modulating the power consumption of an SRAM as a function of its usage at least by reaching, with help of a transistor, a voltage on a node within an operational amplifier's feedback loop. The voltage is beyond another voltage that the operational amplifier would drive the node to be without the help of the transistor. The voltage helps the feedback loop establish a voltage drop across a cell within the SRAM.

Abstract: Some embodiments provide a memory cell comprising a body region doped with charge carriers of a first type, a source region disposed in the body region and doped with charge carriers of a second type, and a drain region disposed in the body region and doped with charge carriers of the second type. According to some embodiments, the body region, the source region, and the drain region are oriented in a first direction, the body region and the source region form a first junction, and the body region and the drain region form a second junction. Moreover, a conductivity of the first junction from the body region to the source region in a case that the first junction is unbiased is substantially less than a conductivity of the second junction from the body region to the drain region in a case that the second junction is unbiased. Some embodiments further include a transistor oriented in a second direction, wherein the second direction is not parallel to the first direction.

Abstract: Some embodiments provide a memory cell that includes a body region, a source region and a drain region. The body region is doped with charge carriers of a first type, the source region is disposed in the body region and doped with charge carriers of a second type, and the drain region is disposed in the body region and doped with charge carriers of the second type. The body region and the source region form a first junction, the body region and the drain region form a second junction, and a conductivity of the first junction from the body region to the source region in a case that the first junction is unbiased is substantially less than a conductivity of the second junction from the body region to the drain region in a case that the second junction is unbiased.

Abstract: A memory device is provided that includes a plurality of memory cells where each memory cell includes a source region, a drain region and a floating gate. A coupling bit-line is also provided that extends over at least one column of the plurality of memory cells. The coupling bit-line may be formed on each of the floating gates of memory cells forming the column of the plurality of memory cells. The coupling bit-line may also be formed within a well of each of memory cells forming the column of the plurality of memory cells.

Abstract: Embodiments of the present invention provide a method, apparatus and system for dynamically adjusting one or more performance-related parameters of a processor core based on at least one operation parameter related to an operating condition of the processor core.

Abstract: A floating-body dynamic random access memory device may include a semiconductor body having a top surface and laterally opposite sidewalls formed on a substrate. A gate dielectric layer may be formed on the top surface of the semiconductor body and on the laterally opposite sidewalls of the semiconductor body. A gate electrode may be formed on the gate dielectric on the top surface of the semiconductor body and adjacent to the gate dielectric on the laterally opposite sidewalls of the semiconductor body. The gate electrode may only partially deplete a region of the semiconductor body, and the partially depleted region may be used as a storage node for logic states.

Abstract: A two transistor memory cell includes a write transistor and a read transistor. When reading the memory cell, the read transistor is turned on, and a voltage develops on a read bit line.

Abstract: A transistor may have degraded characteristics because of an overvoltage condition. The degraded characteristics may be sensed to determine that the transistor has previously been subjected to an overvoltage condition.

Abstract: A SRAM device is provided having a plurality of memory cells. Each memory cell may include a plurality of transistors coupled in a cross-coupled inverter configuration. An NMOS transistor may be coupled to a body of the two PMOS transistors in the cross-coupled inverter configuration so as to apply a forward body bias to the PMOS transistors of the cross-coupled inverter configuration. A power control unit may control a supply voltage to each of the PMOS transistors as well as apply the switching signal to the NMOS transistor based on a STANDBY mode of the memory cell.