Patents by Inventor Steven M. Zuniga

Steven M. Zuniga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080119119
    Abstract: A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. A carrier ring has an annular upper portion and an annular lower portion having a lower surface with a smaller inner diameter than the upper surface of the annular upper portion, wherein the carrier ring circumferentially surrounds a retaining ring and has a lower surface to contact a polishing pad.
    Type: Application
    Filed: April 27, 2007
    Publication date: May 22, 2008
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Steven M. Zuniga, Andrew J. Nagengast, Jeonghoon Oh
  • Publication number: 20080119120
    Abstract: A carrier head that has a housing, a base assembly, a retaining ring, a carrier ring, and a flexible membrane is described. The base assembly is vertically movable relative to the housing. The retaining ring is connected to and vertically movable relative to the base assembly and has a lower surface configured to contact a polishing pad and an inner surface configured to circumferentially surround the edge of a substrate to retain the substrate. The carrier ring is connected to and vertically fixed relative to the base assembly, circumferentially surrounds the retaining ring to prevent lateral motion of the retaining ring, and has a bottom surface configured to contact a polishing pad.
    Type: Application
    Filed: September 26, 2007
    Publication date: May 22, 2008
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Steven M. Zuniga, Andrew J. Nagengast, Jeonghoon Oh
  • Publication number: 20080102737
    Abstract: A method and apparatus for conditioning is provided. In one embodiment, a conditioning disk includes a plurality of conditioning elements each having an abrasive working surface, and a flexible foundation having the conditioning elements coupled thereto. The flexible foundation has physical properties that retain the working surfaces in a substantially coplanar orientation with respect to the pad surface.
    Type: Application
    Filed: October 30, 2007
    Publication date: May 1, 2008
    Inventors: Shou-Sung Chang, Steven M. Zuniga
  • Publication number: 20080096467
    Abstract: A two part retaining ring is described. An rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.
    Type: Application
    Filed: October 13, 2006
    Publication date: April 24, 2008
    Inventors: Shaun Van Der Veen, Steven M. Zuniga
  • Patent number: 7344434
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: March 18, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Stacy Meyer, Trung T. Doan, Daniel Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Publication number: 20070289124
    Abstract: The present invention relates to an apparatus and method for improving and speeding up substrate loading process. One embodiment provides a method for vacuum chucking a substrate. The method comprises venting a center chamber of a flexible membrane configured for mounting the substrate, moving the substrate such that a backside of the substrate is in full contact with the flexible membrane, and vacuuming the center chamber to vacuum chuck the backside of the substrate to the flexible membrane.
    Type: Application
    Filed: June 1, 2007
    Publication date: December 20, 2007
    Inventors: Jeonghoon Oh, Andrew Nagengast, Steven M. Zuniga, Hung Chih Chen
  • Publication number: 20070281589
    Abstract: The present invention generally relates to a substrate transferring system having an alignment mechanism of a surface and to two points. One embodiment of the present invention provides a load cup for transferring a substrate. The load cup comprises a cup having a substrate supporting surface configured to support the substrate thereon, and two alignment pins protruding from the cup outside the substrate supporting surface, wherein the two alignment pins are both positioned at a first distance away from a center of the substrate supporting surface, and the cup is pivotable about a pivoting point positioned at a second distance away from the center.
    Type: Application
    Filed: June 1, 2007
    Publication date: December 6, 2007
    Inventors: Jeonghoon Oh, Hung Chih Chen, Steven M. Zuniga
  • Patent number: 7273408
    Abstract: The present invention relates to an apparatus and method for polishing semiconductor substrates. In one embodiment, two polishing heads are mounted on two independent pivoting arms that share one pivot point. Each of the pivoting arms enable the corresponding polishing head direct access to two polishing stations. The polishing system of the present invention provides flexibility and improves throughput.
    Type: Grant
    Filed: May 22, 2006
    Date of Patent: September 25, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga
  • Patent number: 7255771
    Abstract: A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base. The flexible membrane includes a central portion with an outer surface providing a substrate receiving surface, a perimeter portion connecting the central portion to the base, and at least one flap extending from an inner surface of the central portion. The flap divides a volume between the flexible membrane and the base into a plurality of chambers, and the flap includes a laterally extending first section and an angled second section extending beneath the first section and connecting the laterally extending first section to the central portion.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: August 14, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Jeonghoon Oh, Tsz-Sin Siu, Thomas Brezoczky, Steven M. Zuniga
  • Patent number: 7207871
    Abstract: A system for chemical mechanical polishing having a carrier head with pressurizeable chambers that can be configured into pressure zones is described. The system includes a carrier head with a membrane for contacting a substrate during polishing. Pressurizeable chambers behind the membrane are in communication with pressure inputs. The pressure inputs can each supply a different pressure to the pressurizeable chambers. Some of the pressurizeable chambers can be in communication with more than one pressure input. Zones of pressure can be arranged, where each zone includes one or more pressurizeable chambers. The zones can be configurable by altering the pressurizeable chambers that make up each zone.
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: April 24, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Steven M. Zuniga, Hung Chih Chen, Thomas Brezoczky, Steven T. Mear
  • Patent number: 7198561
    Abstract: A flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus has a central portion with an outer surface providing a substrate receiving surface, a perimeter portion for connecting the central portion to a base of the carrier head, and at least one flap extending from an inner surface of the central portion. The flap includes a laterally extending first section and a vertically extending second section connecting the laterally extending first section to the central portion.
    Type: Grant
    Filed: December 28, 2005
    Date of Patent: April 3, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Jeonghoon Oh, Steven M. Zuniga
  • Patent number: 7153188
    Abstract: The carrier head has a base and a substrate backing structure for holding a substrate against a polishing surface during polishing. The substrate backing structure is connected to the base and includes an external surface that contacts a backside of the substrate during polishing. The substrate backing structure also includes a resistive heating system to distribute heat over an area of the external surface and at least one thermally conductive membrane. The external surface is a first surface of the at least one thermally conductive membrane, and the resistive heating system is integrated within one of the at least one thermally conductive membrane.
    Type: Grant
    Filed: October 7, 2005
    Date of Patent: December 26, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Steven M. Zuniga, Hung Chih Chen, Stan D. Tsai, Kapila Wijekoon, Fred C. Redeker, Rajeev Bajaj
  • Patent number: 7115024
    Abstract: A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.
    Type: Grant
    Filed: January 5, 2005
    Date of Patent: October 3, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Thomas H. Osterheld, Sen-Hou Ko, Mohsen Salek
  • Patent number: 7101273
    Abstract: A carrier head includes a housing connectable to a drive shaft to rotate therewith, a lower assembly having a substrate mounting surface, and a gimbal mechanism that connects the housing to the lower assembly to permit the lower assembly to pivot with respect to the housing about an axis substantially parallel to the polishing surface. The gimbal mechanism includes a shaft having an upper end slidably disposed in a vertical passage in a vertical passage in the housing, and a lower member that connects a lower end of the shaft to the lower assembly. The lower member bends to permit the base to pivot with respect to the housing. The shaft and the lower member are a unitary body.
    Type: Grant
    Filed: September 28, 2005
    Date of Patent: September 5, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Ming-Kuei Tseng, Steven M. Zuniga
  • Patent number: 7101272
    Abstract: Systems and apparatus providing a carrier head for chemical mechanical polishing are described. The carrier head includes a base, a support structure attached to the base, a retaining structure attached to the base, and a connector attached to the base and the retaining structure. The support structure includes a receiving surface for contacting a substrate. The retaining structure prevents the substrate from moving along the receiving surface. The base and the retaining structure can thermally expand at different rates of expansion without causing distortion to one another.
    Type: Grant
    Filed: January 15, 2005
    Date of Patent: September 5, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga
  • Patent number: 7081042
    Abstract: Techniques for removing a substrate from a polishing pad are described. A substrate is pulled away from the polishing pad such that the edges of the substrate are pulled away from the polishing pad before the center of the substrate is pulled from the polishing pad.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: July 25, 2006
    Assignee: Applied Materials
    Inventors: Hung Chih Chen, Steven M. Zuniga, Tsz-Sin Siu
  • Patent number: 7048621
    Abstract: A carrier bead for chemical mechanical polishing of a substrate. The carrier head includes a carrier base, a retaining ring, and a junction connecting the carrier base to the retaining ring. The junction is configured such that vertical movement of the retaining ring is substantially restrained relative to the carrier base. The junction is further configured such that the profile of a bottom surface of the retaining ring is substantially decoupled from flexing and/or expansion of carrier base.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: May 23, 2006
    Assignee: Applied Materials Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga
  • Patent number: 7040971
    Abstract: A carrier head for a chemical mechanical polishing apparatus is described. The carrier head has a base, a rigid body, a membrane and a pressurizing structure. The rigid body is movable relative to the base and includes a downwardly-extending projection. The membrane has a mounting surface for a substrate. The membrane extends below the base to provide a chamber between the base and the membrane. The pressurizing structure applies a downward pressure on the rigid body to cause a lower surface of the rigid body to press on an inner surface of the membrane.
    Type: Grant
    Filed: September 20, 2004
    Date of Patent: May 9, 2006
    Assignee: Applied Materials Inc.
    Inventors: Steven M. Zuniga, Manoocher Birang, Hung Chen, Sen-Hou Ko
  • Patent number: 7001257
    Abstract: A carrier head that has a base assembly and a flexible membrane. The flexible membrane has a generally circular main portion with a lower surface that provides a substrate-mounting surface and a plurality of concentric annular portions extending from the main portion and secured to the base assembly. The volume between the base assembly and the flexible membrane forming a plurality of pressurizable chambers.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: February 21, 2006
    Assignee: Applied Materials Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga
  • Patent number: 7001256
    Abstract: A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base to define a chamber. The flexible membrane has a core of a first material and an outer layer of a second material having a lower adhesion to the substrate than the first material. An exposed surface of the outer layer provides a mounting surface for the substrate.
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: February 21, 2006
    Assignee: Applied Materials Inc.
    Inventors: Steven M. Zuniga, Hung Chih Chen