Abstract: A carrier head for chemical mechanical polishing of a substrate has a flexible membrane extending beneath a base to define a chamber. The flexible membrane provides a substrate receiving surface, and can be configured so that a pressure profile applied to a substrate is substantially insensitive to retaining ring wear.

Abstract: A method of chemical mechanical polishing uses a carrier head having a flexible membrane that applies a load to a substrate in a loading area with a controllable size. One pressurizable chamber in the carrier head controls the size of the loading area, and another chamber controls the pressure applied to the substrate in the loading area.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion. A shim can be inserted between the retaining ring and a base of the carrier head to improve the retaining ring lifetime. A seal may be inserted between the retaining ring and a flexible membrane to seal the chamber between the flexible membrane and the base.

Abstract: A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base to define a chamber. The flexible membrane has a core of a first material and an outer layer of a second material having a lower adhesion to the substrate than the first material. An exposed surface of the outer layer provides a mounting surface for the substrate.

Abstract: A carrier head for a chemical mechanical polishing system includes a flexible membrane with a substrate receiving surface, a sensor mechanism to determine if a substrate is properly attached to the carrier head, and means for preventing fluid that may be located between the substrate and the flexible membrane from interfering with the substrate detection mechanism.

Abstract: A carrier head has a backing assembly with a substrate support surface, a housing connectable to a drive shaft to rotate with the drive shaft about a rotation axis, and a dampening material in a load path between the backing assembly and the housing. The dampening material reduces transmission of vibrations from the backing assembly to the housing.

Abstract: A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.

Abstract: A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.

Abstract: A carrier head with a housing, a lower flexible membrane that defines a first chamber, an upper flexible membrane that defines a second chamber, and a pressure distribution assembly positioned between the upper flexible membrane and the lower flexible membrane. A lower surface of the lower flexible membrane provides a substrate mounting surface, and a portion of the upper flexible membrane can be biasable into contact with an upper surface of the lower flexible membrane. The pressure distribution assembly can include an upper surface in contact with the upper flexible membrane and a lower surface in contact with the lower flexible membrane. The pressure distribution assembly can be configured to transfer pressure from a portion of the upper flexible membrane to a more concentrated region of the substrate.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate. A central portion of the flexible membrane is formed of a first material with a different rigidity than a second material that forms the annular portion of the flexible membrane.

Abstract: A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.

Abstract: A compressible film that is detachably securable to a surface of a rigid structure in the carrier head. The compressible film has a plurality of apertures positioned to create a non-uniform pressure distribution on a substrate during polishing so as to improve polishing uniformity. The apertures may be spaced and positioned to provide a pressure distribution on the substrate that is locally uniform but globally non-uniform.

Abstract: A method of chemical mechanical polishing uses a carrier head having a flexible membrane that applies a load to a substrate in a loading area with a controllable size. One pressurizable chamber in the carrier head controls the size of the loading area, and another chamber controls the pressure applied to the substrate in the loading area.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate. A central portion of the flexible membrane is formed of a first material with a different rigidity than a second material that forms the annular portion of the flexible membrane.

Abstract: A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.

Abstract: A chemical mechanical polishing apparatus includes a carrier head, a platen positioned on an opposing side of the carrier head, and a polishing pad positioned on the platen to contact and polish the substrate received on the substrate receiving surface. The carrier head includes a housing, a flexible membrane attached to the housing and having a substrate receiving surface to receive a substrate. The flexible membrane has magnetically sensitive particles distributed therein. One or more coils are positioned above the flexible membrane to generate magnetic fields to exert magnetic forces on the particles.

Abstract: A carrier head for a chemical mechanical polishing apparatus has a base, a first flexible membrane extending beneath the base to form a first pressurizable chamber, a support structure positioned in the first chamber, and a compressible film adjacent a bottom surface of the support structure. A lower surface of the first flexible membrane providing a mounting surface for a substrate. The compressible film has a plurality of apertures disposed in a pattern to establish a pressure distribution on a top surface of the first flexible membrane.

Abstract: A carrier head for a chemical mechanical polishing apparatus a flexible membrane that applies a load to a substrate in a loading area with a controllable size. One pressurizable chamber in the carrier head controls the size of the loading area, and another chamber controls the pressure applied to the substrate in the loading area.

Abstract: A carrier head for a chemical mechanical polishing system includes a flexible membrane with a substrate receiving surface, a sensor mechanism to determine if a substrate is properly attached to the carrier head, and means for preventing fluid that may be located between the substrate and the flexible membrane from interfering with the substrate detection mechanism.