Patents by Inventor Steven M. Zuniga

Steven M. Zuniga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7001260
    Abstract: A compressible film that is detachably securable to a surface of a rigid structure in the carrier head. The compressible film has a plurality of apertures positioned to create a non-uniform pressure distribution on a substrate during polishing so as to improve polishing uniformity. The apertures may be spaced and positioned to provide a pressure distribution on the substrate that is locally uniform but globally non-uniform.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: February 21, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga
  • Patent number: 6979250
    Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a controllable load to a substrate in an area with a controllable inner diameter.
    Type: Grant
    Filed: March 22, 2004
    Date of Patent: December 27, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Steven M. Zuniga, Hung Chih Chen, Ming Kuie Tseng
  • Patent number: 6974371
    Abstract: A retaining ring is made of two generally annual portions. One portion has depressions and the other portion has projections that extend into the depressions when the two portions are brought together. The projections can have a cross section with two outwardly sloped sides.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: December 13, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Jeonghoon Oh, Steven M. Zuniga, Robert D. Tolles
  • Patent number: 6923714
    Abstract: A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base to define a chamber. The flexible membrane has a core of a first material and an outer layer of a second material having a lower adhesion to the substrate than the first material. An exposed surface of the outer layer provides a mounting surface for the substrate.
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: August 2, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Steven M. Zuniga, Hung Chih Chen
  • Patent number: 6913518
    Abstract: A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.
    Type: Grant
    Filed: May 6, 2003
    Date of Patent: July 5, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Thomas H. Osterheld, Sen-Hou Ko, Mohsen Salek
  • Patent number: 6890249
    Abstract: A carrier head for chemical mechanical polishing of a substrate having a front surface, a back surface and an edge. The carrier head has a base, an inner retaining ring positioned beneath the base, and an outer retaining ring surrounding the inner retaining ring to retain the inner retaining ring. The inner retaining ring has a main portion with a first surface to apply a load to a perimeter portion of the back surface of the substrate and an annular lower projection protruding downwardly from the main portion with a second surface to circumferentially surround the edge of the substrate to retain the substrate.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: May 10, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Steven M. Zuniga, Ming-Kuei Tseng
  • Patent number: 6872122
    Abstract: A method of detecting a substrate in a carrier head for a chemical mechanical polishing system includes connecting a chamber in a carrier head to a pressure source, measuring the pressure in the chamber as a function of time, calculating the derivative of the pressure in the chamber, and determining whether the substrate is adjacent a substrate receiving surface in the carrier head from the derivative.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: March 29, 2005
    Assignee: Applied Materials, Inc.
    Inventor: Steven M. Zuniga
  • Patent number: 6872130
    Abstract: A carrier head for chemical mechanical polishing of a substrate has a base and a retaining ring positioned beneath the base. The retaining ring includes a main portion with a first surface to apply a load to a perimeter portion of the back surface of the substrate and an annular projection with a second surface to retain the substrate. A bottom surface of the projection is separated from a top surface of a polishing pad by a gap.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: March 29, 2005
    Assignee: Applied Materials Inc.
    Inventor: Steven M. Zuniga
  • Patent number: 6857945
    Abstract: A carrier head that has a base assembly and a flexible membrane. The flexible membrane has a generally circular main portion with a lower surface that provides a substrate-mounting surface and a plurality of concentric annular portions extending from the main portion and secured to the base assembly. The volume between the base assembly and the flexible membrane forming a plurality of pressurizable chambers.
    Type: Grant
    Filed: November 13, 2000
    Date of Patent: February 22, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga
  • Patent number: 6857946
    Abstract: A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.
    Type: Grant
    Filed: January 28, 2003
    Date of Patent: February 22, 2005
    Assignee: Applied Materials Inc.
    Inventors: Steven M. Zuniga, Manoocher Birang, Hung Chen, Sen-Hou Ko
  • Patent number: 6848980
    Abstract: A carrier head has a backing assembly with a substrate support surface, a housing connectable to a drive shaft to rotate with the drive shaft about a rotation axis, and a dampening material in a load path between the backing assembly and the housing. The dampening material reduces transmission of vibrations from the backing assembly to the housing.
    Type: Grant
    Filed: April 16, 2002
    Date of Patent: February 1, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Ramakrishna Cheboli
  • Patent number: 6835125
    Abstract: A retaining ring has an inner core of a first material and an outer layer of a second, different material that is deposited on the first material. The outer layer can be deposited by spraying, e.g., by powder coating, and can be a polymer, e.g., polyetheretherketone.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: December 28, 2004
    Assignee: Applied Materials Inc.
    Inventors: Ming-Kuei Tseng, Michael Richter, Steven M. Zuniga
  • Publication number: 20040224615
    Abstract: A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.
    Type: Application
    Filed: May 6, 2003
    Publication date: November 11, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Thomas H. Osterheld, Sen-Hou Ko, Mohsen Salek
  • Publication number: 20040219870
    Abstract: A retaining ring is made of two generally annual portions. One portion has depressions and the other portion has projections that extend into the depressions when the two portions are brought together. The projections can have a cross section with two outwardly sloped sides.
    Type: Application
    Filed: April 30, 2003
    Publication date: November 4, 2004
    Inventors: Hung Chih Chen, Jeonghoon Oh, Steven M. Zuniga, Robert D. Tolles
  • Publication number: 20040209556
    Abstract: A substrate is maintained beneath a substrate mounting surface with a retaining ring that includes a generally annular lower portion having a bottom surface for contacting the polishing surface during polishing, and a generally annular upper portion having a bottom surface joined to the lower portion and a top surface fixed to and abutting the base. The lower portion is made of a plastic and the upper lower portion is made of a metal which is more rigid than the plastic.
    Type: Application
    Filed: April 15, 2004
    Publication date: October 21, 2004
    Applicant: Applied Materials, Inc., a Delaware corporation
    Inventors: Steven M. Zuniga, Thomas H. Osterheld, Lawrence M. Rosenberg
  • Publication number: 20040192173
    Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a controllable load to a substrate in an area with a controllable inner diameter.
    Type: Application
    Filed: March 22, 2004
    Publication date: September 30, 2004
    Inventors: Steven M. Zuniga, Hung Chih Chen, Ming Kuie Tseng
  • Patent number: 6776694
    Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate. A central portion of the flexible membrane is formed of a first material with a different rigidity than a second material that forms the annular portion of the flexible membrane.
    Type: Grant
    Filed: July 1, 2002
    Date of Patent: August 17, 2004
    Assignee: Applied Materials Inc.
    Inventors: Steven M. Zuniga, Hung Chih Chen, Ming Kuie Tseng
  • Patent number: 6722965
    Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a controllable load to a substrate in an area with a controllable inner diameter.
    Type: Grant
    Filed: July 10, 2001
    Date of Patent: April 20, 2004
    Assignee: Applied Materials Inc.
    Inventors: Steven M. Zuniga, Hung Chih Chen, Ming Kuie Tseng
  • Publication number: 20040067719
    Abstract: A method of detecting a substrate in a carrier head for a chemical mechanical polishing system includes connecting a chamber in a carrier head to a pressure source, measuring the pressure in the chamber as a function of time, calculating the derivative of the pressure in the chamber, and determining whether the substrate is adjacent a substrate receiving surface in the carrier head from the derivative.
    Type: Application
    Filed: September 24, 2003
    Publication date: April 8, 2004
    Inventor: Steven M. Zuniga
  • Publication number: 20040033769
    Abstract: A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.
    Type: Application
    Filed: January 28, 2003
    Publication date: February 19, 2004
    Applicant: Applied Materials, Inc., a Delaware corporation
    Inventors: Steven M. Zuniga, Manoocher Birang, Hung Chen, Sen-Hou Ko