Abstract: A method of manufacturing a semiconductor device, including forming an etching target film on a substrate; forming an anti-reflection film on the etching target film; forming a photoresist film on the anti-reflection film; exposing the photoresist film; performing heat treatment on the anti-reflection film and the photoresist film to form a covalent bond between the anti-reflection film and the photoresist film; and developing the photoresist film.

Abstract: A high-output lithium secondary battery is provided. In some embodiments, the lithium secondary battery includes a cathode having a first cathode active material having a layered structure and. a second cathode active material having a spinel structure, wherein the-amount of the second cathode active material is between 40 and 100 wt % based on the total weight of the cathode active materials, an anode including crystalline graphite having a specific surface area (with respect to capacity) of 0.005 to 0.013 m2/mAh as an anode active material, and a separator.

Abstract: Packages substrates are provided. The package substrates may include a substrate and a set of leads disposed on the substrate. The set of lead may include a first lead, a second lead and a third lead, which are sequentially disposed along a first direction. Each of the first lead, the second lead and the third lead may extend along a second direction that is different from the first direction. The first lead and the second lead may be spaced apart at a first distance, and the second lead and the third lead may be spaced apart at a second distance that is less than the first distance.

Abstract: Provided are a semiconductor package and a method of fabricating the same. The package substrate includes a hole, which may be used to form a mold layer without any void. The mold layer may be partially removed to expose a lower conductive pattern. Accordingly, it is possible to improve routability of solder balls.

Abstract: Disclosed is a high-output lithium secondary battery including: a cathode that includes, as cathode active materials, a first cathode active material represented by Formula 1 below and having a layered structure and a second cathode active material represented by Formula 2 below and having a spinel structure, wherein the amount of the second cathode active material is between 40 and 100 wt % based on the total weight of the cathode active materials; an anode including crystalline graphite and amorphous carbon as anode active materials, wherein the amount of the amorphous carbon is between 40 and 100 wt % based on the total weight of the anode active materials; and a separator.

Abstract: Provided are a semiconductor package and a method of fabricating the same. The package substrate includes a hole, which may be used to form a mold layer without any void. The mold layer may be partially removed to expose a lower conductive pattern. Accordingly, it is possible to improve routability of solder balls.

Abstract: Provided are a method of forming patterns and a method of manufacturing an integrated circuit device. In the method of forming patterns, a photoresist pattern having a first opening exposing a first region of a target layer is formed. A capping layer is formed at sidewalls of the photoresist pattern defining the first opening. An insoluble region is formed around the first opening by diffusing acid from the capping layer to the inside of the photoresist pattern. A second opening exposing a second region of the target layer is formed by removing a soluble region spaced apart from the first opening, with the insoluble region being interposed therebetween. The target layer is etched using the insoluble region as an etch mask.

Abstract: Disclosed is lithium iron phosphate having an olivine crystal structure, wherein the lithium iron phosphate has a composition represented by the following Formula 1, a sulfur compound with a sulfide bond is contained, as an impurity, in the lithium iron phosphate particles, and carbon (C) is coated on particle surfaces of the lithium iron phosphate: Li1+aFe1-xMx(PO4-b)Xb??(1) (wherein M, X, a, x, and b are the same as defined in the specification).

Abstract: Disclosed is a high-output lithium secondary battery including: a cathode that includes, as cathode active materials, a first cathode active material represented by Formula 1 below and having a layered structure and a second cathode active material represented by Formula 2 below and having a spinel structure, wherein the amount of the second cathode active material is between 40 and 100 wt % based on the total weight of the cathode active materials; an anode including amorphous carbon having a capacity of 300 mAh/g or greater; and a separator.

Abstract: Disclosed is a high-output lithium secondary battery including: a cathode including a cathode active material having an average particle diameter (with respect to capacity) of 0.03 to 0.1 ?m/mAh and a layered structure; an anode including crystalline graphite and amorphous carbon as anode active materials, wherein the amount of the amorphous carbon is between 40 and 100 wt % based on the total weight of the anode active materials; and a separator.

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract: Packages substrates are provided. The package substrates may include a substrate and a set of leads disposed on the substrate. The set of lead may include a first lead, a second lead and a third lead, which are sequentially disposed along a first direction. Each of the first lead, the second lead and the third lead may extend along a second direction that is different from the first direction. The first lead and the second lead may be spaced apart at a first distance, and the second lead and the third lead may be spaced apart at a second distance that is less than the first distance.

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract: In a composition of forming a passivation layer, the composition includes about 30 to about 60 percent by weight of a mixed polymer resin formed by blending polyamic acid and polyhydroxy amide, about 3 to about 10 percent by weight of a photoactive compound, about 2 to about 10 percent by weight of a cross-linking agent and an organic solvent. The passivation layer formed by using the composition has superior mechanical and physical properties, in which disadvantages of polyimide and polybenzoxazole are compensated by mixing both materials.

Abstract: Disclosed are a system and method for charging a battery pack. The system uses a recovery vehicle to quickly charge a vehicle battery pack. The system includes a charging power supply module equipped in the recovery vehicle, quick charging power lines placed in the vehicle battery pack, a quick charge switch placed in the quick charging power lines, and a control module.

Abstract: Provided are a semiconductor device including an EMI shield, a method of manufacturing the same, a semiconductor module including the semiconductor device, and an electronic system including the semiconductor device. The semiconductor device includes a lower semiconductor package, an upper semiconductor package, a package bump, and an EMI shield. The lower semiconductor package includes a lower substrate, a lower semiconductor chip mounted on the lower substrate, and a ground wire separated from the lower semiconductor chip. The upper semiconductor package includes an upper substrate stacked on the lower semiconductor package, and an upper semiconductor chip stacked on the upper substrate. The package bump electrically connects the upper semiconductor package and the lower semiconductor package. The EMI shield covers the upper and lower semiconductor packages and is electrically connected to the ground wire.

Abstract: Disclosed is lithium iron phosphate having an olivine crystal structure wherein carbon (C) is coated on particle surfaces of the lithium iron phosphate, wherein, when a powder of the lithium iron phosphate is dispersed in water, water is removed from the resulting dispersion and the resulting lithium iron phosphate residue is quantitatively analyzed, a ratio of the carbon-released lithium iron phosphate with respect to the total weight of the carbon-coated lithium iron phosphate is 0.005% by weight or less. Advantageously, the olivine-type lithium iron phosphate is not readily separated through uniform thin film coating on the surface of the lithium iron phosphate and exhibits superior conductivity and density, since carbon is coated on particle surfaces of lithium iron phosphate in a state in which the amount of carbon released in water is considerably small.

Abstract: A flip-chip semiconductor package is provided that includes a semiconductor chip, a package substrate having a chip attachment surface on which bond sites are formed, and bumps attached to an active surface of the semiconductor chip and bonded to the bond sites, wherein the bond sites are radially arranged around a middle portion of the package substrate.

Abstract: Disclosed is an anticancer composition, comprising an inhibitor against WIG1 and/or YPEL5 or against a protein encoded by the gene. A composition for screening an anticancer agent comprising a nucleic acid having a sequence complementary to an mRNA of WIG1 and/or YPEL5, or an antibody to a protein encoded by the gene is also provided. Also, a method is provided for screening an anticancer agent, which comprises: (A) quantitatively analyzing expression of WIG1 and/or YPEL5 at an mRNA or protein level in a tumor cell which is not treated with a candidate for an anticancer agent; (B) quantitatively analyzing expression of the gene at an mRNA or protein level in a tumor cell after treatment of the candidate for an anticancer agent; and (C) selecting the candidate if the expression level of the gene is increased in step (B), compared to step (A).

Abstract: Disclosed is lithium iron phosphate having an olivine crystal structure, wherein the lithium iron phosphate has a composition represented by the following Formula 1 and carbon (C) is coated on the particle surface of the lithium iron phosphate containing a predetermined amount of sulfur (S). Li1+aFe1?xMx(PO4?b)Xb??(1) (wherein M, X, a, x, and b are the same as defined in the specification).