Abstract: A system for tracepoint-based fault diagnosis and recovery includes: a system state tracing model unit for storing state tracing models which are obtained by a modeling technique and are required for fault diagnosis and recovery; a state diagnosis unit for determining whether or not an action event is executable with reference to the state tracing models when the action event is received from a specific tracepoint among multiple tracepoints which exist in each of components within an operating system of the system, and generating a fault recovery command when it is determined that the action is not executable, that is, a fault has occurred; and a fault recovery unit for performing a fault recovery processing based on the state tracing models in response to the generated fault recovery command.

Abstract: An ortho-nitrobenzyl ester compound including a compound represented by Chemical Formula 1, and a positive photosensitive resin composition including the same are provided.

Abstract: Disclosed are a novel phenol compound comprising a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, or a combination thereof, and a positive photosensitive resin composition including the same.

Abstract: Disclosed is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. In the above Chemical Formula 1, each substituent is the same as defined in the specification.

Abstract: In a composition of forming a passivation layer, the composition includes about 30 to about 60 percent by weight of a mixed polymer resin formed by blending polyamic acid and polyhydroxy amide, about 3 to about 10 percent by weight of a photoactive compound, about 2 to about 10 percent by weight of a cross-linking agent and an organic solvent. The passivation layer formed by using the composition has superior mechanical and physical properties, in which disadvantages of polyimide and polybenzoxazole are compensated by mixing both materials.

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract: A system for tracepoint-based fault diagnosis and recovery includes: a system state tracing model unit for storing state tracing models which are obtained by a modeling technique and are required for fault diagnosis and recovery; a state diagnosis unit for determining whether or not an action event is executable with reference to the state tracing models when the action event is received from a specific tracepoint among multiple tracepoints which exist in each of components within an operating system of the system, and generating a fault recovery command when it is determined that the action is not executable, that is, a fault has occurred; and a fault recovery unit for performing a fault recovery processing based on the state tracing models in response to the generated fault recovery command.

Abstract: Provided is a semiconductor chip. The semiconductor chip includes a semiconductor substrate including a main chip region and a scribe lane region surrounding the main chip region. An insulating layer is disposed over the semiconductor substrate. A guard ring is disposed in the insulating layer in the scribe lane region. The guard ring surrounds at least a portion of the main chip region. The guard ring has a brittleness greater than a brittleness of the insulating layer.