Abstract: An embodiment is a method including forming a first package. The forming the first package includes forming a through via adjacent a first die, at least laterally encapsulating the first die and the through via with an encapsulant, and forming a first redistribution structure over the first die, the through via, and the encapsulant. The forming the first redistribution structure including forming a first via on the through via, and forming a first metallization pattern on the first via, at least one sidewall of the first metallization pattern directly overlying the through via.

Abstract: The present disclosure provides a novel compound represented by the following Chemical Formula 1 and an organic light emitting device including the same: wherein R1 to R8 are described herein.

Abstract: The present disclosure relates to a transmission of an agricultural work vehicle, the transmission comprising: a pre-shift part for performing speed shifting on driving transmitted from an engine of an agricultural work vehicle; a clutch part connected to the pre-shift part so as to selectively output driving transmitted from the pre-shift part; an adjusting part connected to the clutch part so as to perform speed shifting on driving transmitted from the clutch part; and a subsequent shift part connected to the adjusting part so as to perform speed shifting on driving transmitted from the adjusting part.

Abstract: A device includes a fin extending from a semiconductor substrate; a gate stack over the fin; a first spacer on a sidewall of the gate stack; a source/drain region in the fin adjacent the first spacer; an inter-layer dielectric layer (ILD) extending over the gate stack, the first spacer, and the source/drain region, the ILD having a first portion and a second portion, wherein the second portion of the ILD is closer to the gate stack than the first portion of the ILD; a contact plug extending through the ILD and contacting the source/drain region; a second spacer on a sidewall of the contact plug; and an air gap between the first spacer and the second spacer, wherein the first portion of the ILD extends across the air gap and physically contacts the second spacer, wherein the first portion of the ILD seals the air gap.

Abstract: An integrated circuit includes a first standard cell including a first first-type transistor, a first second-type transistor, a third second-type transistor, and a third first-type transistor, a second standard cell including a second first-type transistor, a second second-type transistor, a fourth second-type transistor and a fourth first-type transistor, a plurality of wiring layers which are disposed on the first and second standard cells and includes a first wiring layer, a second wiring layer, and a third wiring layer sequentially stacked. A source contact of the first first-type transistor and a source contact of the second first-type transistor are electrically connected through a first power rail of the plurality of wiring layers, and a source contact of the third first-type transistor and a source contact of the fourth first-type transistor are electrically connected through a second power rail of the plurality of wiring layers.

Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a substrate, a gate structure, a dielectric structure and a contact structure. The substrate has source/drain (S/D) regions. The gate structure is on the substrate and between the S/D regions. The dielectric structure covers the gate structure. The contact structure penetrates through the dielectric structure to connect to the S/D region. A lower portion of a sidewall of the contact structure is spaced apart from the dielectric structure by an air gap therebetween, while an upper portion of the sidewall of the contact structure is in contact with the dielectric structure.

Abstract: A method includes placing an electronic die and a photonic die over a carrier, with a back surface of the electronic die and a front surface of the photonic die facing the carrier. The method further includes encapsulating the electronic die and the photonic die in an encapsulant, planarizing the encapsulant until an electrical connector of the electronic die and a conductive feature of the photonic die are revealed, and forming redistribution lines over the encapsulant. The redistribution lines electrically connect the electronic die to the photonic die. An optical coupler is attached to the photonic die. An optical fiber attached to the optical coupler is configured to optically couple to the photonic die.

Abstract: Disclosed are an electrolyte membrane of a membrane-electrode assembly including an electronic insulation layer, which greatly improves the durability of the electrolyte membrane, and a method of preparing the same. The electrolyte membrane includes an ion exchange layer and an electronic insulation layer provided on the ion exchange layer, and the electronic insulation layer includes one or more catalyst complexes, and a second ionomer Particularly, each of the one or more catalyst complex includes a catalyst particle and a first ionomer coated on the entirety or a portion of the surface of the catalyst particle, and the one or more catalyst complexes are dispersed the second ionomer.

Abstract: Methods, systems and apparatuses for managing roaming by access points (AP), a controller, and a wireless device are described. The wireless device may indicate intent to roam from a source AP to a target AP. The wireless device, APs, and controller may adjust buffering in anticipation of the change. The wireless device, APs, and controller may deliver buffered data via the target AP following a successful change from the source AP.

Abstract: An AI motion recognition based smart hometraining platform is configured to include: a photographing unit; an motion image generation unit; a joint information generation unit; a deep learning determination unit determining whether the user motion is suitable by inputting user joint information; a correction information generation unit extracting correction information, and generating an image for a correction image or correction information based on the extracted correction information; a user image generation unit generating a user image acquired by overlaying a joint information image of the joint information generation unit to the user image; and a display displaying both the image for the correction message or the correction information and the user image of the user image generation unit in the display.

Abstract: A positioning method and apparatus. A location management network element sends first indication information to a network device, where the first indication information is useable by the network device to measure a signal that is sent by a terminal device and that is reflected by a reflection panel. After receiving the first indication information, the network device measures the signal reflected by the reflection panel, and reports a measurement result to the location management network element. The location management network element determines a location of the terminal device based on location information of the network device, location information of the reflection panel, and the measurement result. In response to a line-of-sight (LOS) path between the terminal device and the network device being blocked, a signal on the LOS path cannot be directly transmitted and measured.

Abstract: A method for forming a via in a semiconductor device and a semiconductor device including the via are disclosed. In an embodiment, the method may include bonding a first terminal and a second terminal of a first substrate to a third terminal and a fourth terminal of a second substrate; separating the first substrate to form a first component device and a second component device; forming a gap fill material over the first component device, the second component device, and the second substrate; forming a conductive via extending from a top surface of the gap fill material to a fifth terminal of the second substrate; and forming a top terminal over a top surface of the first component device, the top terminal connecting the first component device to the fifth terminal of the second substrate through the conductive via.

Abstract: The present disclosure provides a novel compound represented by the following Chemical Formula 1, and an organic light emitting device including the same: wherein A1 to A4, X, Y, and n are described herein.

Abstract: A chip package structure is provided. The chip package structure includes a chip structure. The chip package structure includes a first ground bump below the chip structure. The chip package structure includes a conductive shielding film disposed over the chip structure and extending onto the first ground bump. The conductive shielding film has a concave upper surface facing the first ground bump.

Abstract: An electronic device including a memory device with improved reliability is provided. The semiconductor device comprises a data pin configured to transmit a data signal, a command/address pin configured to transmit a command and an address, a command/address receiver connected to the command/address pin, and a computing unit connected to the command/address receiver, wherein the command/address receiver receives a first command and a first address from the outside through the command/address pin and generates a first instruction on the basis of the first command and the first address, and the computing unit receives the first instruction and performs computation based on the first instruction.

Abstract: A semiconductor device includes a first and second active pattern extending in a first direction on a substrate, a first and second gate electrode extending in a second direction to intersect the first and second active pattern, a first source/drain contact extending in the second direction and connected to a first and source/drain region of the first and second active patterns, respectively, a first source/drain via connected to the first source/drain contact, a first cell separation film extending in the second direction and crosses the first active pattern and the second active pattern, between the first source/drain contact and the second gate electrode, a first gate via connected to the second gate electrode and arranged with the first source/drain via along the first direction, and a first connection wiring which extending in the first direction and connects the first source/drain via and the first gate via.

Abstract: A method of manufacturing a semiconductor device is as below. An exposed photoresist layer is developed using a developer supplied by a developer supplying unit. An ammonia gas by-product of the developer is discharged through a gas outlet of the developer supplying unit into a treating tool. The ammonia gas by-product is retained in the treating tool. A concentration of the ammonia gas by-product is monitored.

Abstract: An image sensor includes a substrate, a grid, and a color filter. The grid is over the substrate. From a cross-sectional view, the grid includes a first grid and a second grid over the first grid, the first grid has lower portion that has a first sidewall and a second sidewall opposing the first sidewall, the second grid has a third sidewall and a fourth sidewall opposing the third sidewall, and a width between the third sidewall and the fourth sidewall is less than a width between the first sidewall and the second sidewall. The color filter extends through the grid structure.

Abstract: The present invention relates to a perovskite solar cell module and a manufacturing method for same. The perovskite solar cell module comprises a plurality of perovskite solar cells disposed on a substrate, each of the perovskite solar cells comprising: a first electrode, a first charge transport layer on the first electrode, an optical active layer formed of a perovskite crystal structure, and a second charge transport layer, which are laminated in this order; and a second electrode laminated on the second charge transport layer, wherein the second electrode included in each of the cells can be electrically connected in series to the first electrode of the closest perovskite solar cell and enhance the photoelectric conversion efficiency of the perovskite solar cell module.

Abstract: A catalyst for preparing a synthesis gas includes: a mesoporous Al2O3 support including mesopores having a pore size of about 1 nm to about 30 nm; metal nanoparticles supported in the mesopores of the mesoporous Al2O3 support wherein the metal nanoparticles have a particle size of less than or equal to about 20 nm; and a metal oxide coating layer including particles wherein the metal oxide coating layer is coated on the surface of the mesoporous Al2O3 support and includes mesopores having a pore size of about 2 nm to about 50 nm.