Abstract: The present disclosure relates generally to certain 6-azabenzimidazole compounds, pharmaceutical compositions comprising said compounds, and methods of making and using said compounds and pharmaceutical compositions. The compounds and compositions disclosed herein may be used for the treatment or prevention of diseases, disorders, or infections modifiable by hematopoietic progenitor kinase 1 (HPK1) inhibitors, such as HBV, HIV, cancer, and/or a hyper-proliferative disease.

Abstract: An information handling stylus housing defines an expansion bay that accepts conforming replaceable modules to support a variety of different functions, such as a trigger, a capacitive touch input area, a haptic output film and an extra battery. The replaceable module couples into the replacement bay with magnetic attraction and a pin to hole interface. A set of pogo pins extending up from the main circuit board of the stylus contacts pads of the replaceable module to provide power and communication support.

Abstract: The present disclosure relates generally to compounds that bind to and act as degraders of an IKAROS Family Zinc Finger (IKZF) protein, such as IKZF2 (Helios) and/or IKZF4 (Eos). The disclosure further relates to the use of the compounds for the preparation of a medicament for the treatment of diseases and/or conditions through binding and degradation of an IKZF protein, such as IKZF2 and/or IKZF4, including cancer.

Abstract: The present disclosure relates generally to certain 6-azabenzimidazole compounds, pharmaceutical compositions comprising said compounds, and methods of making and using said compounds and pharmaceutical compositions. The compounds and compositions disclosed herein may be used for the treatment or prevention of diseases, disorders, or infections modifiable by hematopoietic progenitor kinase 1 (HPK1) inhibitors, such as HBV, HIV, cancer, and/or a hyper-proliferative disease.

Abstract: An information handling system keyboard includes an array of microphones having a defined layout that supports location of human voice sounds captured by the array of microphones to isolate voices originating from a defined distance and orientation while filtering other voices and non-voice sounds. A display included in the keyboard depicts a visual indication of voice quality that can include instructions to a speaker regarding adjustments to help obtain a desired voice capture quality to support a video or audio conference of an information handling system interfaced with the keyboard. The keyboard display also supports an interface to control a keyboard, video, mouse (KVM) switch interfaced with the keyboard.

Abstract: A memory subsystem triggers dynamic switching for memory devices to provide access to active memory devices and prevent access to inactive memory devices. Dynamic switching enables a single bus to switch between multiple memory devices whose capacity otherwise exceeds the capacity of the single bus. A switch can be mounted in a memory module or directly on a motherboard alongside the memory devices. A memory controller can toggle a chip select signal as a single control signal to drive the switch. Each switch includes pairs of field effect transistors (FETs), including any of CMOS, NMOS and PMOS FETs. The switch electrically isolates inactive memory devices to prevent access without the need to electrically short the devices.

Abstract: A fragmented sound box hub device comprising a rounded, fragmented sound box housing having a bottom housing cover and a side ring housing having a plurality of apertures for data ports and a microphone, a sound box processor, a sound box memory device, and a sound box power management unit (PMU) disposed on a base printed circuit board (PCB) within the rounded, fragmented sound box housing, a speaker centrally disposed in the rounded, fragmented soundbox housing, and a plurality of adjacent fragmented sound chambers operatively coupled to the speaker and disposed along the speaker in the rounded, fragmented sound box housing, where a portion of the fragmented sound chambers are of a plurality of different sizes to resonate sounds produced by the speaker at a corresponding plurality of sound frequency bands.

Abstract: The described technology provides an apparatus including a power supply unit (PSU) and a PSU control system stored in the memory and executable by the one or more processor units, the PSU control system encoding computer-executable instructions on the memory for executing on the one or more processor units a computer process, the computer process including receiving internal temperatures of the PSU over a duration of time, determining multiple exponential weighted moving average (EWMAs) of the internal temperature of the PSU for the duration of time, comparing the EWMA with a temperature threshold associated with the duration of time, and based at least in part on determining that EWMA exceeds the temperature threshold associated with the duration of time, limiting the output power of a charger using a charger current limit input to the charger.

Abstract: A power supply unit provides power to a common output node. The power supply unit includes a first power conversion block electrically coupled to convert the electrical power input to a first output power supply share supplied to the common output node. The first power conversion block is configured to decrease output voltage from the first power conversion block based on output current from the first power conversion block reaching a rated current level. A second power conversion block is electrically coupled to convert the electrical power input to a second output power supply share supplied to the common output node. The second power conversion block is configured with a predesignated open circuit voltage setting and is further configured to contribute the second output power supply share to the common output node based on the output voltage at the common output node decreasing to the predesignated electrical voltage setting.

Abstract: Embodiments herein relate to systems, apparatuses, techniques, or processes for stiffeners for a surface of a package substrate, where the stiffeners provide EMI/RFI shielding for signal traces or other electrical routings within the package, and in particular for traces at a surface of the package such as microstrip routings. Other embodiments may be described and/or claimed.

Abstract: Methods for preventing three-dimensional content from obscuring portions of a web browser or other user interface in a three-dimensional environment. In some embodiments, the methods include applying one or more visual treatments to the three-dimensional content. In some embodiments, the methods further include applying one or more visual treatments to portions of the web browser or portions of the other user interface. In some embodiments, the one or more visual treatments are applied at least from a viewpoint of a user. In some embodiments, applying the or more visual treatments is based on a three-dimensional visual effect of the three-dimensional content.

Abstract: A semiconductor package including a package substrate including a bottom surface; a first plurality of solder balls connected to the bottom surface of the package substrate; a second plurality of solder balls connected to a motherboard; and a shielding assembly interposed between the first and the second plurality of solder balls and configured to shield each solder ball of the first and second plurality of solder balls from electromagnetic interference.

Abstract: Embodiments herein relate to systems, apparatuses, or processes for creating packages that include one or more memory modules with electrically conductive strips on the side of the memory module to route power or provide a ground to multiple BGA contacts on a side of the memory module coupled with a substrate. Providing power and/or ground in this manner enables fewer layers to be used in a substrate that are no longer needed to be routed in the power plane on the substrate, thus reducing a Z-height of the package. Other embodiments may be described and/or claimed.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a die. In an embodiment, a package substrate is coupled to the die. In an embodiment, a ring is provided under the package substrate. In an embodiment, the ring comprises a conductive material. In an embodiment, the electronic package further comprises balls outside of the ring.

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a stiffener for a surface of a semiconductor package, where the stiffener includes slots that allow a gasket to go over the stiffener to electrically couple with a ground or a VSS of the semiconductor package. In embodiments, the gasket may include a material that blocks or absorbs EMI or RFI. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein relate to systems, apparatuses, techniques or processes for packages that include a die complex with a base die that is coupled with a HDP substrate that in turn is coupled with an mSAP board. The HDP substrate may have a small trace width and trace spacing, for example three ?m or less, that enable the HDP substrate to be used as a pitch translator between the base die and the mSAP board, for example between a 110 ?m pitch and a 210 ?m pitch. One or more DRAM modules may be coupled with the mSAP board. The configuration has a reduced overall package height. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein relate to systems, apparatuses, techniques, or processes directed to an electrical conductor, or power corridor, on the outside of a package substrate, wherein the electrical conductor is raised, or extends from a surface of the package substrate. In embodiments, this electrical conductor may be used to reduce the number of layers required within the package substrate by removing power planes within the substrate to the electrical conductors on the surface of the package. Other embodiments may be described and/or claimed.

Abstract: A computing device includes a flexible display screen, a housing to house at least one processor device and at least one memory element, and a first wing to support a side portion of the display screen. The front face of the housing includes a center portion of the display screen. The first wing is connected to the housing by a hinge, the first wing configured to swivel about an axis defined by the hinge. The hinge is configured to lock the first wing in at least two wing positions, a first of the wing positions supports the side portion of the display screen in a first orientation, a second of the wing positions supports the side portion of the display screen in a second orientation, and the side portion of the display screen is active in the first orientation and hidden in the second orientation.

Abstract: The present disclosure provides diacylglycerol kinase modulating compounds, and pharmaceutical compositions thereof, for treating cancer, including solid tumors, and viral infections, such as HIV or hepatitis B virus infection. The compounds can be used alone or in combination with other agents.

Abstract: A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to landing metal pads on the package substrate. The PCB includes surface pins in an arrangement to match the LM filled holes. A pick and place assembly of the package substrate to the PCB can be done without needing a reflow step. A magnet ring can be positioned on the polyimide sheet and configured to pair with a metal plate on the PCB. Guideposts around the periphery of the package substrate may be used to assist in alignment during assembly.