Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, and a base coupled to the package substrate. In an embodiment, a die is coupled to the base, and a memory die module is over the die.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, a stiffener is around the die and over the package substrate. In an embodiment, an electrically non-conductive underfill is around first level interconnects (FLIs) between the package substrate and the die. In an embodiment, an electrically conductive layer is around the non-conductive underfill.

Abstract: Embodiments disclosed herein include package substrates. In an embodiment, the package substrate comprises a core. In an embodiment, the core comprises a first sub-core layer and a second sub-core layer. In an embodiment, a via is provided through the first sub-core layer and the second sub-core layer. In an embodiment, the via comprises a first hourglass shape in the first sub-core layer and a second hourglass shape in the second sub-core layer. In an embodiment, a front-side buildup layer is over the core and a backside buildup layer is under the core.

Abstract: Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a first slot is through a thickness of the substrate, and a second slot is through the thickness of the substrate, where the first slot is parallel to the second slot. In an embodiment, a metal plate is provided on the PCB. In an embodiment the metal plate comprises a first portion over the first surface of the substrate between the first slot and the second slot, a second portion connected to the first portion, wherein the second portion is in the first slot, and a third portion connected to the first portion, wherein the third portion is in the second slot.

Abstract: Embodiments disclosed herein include package substrates. In an embodiment, a package substrate comprises a core, a first layer on the core, where the first layer comprises a first plane, a second layer on the first layer, where the second layer comprises first traces and second traces arranged in an alternating pattern, a third layer on the second layer, where the third layer comprises third traces and fourth traces arranged in an alternating pattern, and a fourth layer over the third layer, where the fourth layer comprises a second plane.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate with a first memory die stack on the package substrate, and a second memory die stack on the package substrate. In an embodiment, an electrically insulating layer is provided over the first memory die stack and the second memory die stack. In an embodiment, an opening is provided through the electrically insulating layer, and a die module is in the opening over the package substrate.

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate with a cutout. In an embodiment, pads are adjacent to the cutout. In an embodiment, a memory die stack is on the package substrate, where the memory die stack is electrically coupled to the pads by routing in the package substrate. In an embodiment, a die is over the cutout, where the die is supported by the pads.

Abstract: Systems, apparatuses and methods may provide for technology that receives parameter results and scores of one or more local sessions with respect to subcircuit components in a bounded area, aggregates the parameter results and scores, and generates a global placement model based on an output of the aggregated parameter results and scores.

Abstract: Systems and methods which provide single nanostructure-integrated metalens configurations implementing light focusing functionality are described. A single nanostructure-integrated metalens may comprise an optical substrate having a preconfigured mapping of integrated nanostructures providing metasurfaces for modulating the behaviors of electromagnetic waves to implement a thin, flat lens. A period distance for the nanostructures, a height of the nanostructures, and a quantization for lateral sizes of the nanostructures may be selected for a particular single nanostructure-integrated metalens configuration. One or more phase maps configured for light focusing may be computed with respect to one or more design wavelengths selected for focusing. The consolidated phase retardation requirements of the one ore more phase maps may be satisfied by a preconfigured mapping which defines the phase distribution for the nanostructures of a single nanostructure-integrated metalens implementation.

Abstract: An information handling system keyboard includes an array of microphones having a defined layout that supports location of human voice sounds captured by the array of microphones to isolate voices originating from a defined distance and orientation while filtering other voices and non-voice sounds. A display included in the keyboard depicts a visual indication of voice quality that can include instructions to a speaker regarding adjustments to help obtain a desired voice capture quality to support a video or audio conference of an information handling system interfaced with the keyboard. The keyboard display also supports an interface to control a keyboard, video, mouse (KVM) switch interfaced with the keyboard.

Abstract: A power supply includes a power factor correction (PFC) circuit, a PFC bypass circuit, and a decision circuit. The PFC circuit is configured to receive an input current from a power source and, when enabled, reduce current harmonics in the input current by shaping an input sinusoidal current waveform to match a phase and shape of a sinusoidal input voltage waveform. The PFC bypass circuit is configured to bypass the PFC circuit when the PFC circuit is disabled. The decision circuit includes a detection circuit configured to detect an output load of the power supply and is configured to output a PFC enable command based at least in part on the detected output load being greater than or equal to a threshold value and a determination that an input voltage of the power source is greater than or equal to a threshold value.

Abstract: The present disclosure relates generally to compounds that bind to and act as degraders of an IKAROS Family Zinc Finger (IKZF) protein, such as IKZF2 (Helios) and/or IKZF4 (Eos). The disclosure further relates to the use of the compounds for the preparation of a medicament for the treatment of diseases and/or conditions through binding and degradation of an IKZF protein, such as IKZF2 and/or IKZF4, including cancer.

Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing a Pad on Solder Mask (PoSM) semiconductor substrate package.

Abstract: Methods and apparatus to provide power management for multi-die stacks using artificial intelligence are disclosed. An example integrated circuit (IC) package includes a computer processor unit (CPU) die, a memory die, inference engine circuitry within the CPU die, the inference engine circuitry to infer, based on a first machine learning model, a workload for at least one of the CPU die or the memory die, and power management engine circuitry within the CPU die, the power management engine circuitry distinct from the inference engine circuitry, the power management engine circuitry to adjust, based on a second machine learning model different than the first machine learning model, operational parameters associated with the at least one of the CPU die or the memory die, the inferred workload to be an input to the second machine learning model.

Abstract: An information handling system mouse couples a scroll wheel at a scroll wheel position of the mouse upper surface to a five-way switch so that movement of the scroll wheel commands through the five-way switch a scroll up or down, a swipe left or right and a press down mouse click. An adjacent button provides precision or fast scroll through an interaction separate from the scroll wheel. A vibration device interfaced with the scroll wheel provides haptic feedback of end user interactions, such as by providing vibrations with a vertical orientation from a position below the scroll wheel.

Abstract: A first wireless speaker and microphone device paired with an information handling system comprising a microphone, speaker, wireless radio system for conducting a first pairing with the information handling system for wireless communications, and memory for storing a pairing profile for the first pairing. A microcontroller to operatively couple the first wireless speaker and microphone device to a second wireless speaker and microphone device by conducting a second pairing between the first and second wireless speaker and microphone devices, and cloning and transmitting the pairing profile from the first pairing to the second wireless speaker and microphone device. The first wireless speaker and microphone device to receive a switching command to stop audio transmission and reception at the first wireless speaker and microphone device to allow transmission and reception at the second wireless speaker and microphone device using a cloned wireless link established with the cloned pairing profile.

Abstract: An information handling system having an audio switching dongle operatively coupled to first wireless speaker and microphone device, the audio switching dongle further including an audio switching dongle wireless radio system operatively coupled via a first Wi-Fi protocol wireless link to transmit and receive the audio data on an active audio data stream with the first wireless speaker and microphone device and a second, parallel Wi-Fi protocol wireless link with the second wireless speaker and microphone device in standby, the audio switching dongle wireless radio system to receive a switching command from the second wireless speaker and microphone device pursuant to a user switch input from a user, and a controller integrated circuit to activate the second, parallel Wi-Fi protocol wireless link to transmit and receive the audio data of the active audio data stream and to transition the first Wi-Fi protocol wireless link to standby.

Abstract: A wearable hearing device operatively coupled to an information handling system comprising a housing for a speaker and a microphone, a magnetic slider switch moveable with respect to the housing between a closed position and an open position in response to a user's external force, a rolling magnet rotating within the magnetic slider switch during movement between the open and closed positions, a bar magnet fixed within the housing having a first pole attracting the rolling magnet in the closed position and a second pole attracting the rolling magnet in the open position to reduce the external force required to move the magnetic slider switch, a hall effect sensor to sense a change in distance to the rolling magnet during movement between the open and closed positions, and to associate the change in distance with a command instruction, and a microcontroller to execute or transmit the command instruction.

Abstract: An information handling system mouse couples a scroll wheel at a scroll wheel position of the mouse upper surface to a five-way switch so that movement of the scroll wheel commands through the five-way switch a scroll up or down, a swipe left or right and a press down mouse click. An adjacent button provides precision or fast scroll through an interaction separate from the scroll wheel. A vibration device interfaced with the scroll wheel provides haptic feedback of end user interactions, such as by providing vibrations with a vertical orientation from a position below the scroll wheel.

Abstract: The present invention is directed to new stable immediate release tablet and capsule formulations for the Janus Kinase 3 (JAK3) inhibitor 1-((2S,5R)-5-((7H-pyrrolo[2,3-d]pyrimidin-4-yl)amino)-2-methylpiperidin-1-yl)prop-2-en-1-one para-toluenesulfonate having structure