Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low profile hinge design that includes a micro-hinge. The micro-hinge can couple a first element to a second element and can include a first attachment that couples to the first element, a second attachment that couples to the second element, and a plurality of linkages that couples the first attachment to the second attachment. The low profile hinge can further include a plurality of micro-hinges and a plurality of support rods.

Abstract: An information handling system touch screen display and peripheral camera cooperate to coordinate presentation of visual images related to camera operations. For example, in one embodiment a tap on the camera housing commands presentation of a settings on screen display menu generated by a controller of the camera. In another example, a touch screen of the display detects a position of the camera by its capacitive effects to adjust presentation of visual images at the display, such as moving the settings on screen display menu to a position proximate the camera or adjusting a video conference presentation around the camera position.

Abstract: There may be provided a fastener arrangement. The fastener arrangement may include a first fastener tape including a first plurality of electrically conductive coupling elements and a first plurality of non-electrically conductive coupling elements. The fastener arrangement may further include a second fastener tape comprising a second plurality of electrically conductive coupling elements and a second plurality of non-electrically conductive coupling element. The fastener arrangement may further include a slider couplable to the first fastener tape and the second fastener tape for reversibly interleaving and interlocking the first plurality of electrically conductive and non-electrically conductive coupling elements with their corresponding second plurality of electrically conductive and non-electrically conductive elements.

Abstract: The present disclosure provides diacylglycerol kinase modulating compounds, and pharmaceutical compositions thereof, for treating cancer, including solid tumors, and viral infections, such as HIV or hepatitis B virus infection. The compounds can be used alone or in combination with other agents.

Abstract: A garment has a main body including a front portion, a back portion, and a gusset connecting the front portion and the back portion. The gusset has left and right lateral edges partially defining respective left and right leg openings of the main body. An absorbent material is coupled to an inner face of the main body at least at the gusset. A waterproof material is sandwiched between the main body and the absorbent material. Left and right elastic bands are coupled to outer lateral edges of the absorbent material. The left and right elastic bands are bonded to the waterproof material and the waterproof material is attached to the main body proximate the respective left and right lateral edges of the gusset. A method of manufacturing the garment is also disclosed.

Abstract: A power supply unit provides power to a common output node. The power supply unit includes a first power conversion block electrically coupled to convert the electrical power input to a first output power supply share supplied to the common output node. The first power conversion block is configured to decrease output voltage from the first power conversion block based at least in part on output current from the first power conversion block reaching a rated current level. A second power conversion block is electrically coupled to convert the electrical power input to a second output power supply share supplied to the common output node. The second power conversion block is configured with a predesignated open circuit voltage setting and is further configured to contribute the second output power supply share to the common output node based at least in part on the output voltage at the common output node decreasing to the predesignated electrical voltage setting.

Abstract: Integrated circuit (IC) packages with On Package Memory (OPM) architectures are disclosed herein. An example IC package includes a substrate having a first side and a second side opposite the first side, a semiconductor die mounted on the first side of the substrate, and a die pad on the first side of the substrate. The die is electrically coupled to the die pad. The IC package also includes a memory pad on the first side of the substrate. The memory pad is to be electrically coupled to a memory mounted on the first side of the substrate. The IC package further includes a ball on the second side of the substrate, and a memory interconnect in the substrate electrically coupling the die pad, the memory pad, and the ball.

Abstract: The present disclosure provides diacylglycerol kinase modulating compounds, and pharmaceutical compositions thereof, for treating cancer, including solid tumors, and viral infections, such as HIV or hepatitis B virus infection. The compounds can be used alone or in combination with other agents.

Abstract: The present disclosure generally relates to a computer circuit board having an integrated voltage regulator assembly that may include a heat sink and at least one voltage regulator module board. The heat sink may have a metal plate with at least one recess in which the voltage regulator module board may be attached. The voltage regulator module board is electrically coupled to a semiconductor package and the heat sink is thermally coupled to the semiconductor package. The computer circuit board is used in high-performance computing devices including computer workstations and computer servers.

Abstract: The present disclosure provides diacylglycerol kinase modulating compounds, and pharmaceutical compositions thereof, for treating cancer, including solid tumors, and viral infections, such as HIV or hepatitis B virus infection. The compounds can be used alone or in combination with other agents.

Abstract: Methods, apparatus, systems, and articles of manufacture for allocating a workload to an accelerator using machine learning are disclosed. An example apparatus includes a workload attribute determiner to identify a first attribute of a first workload and a second attribute of a second workload. An accelerator selection processor causes at least a portion of the first workload to be executed by at least two accelerators, accesses respective performance metrics corresponding to execution of the first workload by the at least two accelerators, and selects a first accelerator of the at least two accelerators based on the performance metrics. A neural network trainer trains a machine learning model based on an association between the first accelerator and the first attribute of the first workload. A neural network processor processes, using the machine learning model, the second attribute to select one of the at least two accelerators to execute the second workload.

Abstract: A multilayer printed circuit board including a first printed circuit board portion, including a first inserting connector, including a plurality of contacts for creating a first removable bus connection; a second printed circuit board portion, including a second inserting connector, including a plurality of contacts for creating a second removable bus connection; a third printed circuit board portion, connected between the first printed circuit board portion and to the second printed circuit board portion, wherein a rigidity of the third printed circuit board portion is less than a rigidity of each of the first printed circuit board portion and the second printed circuit board portion; wherein the multilayer printed circuit board is foldable along the third printed circuit board portion and, if so folded, the first printed circuit board portion is arranged on top of the second printed circuit board portion.

Abstract: Electronic device package on package (POP) technology is disclosed. A POP can comprise a first electronic device package including a heat source. The POP can also comprise a second electronic device package disposed on the first electronic device package. The second electronic device package can include a substrate having a heat transfer portion proximate the heat source that facilitates heat transfer from the heat source through a thickness of the substrate. The substrate can also have an electronic component portion at least partially about the heat transfer portion that facilitates electrical communication. In addition, the POP can comprise an electronic component operably coupled to the electronic component portion.

Abstract: The present disclosure provides a compound of Formula (I): or a pharmaceutically acceptable salt thereof as described herein. The present disclosure also provides pharmaceutical compositions comprising a compound of Formula (I), processes for preparing compounds of Formula (I), and therapeutic methods for treating inflammatory disease.

Abstract: A power supply unit (PSU) configured to provide electrical power to an electronic device. The PSU may include a PSU control circuit configured to, via a power meter, detect that electrical power conveyed to the electronic device is above a timer starting threshold. In a first charging mode with a first predetermined charging duration, the PSU control circuit may control the PSU to convey electrical power to the electronic device with a first power ceiling. Subsequently to the first predetermined charging duration elapsing, in a second charging mode with a second predetermined charging duration, the PSU control circuit may control the PSU to convey electrical power to the electronic device with a second power ceiling that is lower than the first power ceiling. Subsequently to the second predetermined charging duration elapsing, the PSU control circuit may control the PSU to return to the first charging mode.

Abstract: Circuit apparatus are disclosed. An example circuit apparatus includes a body including a plurality of first traces formed on the body, and a plurality of openings formed through the body and located between respective ones of the first traces. The openings provide airflow to a fan module of an electronic device through the body of the circuit apparatus.

Abstract: The present disclosure relates generally to certain 6-azabenzimidazole compounds, pharmaceutical compositions comprising said compounds, and methods of making and using said compounds and pharmaceutical compositions. The compounds and compositions disclosed herein may be used for the treatment or prevention of diseases, disorders, or infections modifiable by hematopoietic progenitor kinase 1 (HPK1) inhibitors, such as HBV, HIV, cancer, and/or a hyper-proliferative disease.

Abstract: According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.

Abstract: Embodiments herein disclose techniques for apparatuses and methods for making a slot antenna on a PCB with a cutout. A PCB may include a metal layer. The metal layer may include a cavity to be a first radiating element of an antenna, and a slot to be a second radiating element of the antenna. In addition, the cavity may extend to be the cutout of the PCB through other layers of the PCB. The first and second radiating elements may provide a determined transmission frequency for the antenna. The metal layer may further include a portion of a transmission line of the antenna, and the transmission line is in contact with the cavity and the slot. A package may be affixed to the PCB, where a portion of the package may be within the cutout of the PCB. Other embodiments may be described and/or claimed.