Abstract: The technique described herein includes a device to address the electrical performance (e.g. signal integrity) degradation ascribed to electromagnetic interference and/or crosstalk coupling occur at tightly coupled (e.g. about 110 ?m pitch or less) interconnects, including the first level (e.g. the interconnection between a die and a package substrate). In some embodiments, this invention provides a conductive layer with a plurality of cavities to isolate electromagnetic coupling and/or interference between adjacent interconnects for electronic device performance scaling. In some embodiments, at least one interconnect joint is coupled to the conductive layer, and at least one interconnect joint is isolated from the conductive layer by a dielectric lining at least one of the cavities, the conductive layer being associated to a ground reference voltage by the interconnect joint coupled to the conductive layer.

Abstract: The present disclosure generally relates to techniques and user interfaces for capturing media, displaying a preview of media, displaying a recording indicator, displaying a camera user interface, and/or displaying previously captured media.

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes one or more ribbon bond connections along with one or more wire bond connections. In one example, ribbon bond connections are shown, and are coupled to ground, and configured to provide a shielding effect to wire bond connections.

Abstract: A bra cup for a bra includes an inner layer of material configured to face a wearer's breast when the bra is worn and an outer layer of material configured to face away from the wearer when the bra is worn. An outer face of the inner layer of material is adjacent an inner face of the outer layer of material. A thin polymer web is disposed on the outer face of the inner layer of material. A bra including the bra cup and a method of manufacturing the bra cup are also disclosed.

Abstract: The present disclosure relates generally to compounds that bind to and act as degraders of an IKAROS Family Zinc Finger (IKZF) protein, such as IKZF2 (Helios) and/or IKZF4 (Eos). The disclosure further relates to the use of the compounds for the preparation of a medicament for the treatment of diseases and/or conditions through binding and degradation of an IKZF protein, such as IKZF2 and/or IKZF4, including cancer.

Abstract: An information handling system peripheral camera ensures privacy with a cover that minimizes distance of a camera module to a front opening of the camera housing. For instance, opposing cover members rotate about geared ends that engage to translate rotation between the members, where the members meet over a camera opening to block capture of visual images and move to opposing sides to expose the camera module. In an alternative embodiment, a rotating shutter arrangement selectively covers the camera for security and also covers a microphone to provide security against unauthorized audible access through the camera. Selective covering and exposing of a camera module, infrared camera, microphone and user presence detection sensor support adaptive security at a camera based upon end user context.

Abstract: The present disclosure relates to tissue supports for use with engineered tissues and organoids, such as cardiac organoid chambers. In an embodiment of the present disclosure, the tissue supports are provided with a fluid-impermeable resilient member that is resiliently deformable during testing by cultured tissues formed on the surface of the tissue support.

Abstract: The described technology provides an apparatus including a power supply unit (PSU) and a PSU control system stored in the memory and executable by the one or more processor units, the PSU control system encoding computer-executable instructions on the memory for executing on the one or more processor units a computer process, the computer process including receiving internal temperatures of the PSU over a duration of time, determining multiple exponential weighted moving average (EWMAs) of the internal temperature of the PSU for the duration of time, comparing the EWMA with a temperature threshold associated with the duration of time, and based at least in part on determining that EWMA exceeds the temperature threshold associated with the duration of time, limiting the output power of a charger using a charger current limit input to the charger.

Abstract: A method for forming a substrate with a multi-layered, flexible, and anti-scratch metal oxides protective coating being deposited onto the substrate is provided in the present invention, wherein the top most layer of the coating comprises Al2O3 or a mixture thereof such that the top most layer acts as an anti-scratching layer. The multi-layered, flexible and anti-scratch metal oxides protective coating also retains the flexibility of the underlying substrate.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to improve data training of a machine learning model using a field-programmable gate array (FPGA). An example system includes one or more computation modules, each of the one or more computation modules associated with a corresponding user, the one or more computation modules training first neural networks using data associated with the corresponding users, and FPGA to obtain a first set of parameters from each of the one or more computation modules, the first set of parameters associated with the first neural networks, configure a second neural network based on the first set of parameters, execute the second neural network to generate a second set of parameters, and transmit the second set of parameters to the first neural networks to update the first neural networks.

Abstract: According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.

Abstract: A printed circuit board (PCB) comprises a blind via and a discrete component vertically embedded within the blind via.

Abstract: A power supply includes a power factor correction (PFC) circuit, a PFC bypass circuit, and a decision circuit. The PFC circuit is configured to receive an input current from a power source and, when enabled, reduce current harmonics in the input current by shaping an input sinusoidal current waveform to match a phase and shape of a sinusoidal input voltage waveform. The PFC bypass circuit is configured to bypass the PFC circuit when the PFC circuit is disabled. The decision circuit includes a detection circuit configured to detect an output load of the power supply and is configured to output a PFC enable command based at least in part on the detected output load being greater than or equal to a threshold value and a determination that an input voltage of the power source is greater than or equal to a threshold value.

Abstract: Disclosed embodiments include die-edge level passive devices for integrated-circuit device packages that provide a low-loss path to active and passive devices, by minimizing inductive loops.

Abstract: Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a package substrate on a substrate, a die on the package substrate, and a conductive stiffener over the package substrate and the substrate. The conductive stiffener surrounds the package substrate, where the conductive stiffener has a top portion and a plurality of sidewalls, and where the top portion is directly disposed on the package substrate, and the sidewalls are vertically disposed on the substrate. The semiconductor package also includes the substrate that has a plurality of conductive pads, where the conductive pads are conductively coupled to a ground source. The conductive stiffener may conductively couple the package substrate to the conductive pads of the substrate. The top portion may have a cavity that surrounds the die, where the top portion is directly disposed on a plurality of outer edges of the package substrate.

Abstract: An information handling system peripheral camera ensures privacy with a cover that minimizes distance of a camera module to a front opening of the camera housing. For instance, opposing cover members rotate about geared ends that engage to translate rotation between the members, where the members meet over a camera opening to block capture of visual images and move to opposing sides to expose the camera module. In an alternative embodiment, a rotating shutter arrangement selectively covers the camera for security and also covers a microphone to provide security against unauthorized audible access through the camera. Selective covering and exposing of a camera module, infrared camera, microphone and user presence detection sensor support adaptive security at a camera based upon end user context.

Abstract: An absorbent garment has a pair of breast cups, each having a layer of moisture-wicking one-way transport material, an inner layer of absorbent terry cloth, an inner layer of foam, and an outer layer of water-resistant material. An inner face of the absorbent terry cloth is fully laminated to an outer face of the one-way transport material. An outer face of the absorbent terry cloth is fully laminated to an inner face of the foam. An outer edge of the one-way transport material is coupled to an outer edge of the foam. An outer face of the foam is fully laminated to an inner face of the water-resistant material. The absorbent terry cloth has an outer edge that does not extend to the outer edges of the one-way transport material or the foam such that the absorbent terry cloth is fully enclosed between the one-way transport material and the foam.

Abstract: Embodiments disclose electronic packages with a die assembly and methods of forming such electronic packages. In an embodiment, a die assembly comprises a first die and a second die laterally adjacent to the first die. In an embodiment, the first die and the second die each comprise a first semiconductor layer, an insulator layer over the first semiconductor layer, and a second semiconductor layer over the insulator layer. In an embodiment, a cavity is disposed through the second semiconductor layer. In an embodiment, the die assembly further comprises a bridge substrate that electrically couples the first die to the second die, where the bridge is positioned in the cavity of the first die and the cavity of the second die.

Abstract: A touch sensing method and a serial manipulator using the same are disclosed. A serial manipulator using the method may detect and localize external torques by obtaining a torque value of each joint of a serial manipulator through a torque sensor at the joint; obtaining a preset joint angle of each joint from the serial manipulator; calculating a Jacobian matrices of the serial manipulator based on the joint angle of the joints; estimating joint torques of the serial manipulator based on the torque value of each joint and the Jacobian matrices; calculating an error between the torque value of each joint and the estimated joint torque corresponding to the joint; and determining a link of the serial manipulator that is connected to the joint with the minimum calculated error as having been touched.