Abstract: A sense amplifier utilizes a phase transition material (PTM) in conjunction with CMOS circuits to provide a precise sensing threshold. The sense amplifier can be used in memory applications to sense states of stored bits with high accuracy and robustness. In one sense amplifier, a first diode-connected transistor has gate and drain nodes coupled to an input node of the sense amplifier, a second transistor has a gate node coupled to the gate node of the first diode-connected transistor, and the PTM is coupled to the source node of the second transistor. In another sense amplifier, a first transistor has a gate node coupled to an input node of the sense amplifier, a PTM is coupled to the source node of the first transistor, and an output stage including an inverter is coupled between a drain node of the first transistor and an output node of the sense amplifier.

Abstract: A sense amplifier utilizes a phase transition material (PTM) in conjunction with CMOS circuits to provide a precise sensing threshold. The sense amplifier can be used in memory applications to sense states of stored bits with high accuracy and robustness. In one sense amplifier, a first diode-connected transistor has gate and drain nodes coupled to an input node of the sense amplifier, a second transistor has a gate node coupled to the gate node of the first diode-connected transistor, and the PTM is coupled to the source node of the second transistor. In another sense amplifier, a first transistor has a gate node coupled to an input node of the sense amplifier, a PTM is coupled to the source node of the first transistor, and an output stage including an inverter is coupled between a drain node of the first transistor and an output node of the sense amplifier.

Abstract: A CMOS device includes a PMOS transistor with a first quantum well structure and an NMOS device with a second quantum well structure. The PMOS and NMOS transistors are formed on a substrate.

Abstract: Embodiments include nonvolatile a memory (NVM) device that can be configured for logic switching and/or digital computing. For example, embodiments of the NVM device can be configured as any one or combination of a memory cell, a D flip flop (DFF), a Backup and Restore circuit (B&R circuit), and/or a latch for a DFF. Any of the NVM devices can have a Fe field effect transistors (FeFET) configured to exploit the IDS?VG hysteresis of the steep switch at low voltage for logic memory synergy. The FeFET-based devices can be configured to include a wide hysteresis, a steep hysteresis edge, and high ratio between the two IDS states at VG=0.

Abstract: A transistor having a narrow bandgap semiconductor source/drain region is described. The transistor includes a gate electrode formed on a gate dielectric layer formed on a silicon layer. A pair of source/drain regions are formed on opposite sides of the gate electrode wherein said pair of source/drain regions comprise a narrow bandgap semiconductor film formed in the silicon layer on opposite sides of the gate electrode.

Abstract: The present application provides a method and system for outlier detection, anomalous behavior detection, missing data imputation and prediction of consumption in energy data for one or more energy sensors by using a unified model. The application discloses a data collection module for collect a time series data to be used as training data, a model training module for training the unified model using the collected time series data to enable computation of a plurality of parameters, and a model implementation module for implementing, by the trained unified model, the plurality of parameters on a new data of energy consumption wherein the plurality of parameters are used perform at least one from a group of outlier detection, anomaly detection, missing data imputation and prediction of consumption in energy data.

Abstract: In one embodiment, the present invention includes a method for forming a logic device, including forming an n-type semiconductor device over a silicon (Si) substrate that includes an indium gallium arsenide (InGaAs)-based stack including a first buffer layer, a second buffer layer formed over the first buffer layer, a first device layer formed over the second buffer layer. Further, the method may include forming a p-type semiconductor device over the Si substrate from the InGaAs-based stack and forming an isolation between the n-type semiconductor device and the p-type semiconductor device. Other embodiments are described and claimed.

Abstract: A method of fabricating a MOS transistor having a thinned channel region is described. The channel region is etched following removal of a dummy gate. The source and drain regions have relatively low resistance with the process.

Abstract: A sense amplifier utilizes a phase transition material (PTM) in conjunction with CMOS circuits to provide a precise sensing threshold. The sense amplifier can be used in memory applications to sense states of stored bits with high accuracy and robustness. In one sense amplifier, a first diode-connected transistor has gate and drain nodes coupled to an input node of the sense amplifier, a second transistor has a gate node coupled to the gate node of the first diode-connected transistor, and the PTM is coupled to the source node of the second transistor. In another sense amplifier, a first transistor has a gate node coupled to an input node of the sense amplifier, a PTM is coupled to the source node of the first transistor, and an output stage including an inverter is coupled between a drain node of the first transistor and an output node of the sense amplifier.

Abstract: A transistor having a narrow bandgap semiconductor source/drain region is described. The transistor includes a gate electrode formed on a gate dielectric layer formed on a silicon layer. A pair of source/drain regions are formed on opposite sides of the gate electrode wherein said pair of source/drain regions comprise a narrow bandgap semiconductor film formed in the silicon layer on opposite sides of the gate electrode.

Abstract: A method of fabricating a MOS transistor having a thinned channel region is described. The channel region is etched following removal of a dummy gate. The source and drain regions have relatively low resistance with the process.

Abstract: A CMOS device includes a PMOS transistor with a first quantum well structure and an NMOS device with a second quantum well structure. The PMOS and NMOS transistors are formed on a substrate.

Abstract: Disclosed are low power electronic devices configured to exploit the sub-threshold swing, unidirectional tunneling, and low-voltage operation of steep slope-tunnel tunnel field-effect transistors (TFET) to improve power-conversion efficiency and power-efficiency of electrical systems incorporating the TFET as an electrical component to perform energy harvesting, signal processing, and related operations. The devices include a HTFET-based rectifier having various topologies, a HTFET-based DC-DC charge pump converter, a HTFET-based amplifier having an amplifier circuit including a telescopic operational transconductance amplifier, and a HTFET-based SAR A/D converter having a HTFET-based transmission gate DFF. Any one of the devices may be used to generate a RF-powered system with improved power conversion efficiencies of power harvesters and power efficiencies of processing components within the system.

Abstract: A method of patterning a semiconductor film is described. According to an embodiment of the present invention, a hard mask material is formed on a silicon film having a global crystal orientation wherein the semiconductor film has a first crystal plane and second crystal plane, wherein the first crystal plane is denser than the second crystal plane and wherein the hard mask is formed on the second crystal plane. Next, the hard mask and semiconductor film are patterned into a hard mask covered semiconductor structure. The hard mask covered semiconductor structured is then exposed to a wet etch process which has sufficient chemical strength to etch the second crystal plane but insufficient chemical strength to etch the first crystal plane.

Abstract: A transistor having a narrow bandgap semiconductor source/drain region is described. The transistor includes a gate electrode formed on a gate dielectric layer formed on a silicon layer. A pair of source/drain regions are formed on opposite sides of the gate electrode wherein said pair of source/drain regions comprise a narrow bandgap semiconductor film formed in the silicon layer on opposite sides of the gate electrode.

Abstract: This disclosure relates generally to data analysis systems, and more particularly to systems and methods for analyzing sensor data using incremental autoregression techniques. In one embodiment, a Systems and methods for generating a vector of autoregression coefficients is provided. The system processes a time series data to obtain blocks of observation values, reads the observation values, updates pre-stored convolution values with the observation values, updates a partial sum by adding each observation value to the partial sum, increments a count each time an observation value is read, repeats the steps of updates and increments until a last observation value from a last block is read to obtain an updated set of convolution values, partial sum, and count.

Abstract: A CMOS device includes a PMOS transistor with a first quantum well structure and an NMOS device with a second quantum well structure. The PMOS and NMOS transistors are formed on a substrate.

Abstract: A transistor having a narrow bandgap semiconductor source/drain region is described. The transistor includes a gate electrode formed on a gate dielectric layer formed on a silicon layer. A pair of source/drain regions are formed on opposite sides of the gate electrode wherein said pair of source/drain regions comprise a narrow bandgap semiconductor film formed in the silicon layer on opposite sides of the gate electrode.

Abstract: A transistor having a narrow bandgap semiconductor source/drain region is described. The transistor includes a gate electrode formed on a gate dielectric layer formed on a silicon layer. A pair of source/drain regions are formed on opposite sides of the gate electrode wherein said pair of source/drain regions comprise a narrow bandgap semiconductor film formed in the silicon layer on opposite sides of the gate electrode.

Abstract: A CMOS device includes a PMOS transistor with a first quantum well structure and an NMOS device with a second quantum well structure. The PMOS and NMOS transistors are formed on a substrate.